JPH0316686B2 - - Google Patents
Info
- Publication number
- JPH0316686B2 JPH0316686B2 JP13353984A JP13353984A JPH0316686B2 JP H0316686 B2 JPH0316686 B2 JP H0316686B2 JP 13353984 A JP13353984 A JP 13353984A JP 13353984 A JP13353984 A JP 13353984A JP H0316686 B2 JPH0316686 B2 JP H0316686B2
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- insulating layer
- layer
- pattern
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010409 thin film Substances 0.000 claims description 55
- 239000010408 film Substances 0.000 claims description 47
- 238000000034 method Methods 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 5
- 238000000151 deposition Methods 0.000 claims description 3
- 238000000059 patterning Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000011347 resin Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 19
- 239000010949 copper Substances 0.000 description 11
- 238000004544 sputter deposition Methods 0.000 description 6
- 229910004298 SiO 2 Inorganic materials 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 229910000889 permalloy Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910003271 Ni-Fe Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Landscapes
- Magnetic Heads (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は磁気デイスク装置等に用いられる薄膜
磁気ヘツドの製造方法に係り、特に下部磁性層等
の段差により平坦化が困難な絶縁層上に、分厚い
薄膜コイルを均一な膜厚で形成することを可能に
した方法に関するものである。[Detailed Description of the Invention] [Industrial Field of Application] The present invention relates to a method for manufacturing a thin film magnetic head used in magnetic disk devices, etc., and particularly for manufacturing a thin film magnetic head on an insulating layer that is difficult to flatten due to steps such as a lower magnetic layer. , relates to a method that makes it possible to form a thick thin film coil with a uniform film thickness.
近来、磁気デイスク装置等に用いられている磁
気ヘツドは、磁気デイスク記録媒体に対する高記
録密度化及び高速転送化が図られ、その形状も
益々小型化されると共に、高精度化され、記録に
寄与する磁極先端部でのヘツド磁界分布が急峻
で、高密度な記録を可能とする小型な種々のタイ
プの薄膜磁気ヘツドが既に提案され、実用化が進
められている。 In recent years, magnetic heads used in magnetic disk devices, etc. have been designed to achieve higher recording densities and faster transfer speeds for magnetic disk recording media, and their shapes have also become smaller and more precise, contributing to recording. Various types of compact thin-film magnetic heads, which have a steep magnetic field distribution at the tip of the magnetic pole and enable high-density recording, have already been proposed and are being put into practical use.
上記した薄膜磁気ヘツドは、一般に第７図の平
面図及び第７図に示すＡ−A′切断線に沿つた第
８図の要部断面図に示すように、例えばSiO2か
らなる絶縁体層２が施されたセラミツク等からな
る非磁性基板１上に、Ni−Feパーマロイからな
る下部磁極層４が磁極下地層３を介して設けら
れ、該下部磁極層４上を含む絶縁体層２上の所定
領域にSiO2からなるギヤツプ層５を介してレジ
スト膜等からなる樹脂絶縁層６が配設されてい
る。 The above-mentioned thin film magnetic head generally has an insulating layer made of, for example, SiO 2 , as shown in the plan view of FIG. 7 and the cross-sectional view of the main part of FIG. A lower magnetic pole layer 4 made of Ni-Fe permalloy is provided on a non-magnetic substrate 1 made of ceramic or the like coated with 2, with a magnetic pole base layer 3 interposed therebetween, and a layer 2 is formed on the insulating layer 2 including the upper part of the lower magnetic pole layer 4. A resin insulating layer 6 made of a resist film or the like is provided in a predetermined region of the photoresist with a gap layer 5 made of SiO 2 interposed therebetween.
又、該樹脂絶縁層６の上面には銅（Cu）等か
らなる薄膜コイル７が設けられ、この薄膜コイル
７を含む前記樹脂絶縁層６上に再びレジスト膜等
からなる樹脂絶縁層８が設けられており、その上
面に更に上部磁極層９が配設されて前記下部磁極
層４と上部磁極層９からなる磁極が前記薄膜コイ
ル７及びギヤツプ層５をＵ字形に挟む形状に構成
されている。 Further, a thin film coil 7 made of copper (Cu) or the like is provided on the upper surface of the resin insulating layer 6, and a resin insulating layer 8 made of a resist film or the like is again provided on the resin insulating layer 6 including this thin film coil 7. An upper magnetic pole layer 9 is further disposed on the upper surface thereof, and the magnetic pole composed of the lower magnetic pole layer 4 and the upper magnetic pole layer 9 is configured to sandwich the thin film coil 7 and the gap layer 5 in a U-shape. .
