JPH03147507A - Perpendicular magnetic thin-film head and production thereof - Google Patents

Abstract

PURPOSE:To eliminate the blister, crack and peeling, etc., by a difference in thermal expansion during the production process of an inorg. insulating layer for forming a flat region to be formed with a main magnetic pole and to improve the yield of production by directly disposing the main magnetic pole on the interlayer insulating layer on an upper side and providing the inorg. insulating layer between the front end part of the magnetic pole and a magnetic substrate. CONSTITUTION:The main magnetic pole 17 is disposed directly on the interlayer insulating layer 12 on the upper side and the inorg. insulating layer 15 is provided between the front end part 17a of the magnetic pole and the magnetic substrate 11. Namely, the main magnetic pole 17 is directly formed on the interlayer insulating layer 12 without interposing the thin inorg. insulating layer 15 between the interlayer insulating layer 12 consisting of a thermosetting insulating resin, etc., coating a thin-film coil 13 and the main magnetic pole 17. The generation of the blister, crack or peeling, etc., of the inorg. insulating layer on the main magnetic pole 27 forming surface of the thin-film coil 13 sandwiched by the interlayer insulating layer 12 during the production process like heretofore is obviated and the main magnetic pole is accurately formed on the surface. The yield of production is thus improved.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a perpendicular magnetic thin film head used in a perpendicular magnetization recording type magnetic disk device, a magnetic tape device, etc., and a method for manufacturing the same, an inorganic insulating layer forming a flat main pole forming region. The purpose of this technology is to improve manufacturing yield by eliminating swelling, cranking, and peeling caused by differences in thermal expansion coefficients during the manufacturing process. In a head configuration including a magnetic pole connecting layer connected to the magnetic substrate in the center, and a main magnetic pole having a rear end connected to the magnetic pole connecting layer and having a tip exposed to the medium facing surface, the main magnetic pole is A structure in which an inorganic insulating layer is disposed directly on the upper interlayer insulating layer and between the magnetic pole tip and the magnetic substrate, and a method for manufacturing the same, or an inorganic insulating layer of 10 to 50 μm between the main pole and the upper interlayer insulating layer. A structure in which a thick inorganic insulating layer is provided and a method for manufacturing the same, or the magnetic pole connecting layer extends on an interlayer insulating layer, the main magnetic pole is disposed on the magnetic pole connecting layer, and there is a gap between the magnetic pole tip and the magnetic substrate. It is constructed by a structure in which an inorganic insulating layer is provided on the top and a manufacturing method thereof.

[Industrial application field]

The present invention relates to a perpendicular magnetic thin film head used in a perpendicular magnetic recording type magnetic disk device, a magnetic tape device, etc., and a method for manufacturing the same.

In recent years, high-performance magnetic heads have been required to meet the increasing capacity of magnetic disk drives, which are widely used as external storage devices in combinator systems. A magnetization recording type thin film magnetic head has been proposed and is attracting attention.

Such a perpendicular magnetic thin film head requires a manufacturing method that has high recording and reproducing efficiency and is stable.

[Conventional technology]

As shown in FIG. 4(a), the conventional perpendicular magnetic thin film head described above has a magnetic substrate 1 made of ferrite such as Ni-Zn or Mn-Zn, and a first interlayer made of thermosetting insulating resin or the like. After sequentially laminating a spiral thin film coil 3 and a second interlayer insulating layer 4 via an insulating layer 2, the center portion of the thin film coil 3 is covered with the first and second interlayer insulating layers 2.4. forming a magnetic pole connection layer 5 so as to connect with the magnetic substrate 1;
A thick inorganic insulating layer 6 made of Al or Sing is deposited on the upper surface.

Next, the inorganic insulating layer 6 including the magnetic pole connecting layer 5 is flattened to the position indicated by the dashed line AA' in the figure so that a film thickness of about 2 to 5 μm remains on the third interlayer insulating layer 4. Perform polishing and finishing processing.

After that, as shown in FIG. 4(b), Ni-
The main magnetic pole 7 made of Fe is formed so that its leading end 7a is exposed to a medium facing surface 9, which will be described later, and its rear end 7b is connected to the magnetic pole connecting layer 5.

Here, an inorganic insulation N6 is also formed between the main pole tip 7a and the magnetic substrate 1. And after that, these main magnetic poles 7
An insulating protective layer 8 made of AlzOs is deposited on the entire surface of the inorganic insulating layer 6, and the main pole tip 7a is
The unnecessary length portion is cut off along with the insulating protective layer 8, the inorganic insulating layer 6, and the magnetic substrate 1 immediately below at the position indicated by the dashed line B in the figure, and the cut surface is polished into a head slider shape with the medium facing surface 9. Finishing is performed to complete the structure as shown in FIG. 4(C).