このような薄膜磁気ヘツドにおいては、薄膜コ
イル７を下部磁極層４上を含む樹脂絶縁層６上に
均一な膜厚で、かつ精度の良いパターンに形成す
るためには、該絶縁層６の平坦化が極めて重要と
なる。しかし実際には、下部磁極層４の厚さによ
る段差によつて樹脂絶縁層６の平坦化が極めて重
要となる。しかし実際には、下部磁極層４の厚さ
による段差によつて樹脂絶縁層６の平坦化は容易
で無く、分厚い薄膜コイルを均一な膜厚で形成す
ることが難しい問題があり、段差のあるコイル形
成面上に分厚い薄膜コイルを均一な膜厚で形成す
る方法が要望されている。 In such a thin film magnetic head, in order to form the thin film coil 7 on the resin insulating layer 6 including the bottom pole layer 4 with a uniform thickness and in a highly accurate pattern, it is necessary to ensure the flatness of the insulating layer 6. is extremely important. However, in reality, flattening of the resin insulating layer 6 is extremely important due to the step difference due to the thickness of the lower magnetic pole layer 4. However, in reality, it is difficult to flatten the resin insulating layer 6 due to the difference in the thickness of the lower magnetic pole layer 4, and it is difficult to form a thick thin film coil with a uniform thickness. There is a need for a method of forming a thick thin film coil with a uniform film thickness on a coil forming surface.
上記した薄膜磁気ヘツドの薄膜コイルを形成す
る従来の方法は、第９図の部分大断面図に示すよ
うに、例えば図示しないAl2O3、又はSiO2等から
なる絶縁体層及びNi−Feパーマロイからなる導
電性下地層がスパツタリング法により順に被着形
成され、更にNi−Feパーマロイからなる下部磁
極層が形成されたセラミツク等の非磁性基板１上
にSiO2等からなるギヤツプ層５をスパツタリン
グ法等により被着形成する。
The conventional method for forming the thin film coil of the above-mentioned thin film magnetic head is, as shown in the partial large - scale cross-sectional view of FIG . A conductive underlayer made of permalloy is sequentially deposited by a sputtering method, and a gap layer 5 made of SiO 2 etc. is sputtered on a non-magnetic substrate 1 made of ceramic or the like on which a bottom pole layer made of Ni-Fe permalloy is formed. Adhesion is formed by a method etc.
次に図示しない下部磁性層の磁極先端部となる
部分を除く該ギヤツプ層５上の所定領域に、平坦
化し易いレジスト剤等をスピンコート法等により
塗布し、熱硬化処理を行つて樹脂絶縁層６を形成
する。その後、該樹脂絶縁層６上に銅（Cu）等
からなる導電性下地膜１１をスパツタリング法等
により被着し、その上に再びレジスト膜１２を形
成する。 Next, a resist agent that is easy to flatten is applied to a predetermined area on the gap layer 5, excluding the portion that will become the magnetic pole tip of the lower magnetic layer (not shown), by spin coating, etc., and a thermosetting process is performed to form a resin insulating layer. form 6. Thereafter, a conductive base film 11 made of copper (Cu) or the like is deposited on the resin insulating layer 6 by sputtering or the like, and a resist film 12 is again formed thereon.
次に第１０図に示すように該レジスト膜１２を
所定パターンにパターニングし、該レジスト膜１
２パターンをマスクにして第１１図に示すように
露出した導電性下地膜１１上にメツキ法により
Cu導体層１３を形成する。次に第１２図に示す
ように前記レジスト膜１２パターンを溶解除去す
ると共に、更に露呈した導電性下地膜１１部分を
イオンエツチング法等により選択的にエツチング
除去して薄膜コイル７を形成している。 Next, as shown in FIG. 10, the resist film 12 is patterned into a predetermined pattern.
Using the two patterns as a mask, the exposed conductive base film 11 is coated by plating as shown in FIG.
A Cu conductor layer 13 is formed. Next, as shown in FIG. 12, the resist film 12 pattern is dissolved and removed, and the exposed portion of the conductive base film 11 is selectively etched away using an ion etching method or the like to form a thin film coil 7. .