[Problem to be solved by the invention]

By the way, in the conventional single-pole type perpendicular magnetic thin film head as described above, the second interlayer insulating layer 4 covering the thin film coil 3 is
In order to improve the pattern accuracy of the main magnetic pole 7 that is formed by ensuring a flat main magnetic pole formation area between the main magnetic pole 7 and the main magnetic pole 7,
2 to 5 μm consisting of A f zoz or 5iOz, etc.
A flat inorganic insulating layer 6 with a certain thickness is interposed, and since this inorganic insulating layer 6 has an appropriate hardness, it is easy to flatten it by polishing. Since there is a large difference in coefficient of thermal expansion from the second interlayer insulating layer 4 made of an organic film, for example, the main magnetic pole 7 made of Ni-Fe is deposited and formed on the flat inorganic insulating layer 6 by sputtering or the like. Large thermal stress is applied due to heating during the process.

Therefore, the thinner the inorganic insulating layer 6 is, the more the thermal stress due to the difference in thermal expansion coefficient becomes greater than the film strength of the inorganic insulating layer 6, causing blistering and swelling in the inorganic insulating layer 6, as shown in FIG. There was a problem in that cranking or peeling occurred, which hindered the formation of the main magnetic pole 7.

In view of the above-mentioned conventional problems, the present invention eliminates swelling, cracking, peeling, etc. due to the difference in thermal expansion coefficient during the manufacturing process of the inorganic insulating layer that forms the flat main pole forming region,
It is an object of the present invention to provide a novel single-pole type perpendicular magnetic thin film head and a method for manufacturing the same, which improves manufacturing yield.

[Means to solve the problem]

In order to achieve the above-mentioned object, the present invention has a structure in which:
A thin film coil sandwiched between interlayer insulating layers, a magnetic pole connecting layer connected to the magnetic substrate at the center of the thin film coil, a rear end connected to the magnetic pole connecting layer, and a tip exposed to the medium facing surface. In a head configuration including a main magnetic pole, the main magnetic pole is directly disposed on an upper interlayer insulating layer, and an inorganic insulating layer is provided between the tip of the magnetic pole and a magnetic substrate, and a method for manufacturing the same, or 10 to 5 between the magnetic pole and the upper interlayer insulating layer
A structure in which an inorganic insulating layer with a film thickness of 0 μm is provided and a method for manufacturing the same, or the above-mentioned magnetic pole connecting layer extends on an interlayer insulating layer, the main magnetic pole is arranged on the magnetic pole connecting layer, and the magnetic pole tip and magnetic It is constructed by a structure in which an inorganic insulating layer is provided between substrates and a manufacturing method thereof.

[For production]

In the present invention, (1) the main magnetic pole is formed directly on the interlayer insulating layer without interposing a thin inorganic insulating layer between the interlayer insulating layer made of thermosetting insulating resin or the like covering the thin film coil and the main magnetic pole; This eliminates the occurrence of blistering, cracking, peeling, etc. in the conventional thin inorganic insulating layer due to heating during the manufacturing process. ■Also, by having a structure in which a thick inorganic insulating layer of 10 to 50 μm is interposed between the interlayer insulating layer made of thermosetting insulating resin etc. that covers the thin film coil and the main pole, the film strength of the inorganic insulating layer can be increased. The thermal stress caused by heating during the process will be exceeded, and the inorganic insulating layer will not swell, crack, peel, etc. ■Furthermore, by creating a structure in which a magnetic pole connecting layer is extended from the center of the thin film coil between the interlayer insulation layer made of thermosetting insulating resin etc. that coats the thin film coil and the main pole, it is possible to avoid the conventional thin inorganic insulation layer. There is no occurrence of bulging, cranking, peeling, etc., and the magnetic resistance of the main pole joined to the extended portion of the magnetic pole connecting layer is reduced, increasing recording and reproducing efficiency.

〔Example〕

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIGS. 1A to 1D+ are cross-sectional views of essential parts for explaining a first embodiment of a single-pole type perpendicular magnetic thin film head and a method of manufacturing the same according to the present invention.

First, as shown in FIG. 1(a), a thin film coil 13 sandwiched between interlayer insulating layers 12 made of thermosetting insulating resin or the like is formed on a magnetic substrate 11 made of Ni-Zn ferrite. The central part of the magnetic substrate 11 is opened so that the magnetic substrate 11 is exposed, and a magnetic pole connecting layer 14 made of Ni--Pa is formed by mask plating in the opening to be connected to the magnetic substrate 11. The layer 14, the interlayer insulating layer 12 and the exposed surface of the magnetic substrate 11 are coated with Az
, o, is deposited by a sputtering method or the like.

Next, connect the inorganic insulating layer 15 and the magnetic pole! 14 is polished flat to the position indicated by the dashed line A-A" in the figure so that the interlayer insulating layer 12 is exposed, and
) A flat surface 16 is formed as shown in FIG.

Thereafter, as shown in FIG. 1(C), a main magnetic pole 17 made of Ni-Fe, Co-Zr, Fe-3t, etc. is placed on the flat surface 16, and its tip 17a forms a medium facing surface to be described later. 19, and the rear end portion 17b is formed so as to be connected to the magnetic pole connecting layer 14. At this time, the main pole tips 17a, l! : An inorganic insulating layer 15 is formed between the magnetic substrate 11 and the magnetic substrate 11 . After that, AI! is applied to the entire surface of the main pole 17 and the inorganic insulating layer 15! z(h
An insulating protective layer 18 consisting of the following is deposited.

Furthermore, an insulating protective layer 18 and an inorganic insulating layer 15 are formed on the unnecessary length portion of the main pole tip 17a at a position indicated by a dashed line B in the figure.
The head slider is then cut off together with the magnetic substrate 11 immediately below, and the cut surface is polished into a head slider shape with the medium facing surface 19, thereby completing the structure as shown in FIG. 1(d).

In the thin-film head manufactured in this manner, the main pole 17 is provided directly on the flat surface 16 on the interlayer insulating layer 12 made of thermosetting insulating resin or the like that coats the thin-film coil 13, so that The main magnetic pole 17 is formed with high precision without the occurrence of blistering, cranking, peeling, etc. of the inorganic insulating layer as in the prior art, and the manufacturing yield is improved. Note that since the distance between the main pole and the thin film coil is shortened, recording and reproducing efficiency is also improved.

Further, FIGS. 2A to 2D are cross-sectional views of main parts for explaining a second embodiment of a single-pole type perpendicular magnetic thin film head and a manufacturing method thereof according to the present invention, and FIGS. Parts equivalent to those in (d) are given the same reference numerals.

In this embodiment, as shown in FIG. 2(al), a thin film coil 13 sandwiched between interlayer insulating layers 12 made of thermosetting insulating resin or the like is formed on a magnetic substrate ll made of Ni-Zn ferrite. The center of the coil 13 is connected to the magnetic substrate 11.
is opened so that the magnetic substrate 11 is exposed, and the magnetic substrate 11 is placed in the opening.
A thick magnetic pole connecting layer 21 made of Ni--Fe is formed by mask plating in a state connected to the magnetic pole connecting layer 21, the interlayer insulating layer 12, and the exposed surface of the magnetic substrate 11. The inorganic insulating layer 22 is 10~
The film is deposited to a thickness of 50 μm or more by sputtering or the like.

Next, the inorganic insulating layer 22 is placed on the interlayer insulating layer 12.
A flat surface is obtained by polishing and finishing the magnetic pole connecting layer 21, including the magnetic pole connecting layer 21, to the position indicated by the dashed line A-A' in the figure so that a film thickness of 50D11 remains, as shown in FIG. 2 (b). 2
form 3.

Thereafter, as shown in FIG. 2(C), a main magnetic pole 24 made of Ni-Fe5Co-Zr or Fe-5i is placed on the flat surface 23, and its tip 24a is exposed to a medium facing surface 26, which will be described later. Also, the rear end portion 24b is formed so as to be connected to the magnetic pole connection layer 21. At this time, an inorganic insulating layer 22 is provided between the main pole tip 24a and the magnetic substrate 11.
is formed. After that, A7! is applied to the entire surface of the main magnet i24 and the inorganic insulating layer 22. An insulating protective layer 25 made of Goss is deposited.

Further, an insulating protective layer 25 and an inorganic insulating layer 22 are formed at the unnecessary length portion of the main pole tip 24a at a position indicated by a dashed line B in the figure.
Then, the head slider is cut off together with the magnetic substrate 11 immediately below, and polished and finished into a head slider shape with the cut surface serving as the medium facing surface 26 to complete the structure as shown in FIG. 2(d).