しかし上記の如き従来の薄膜コイルの形成方法
にあつては、コイル形成領域面となる樹脂絶縁層
６の層厚が実際には、下部磁極層４等の厚さによ
る段差によつて該絶縁層６の中央部が厚く、周辺
部が薄くなつて均一な平坦面が得られないことか
ら、かかる樹脂絶縁層６上に導電性下地膜１１を
スパツタリング法等により被着し、その上に薄膜
コイル形成用のレジスト膜１２を形成した際に、
該レジスト膜１２の厚さが第９図に示すように中
央部で薄く、また周辺部に行くに従つて厚くな
る。
However, in the conventional method of forming a thin film coil as described above, the layer thickness of the resin insulating layer 6, which forms the coil forming area surface, is actually different due to the step caused by the thickness of the lower magnetic pole layer 4, etc. 6 is thick at the center and thin at the periphery, making it impossible to obtain a uniform flat surface. Therefore, a conductive base film 11 is deposited on the resin insulating layer 6 by a sputtering method or the like, and a thin film coil is formed on top of the conductive base film 11. When forming the resist film 12 for formation,
As shown in FIG. 9, the thickness of the resist film 12 is thin at the center and becomes thicker toward the periphery.
このため該レジスト膜１２を所定パターンにパ
ターニングし、該レジスト膜１２パターンをマス
クにして第１１図に示すように露出した導電性下
地膜１１上にメツキ法により薄膜コイルとなる
Cu導体層１３を形成する場合、該Cu導体層１３
の膜厚が前記レジスト膜１２パターンの不均一な
膜厚によつて制限される。 For this purpose, the resist film 12 is patterned into a predetermined pattern, and using the pattern of the resist film 12 as a mask, a thin film coil is formed by plating on the exposed conductive base film 11 as shown in FIG.
When forming the Cu conductor layer 13, the Cu conductor layer 13
The film thickness is limited by the non-uniform film thickness of the resist film 12 pattern.
従つて、例えば該レジスト膜１２パターンの中
央部の膜厚を基準にすると、薄膜コイル７のパタ
ーン精度はよいが、厚い膜厚の薄膜コイルを形成
することができず、又前記レジスト膜１２パター
ンの周辺部の膜厚を基準にして薄膜コイル７を厚
く形成すると前記レジスト膜１２パターンの中央
部において薄膜コイル７の幅が該レジスト膜１２
パターンを越えて増大し、極端な場合には隣り合
わせの薄膜コイル同士が接触してシヨートする恐
れがあり、断面形状が所望とする略正方形をなす
厚い薄膜コイルをパターン精度よく得ることが難
しいといつた問題があつた。 Therefore, for example, if the thickness of the central portion of the resist film 12 pattern is used as a reference, the pattern accuracy of the thin film coil 7 is good, but it is not possible to form a thin film coil with a large thickness. When the thin film coil 7 is formed thickly based on the thickness of the peripheral part of the resist film 12, the width of the thin film coil 7 at the center of the pattern of the resist film 12 becomes thicker than that of the resist film 12.
It may increase beyond the pattern, and in extreme cases, adjacent thin film coils may come into contact with each other and shoot, making it difficult to obtain thick thin film coils with a desired approximately square cross-sectional shape with high pattern accuracy. I had a problem.
本発明は上記問題点を解消した薄膜磁気ヘツド
の製造方法、特に薄膜コイルを形成すべき樹脂絶
縁層が平坦で無くても、断面形状が所望とする略
正方形をなす厚い薄膜コイルをパターン精度よく
形成する方法を提供せんとするもので、その手段
は、基板上に下部磁性層を所定パターンに被着形
成した後、該下部磁性層上にギヤツプ層及び絶縁
層を介して薄膜コイル、絶縁層及び上部磁性層を
順に積層形成する薄膜磁気ヘツドの製造方法にお
いて、上記絶縁層上に薄膜コイルを形成する際
に、該絶縁層上にレジスト膜を塗布した後、該レ
ジスト膜を所定パターンにパターニングして第１
枠状パターンを形成する工程と、該第１枠状パタ
ーンが形成された絶縁層上に導電性下地膜を被着
した後、その上に再びレジスト膜を塗布し、該レ
ジスト膜を前記第１枠状パターンと同様の所定パ
ターンにパターニングして第２枠状パターンを形
成する工程とを行い、前記第２枠状パターンをマ
スクにして薄膜コイルをメツキ法により形成する
本発明による薄膜磁気ヘツドの製造方法によつて
解決される。
The present invention is directed to a method for manufacturing a thin film magnetic head that solves the above-mentioned problems. In particular, even if the resin insulating layer on which the thin film coil is to be formed is not flat, a thick thin film coil having a desired substantially square cross section can be fabricated with high pattern accuracy. The present invention aims to provide a method for forming a thin film coil and an insulating layer on the lower magnetic layer via a gap layer and an insulating layer, after forming a lower magnetic layer on a substrate in a predetermined pattern. and a method for manufacturing a thin film magnetic head in which upper magnetic layers are sequentially laminated, and when forming a thin film coil on the insulating layer, a resist film is applied on the insulating layer, and then the resist film is patterned into a predetermined pattern. first
After forming a frame pattern and depositing a conductive base film on the insulating layer on which the first frame pattern is formed, a resist film is again applied thereon, and the resist film is applied to the first frame pattern. forming a second frame pattern by patterning it into a predetermined pattern similar to the frame pattern, and forming a thin film coil by a plating method using the second frame pattern as a mask. The problem is solved by the manufacturing method.
即ち、薄膜コイルを形成すべき樹脂絶縁層上に
コイル形成用のレジスト膜マスクパターンを２層
構成に形成して該マスクパターンの膜厚を増大せ
しめ、該厚い膜厚のレジスト膜マスクパターンを
用いて薄膜コイルを形成することにより、断面形
状が略正方形をなす所望とする厚い薄膜コイルを
パターン精度よく形成し得るようにしたことであ
る。
That is, a resist film mask pattern for forming a coil is formed in a two-layer configuration on a resin insulating layer on which a thin film coil is to be formed, the film thickness of the mask pattern is increased, and the resist film mask pattern with the thick film thickness is used. By forming a thin film coil using the same method, a desired thick thin film coil having a substantially square cross-sectional shape can be formed with high pattern accuracy.
以下図面を用いて本発明の実施例について詳細
に説明する。
Embodiments of the present invention will be described in detail below with reference to the drawings.
第１図乃至第６図は本発明に係る薄膜磁気ヘツ
ドの製造方法の一実施例を工程順に示す要部断面
図である。 FIGS. 1 to 6 are sectional views showing essential parts of an embodiment of a method for manufacturing a thin film magnetic head according to the present invention in the order of steps.
まず第１図に示すように、従来と同様に例えば
図示しないAl2O3、又はSiO2等からなる絶縁体層
及びNi−Feパーマロイからなる導電性下地層が
スパツタリング法により順に被着形成され、更に
Ni−Feパーマロイからなる下部磁極層が形成さ
れたセラミツク等の非磁性基板１上にSiO2等か
らなるギヤツプ層５をスパツタリング法等により
被着形成する。 First, as shown in FIG. 1, an insulating layer made of, for example, Al 2 O 3 or SiO 2 (not shown) and a conductive base layer made of Ni-Fe permalloy are sequentially deposited by sputtering as in the conventional method. , furthermore
A gap layer 5 made of SiO 2 or the like is deposited by sputtering or the like on a nonmagnetic substrate 1 made of ceramic or the like on which a bottom pole layer made of Ni--Fe permalloy is formed.
次に図示しない下部磁極層の磁極先端部となる
部分を除く該ギヤツプ層５上の所定領域に、平坦
化し易いレジスト剤等をスピンコート法等により
塗布し、熱硬化処理を行つて樹脂絶縁層６を形成
する。その後、該樹脂絶縁層６上に再びレジスト
膜１２をスピンコート法等により形成する。 Next, a resist agent that is easy to flatten is applied to a predetermined area on the gap layer 5, excluding the portion that will become the magnetic pole tip of the lower magnetic pole layer (not shown), by spin coating or the like, and a thermosetting process is performed to form a resin insulating layer. form 6. Thereafter, a resist film 12 is again formed on the resin insulating layer 6 by spin coating or the like.
次に第２図に示すように該レジスト膜１２を所
定パターンにパターニングし、該レジスト膜１２
パターンを第３図に示すように、例えば数百度で
一時間程度、熱硬化処理を行つて突起状の第１枠
状パターン２１を形成した後、該第１枠状パター
ン２１が成された樹脂絶縁層６上に銅（Cu）等
からなる導電性下地膜２２をスパツタリング法等
により被着形成する。 Next, as shown in FIG. 2, the resist film 12 is patterned into a predetermined pattern.