In a thin film head manufactured with such a configuration, a thick film having a film strength greater than the thermal stress caused by heating during the manufacturing process is formed on the interlayer insulating layer 12 made of a thermosetting insulating resin or the like that covers the thin film coil 13. Since the inorganic insulating layer N22 is provided, the main magnetic pole 24 can be formed with high accuracy on the surface of the inorganic insulating layer without the occurrence of blistering, cracking, or peeling during the conventional manufacturing process. ,
Manufacturing yield is improved.

Furthermore, FIGS. 3(a) to 3(d) are sectional views of main parts for explaining a third embodiment of a single-pole type perpendicular magnetic thin film head and a manufacturing method thereof according to the present invention, and FIG. Portions equivalent to those in al to (d) are given the same reference numerals.

In this embodiment, as shown in FIG. 3(a), a thin film coil 13 sandwiched between interlayer insulating layers 12 made of thermosetting insulating resin or the like is formed on a magnetic substrate 11 made of Ni-Zn ferrite. The center of the thin film coil 13 is connected to the magnetic substrate 11.
A magnetic pole connection N31 made of Ni--Fe is connected to the magnetic substrate 11 using a mask so that the magnetic pole connection N31 made of Ni--Fe is opened so as to be exposed and extends from above the opening onto the interlayer insulation l1112 sandwiching the thin film coil 13. Formed thickly using plating method. Note that the tip of the magnetic pole connecting layer 31 extending on the interlayer insulating layer 12 is 5 to 20 mm from the medium facing surface 36, which will be described later.
It is desirable that the positions be spaced apart by μm.

Further, an inorganic insulating layer 32 made of Al 203 is formed on the magnetic pole connecting layer 31, the interlayer insulating layer 12, and the exposed surface of the magnetic substrate 11 to a thickness equal to or thicker than that of the magnetic pole connecting layer 31 by sputtering, etc. Adhesion is formed by

Next, the magnetic pole connecting layer 31 is flattened and polished to the position indicated by the dashed line AA' in the figure, including the inorganic insulating JiJ32, so that a predetermined film thickness remains on the interlayer insulating layer 12. Then, a flat surface 33 is formed as shown in FIG. 3(b).

Thereafter, as shown in FIG. 3(C), a main magnetic pole 34 having high saturation magnetization and high magnetic permeability made of Nt-Fe, Co-Zr, or Fe-3t, etc. is placed on the flat surface 33 at its tip. The portion 34a is formed to be exposed to a medium facing surface 36, which will be described later, and the rear end portion 34b is formed to be connected to the magnetic pole connection N31. At this time, the main pole tip 34a
An inorganic insulating layer 32 is formed between the magnetic substrate 11 and the magnetic substrate 11 . Thereafter, an insulating protective layer 35 made of Af and O is deposited on the entire surface of the main pole 34 and the inorganic insulating layer 32.

Furthermore, an insulating protective layer 35 and an inorganic insulating layer 32 are formed on the unnecessary length portion of the main pole tip 34a at a position indicated by a dashed line B in the figure.
Then, the head slider is cut off together with the magnetic substrate 11 immediately below, and polished and finished into a head slider shape with the cut surface serving as the medium facing surface 36 to complete the structure as shown in FIG. 3(d).

In a thin film head manufactured with such a configuration, the interlayer insulating layer 1
Since the main magnetic pole 34 is provided directly on the flat surface 33 of the magnetic pole connecting layer 31 and the inorganic insulating layer 32 that extend on the magnetic pole connecting layer 31 and the inorganic insulating layer 32, there is no possibility that the inorganic insulating layer will bulge, crack, or form during the conventional manufacturing process. There is no occurrence of peeling, etc., and the main magnetic pole 34 can be formed on the surface with high precision, improving manufacturing yield. Furthermore, since the main magnetic pole 34 is joined to the extended portion of the magnetic pole connection layer 31, the magnetic resistance is reduced, and the main magnetic pole 34 is effectively
4 and the thin film coil 13, etc., the recording and reproducing efficiency is increased.

〔Effect of the invention〕

As is clear from the above description, according to the perpendicular magnetic thin film head and the manufacturing method thereof according to the present invention, inorganic insulation is formed on the main pole forming surface of the thin film coil sandwiched between interlayer insulating layers during the conventional manufacturing process. There is no occurrence of layer bulges, cracks, or peeling, and the main pole can be formed on the surface with high precision, which has the advantage of improving manufacturing yield. Furthermore, in the first and third embodiments, the recording and reproducing efficiency is increased, and a high-performance perpendicular magnetic thin film head can be obtained.
It has a practical effect.

[Brief explanation of the drawing]

FIGS. 1(a) to (dl) are sectional views of essential parts for explaining a first embodiment of a single-pole type perpendicular magnetic thin film head and its manufacturing method according to the present invention; FIGS. 2(a) to (dl) ) is a sectional view of a main part for explaining a second embodiment of a single magnetic pole type perpendicular magnetic thin film head and a manufacturing method thereof according to the present invention, and FIGS. 3(a) to (d) are single magnetic pole type perpendicular magnetic thin film heads according to the present invention. Figures 4(a) to 4(C) are cross-sectional views of main parts for explaining a third embodiment of a conventional single-pole type perpendicular magnetic thin-film head and its manufacturing method. Fig. 5 is a cross-sectional view of main parts for explaining the manufacturing problems of a conventional single-pole type perpendicular magnetic head. Figs. 1(a) to (d) 3(a) to (d), 11 is a magnetic substrate, 12 is an interlayer insulating layer, 13 is a thin film coil, 14.21.31 is a magnetic pole connection layer, 15°22.
32 is an inorganic insulating layer, 16, 23.33 is a flat surface, 17.
24.34 is the main magnetic pole, 1B, 25.35 is the insulation protective layer,
19, 26, and 36 indicate the medium facing surfaces, respectively. (d) Figure

Claims (6)

[Claims] (1) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a magnetic pole connecting layer connected to the magnetic substrate (11) at the center of the thin film coil (13). (
14), and a main magnetic pole (17) whose rear end is connected to the magnetic pole connection layer (14) and whose tip is exposed to the medium facing surface (19).
), the main magnetic pole (17) is placed directly on the upper interlayer insulating layer (12), and an inorganic insulating layer (15) is provided between the magnetic pole tip and the magnetic substrate (11). A perpendicular magnetic thin film head characterized by the following. (2) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a magnetic pole connecting layer (13) connected to the substrate (11) at the center of the thin film coil (13). 14)
The interlayer insulating layer (12) and the magnetic pole connecting layer (14) are formed.
), and the inorganic insulating layer (15) and the magnetic pole connection layer (14) are planarized and polished so that the interlayer insulating layer (12) is exposed. the flattened inorganic insulating layer (15) and the interlayer insulating layer (12);
The main pole (17) is placed on top, and its tip is placed on the medium facing surface (19).
) and forming the rear end so as to be connected to a magnetic pole connecting layer (14). (3) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a magnetic pole connecting layer connected to the magnetic substrate (11) at the center of the thin film coil (13). (
14), and a main magnetic pole (17) whose rear end is connected to the magnetic pole connection layer (14) and whose tip is exposed to the medium facing surface (19).
), characterized in that an inorganic insulating layer (22) with a thickness of 10 to 50 μm is provided between the main pole (24) and the upper interlayer insulating layer (12). Magnetic thin film head. (4) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a magnetic pole connecting layer (13) connected to the substrate (11) at the center of the thin film coil (13). 21)
, and the interlayer insulating layer (12) and the magnetic pole connecting layer (21
) A thick inorganic insulating layer (22) is formed on the magnetic substrate (11) containing the magnetic pole connecting layer (21), and the inorganic insulating layer (22) is planarized and polished to leave a film thickness of 10 to 50 μm. and a step of forming a main magnetic pole (24) on the flattened inorganic insulating layer (22) and the magnetic pole connecting layer (21) so that its tip is exposed to the medium facing surface (26). A method of manufacturing a perpendicular magnetic thin film head, comprising: (5) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a magnetic pole connecting layer connected to the magnetic substrate (11) at the center of the thin film coil (13). (
14), and a main magnetic pole (17) whose rear end is connected to the magnetic pole connection layer (14) and whose tip is exposed to the medium facing surface (19).
), the magnetic pole connecting layer (31) extends on the interlayer insulating layer (12), the main magnetic pole (34) is arranged on the magnetic pole connecting layer (31), and the magnetic pole tip part An inorganic insulating layer (
32) A perpendicular magnetic thin film head characterized in that it is provided with: (6) A thin film coil (13) sandwiched between interlayer insulating layers (12) on a magnetic substrate (11), and a thin film coil (13) sandwiched between the interlayer insulating layers (12) and the center of the thin film coil (13) on the magnetic substrate (11). ), forming an inorganic insulating layer (32) on the substrate (11) including the magnetic pole connecting layer (31); a step of planarizing and polishing the magnetic pole connecting layer (31) and the inorganic insulating layer (32) together with the inorganic insulating layer (32) so as to leave a predetermined film thickness;
The main pole (34) is placed on top, and its tip is placed on the medium facing surface (36).
) A method of manufacturing a perpendicular magnetic thin film head, comprising the step of forming the head so as to expose the head.