As shown in FIG. 3, the pattern is thermally cured at several hundred degrees for about an hour to form a protruding first frame pattern 21, and then the resin on which the first frame pattern 21 is formed is heated. A conductive base film 22 made of copper (Cu) or the like is deposited on the insulating layer 6 by sputtering or the like.
次に第４図に示すように該導電性下地膜２２上
に再度レジスト膜１３を形成し、該レジスト膜２
３を前記第１枠状パターン２１と同様の所定パタ
ーンにパターニングして第２枠状パターン２４を
形成する。 Next, as shown in FIG. 4, a resist film 13 is formed again on the conductive base film 22, and the resist film 2
3 into a predetermined pattern similar to the first frame pattern 21 to form a second frame pattern 24.
かくすれば、薄膜コイル２６形成用のマスクパ
ターンが容易に厚く形成される。従つて第５図に
示すように第２枠状パターン２４をマスクとして
露出した導電性下地膜２２部分上にメツキ法によ
りCu導体層２５を厚く形成することが出来る。 In this way, a thick mask pattern for forming the thin film coil 26 can be easily formed. Therefore, as shown in FIG. 5, a thick Cu conductor layer 25 can be formed by plating on the exposed portion of the conductive base film 22 using the second frame pattern 24 as a mask.
次に第６図に示すように前記第２枠状パターン
２４をレジスト除去剤により溶解除去すると共
に、除去することによつて露呈した導電性下地膜
２２部分をイオンエツチング法等により選択的に
エツチング除去することにより、断面形状が略正
方形をなす所望とする厚い薄膜コイル２６をパタ
ーン精度よく形成することができる。 Next, as shown in FIG. 6, the second frame pattern 24 is dissolved and removed using a resist remover, and the portion of the conductive base film 22 exposed by the removal is selectively etched using an ion etching method or the like. By removing it, a desired thick thin film coil 26 having a substantially square cross-sectional shape can be formed with high pattern accuracy.
尚、薄膜コイル２６間に突出残置している第１
枠状パターン２１は熱硬化処理が施されているこ
とから樹脂絶縁層としてそのまま残留適用できる
ので、このままの状態で以後の絶縁層、上部磁性
層等の形成工程を進めれば良い。 Note that the first coil remaining protruding between the thin film coils 26
Since the frame-shaped pattern 21 has been subjected to thermosetting treatment, it can be left as is as a resin insulating layer, and the subsequent steps of forming the insulating layer, upper magnetic layer, etc. can be proceeded in this state.
以上の説明から明らかなように、本発明に係る
薄膜磁気ヘツドの製造方法によれば、薄膜コイル
を形成すべき樹脂絶縁層の平坦性に難点があつて
も、断面形状が略正方形をなす所望とする厚い薄
膜コイルをパターン精度よく容易に形成すること
が可能となる。
As is clear from the above description, according to the method of manufacturing a thin film magnetic head according to the present invention, even if there is a problem with the flatness of the resin insulating layer on which the thin film coil is formed, the desired cross-sectional shape is approximately square. It becomes possible to easily form a thick thin film coil with high pattern accuracy.
従つて従来、問題となつていた薄膜コイルが薄
いことによる製造上での段差等による切断障害
や、厚く形成することによる隣接コイル間のシヨ
ート障害等が解消され、この種の薄膜磁気ヘツド
の製造方法に適用して信頼性の良い薄膜磁気ヘツ
ドを得ることができる優れた効果を有する。 Therefore, the conventional problems of cutting problems due to differences in manufacturing steps due to thin thin film coils, and shorting problems between adjacent coils due to thicker thin film coils, etc., have been solved, and the manufacturing of this type of thin film magnetic head has been solved. This method has an excellent effect in that a highly reliable thin film magnetic head can be obtained.
第１図乃至第６図は本発明に係る薄膜磁気ヘツ
ドの製造方法の一実施例を工程順に示す要部断面
図、第７図は薄膜磁気ヘツドの構造を説明するた
めの平面図、第８図は第７図に示すＡ−A′切断
線に沿つた要部断面図、第９図乃至第１２図は従
来の薄膜磁気ヘツドの製造方法の１例を工程順に
説明するための要部拡大断面図である。
図中、１は非磁性基板、５はギヤツプ層、６は
薄膜コイル形成面を有する樹脂絶縁層、２１は第
１枠状パターン、１２，２３はレジスト膜、２２
は導電性下地層、２４は第２枠状パターン、２５
はCu導体層、２６は薄膜コイルをそれぞれ示す。
1 to 6 are cross-sectional views of main parts showing an embodiment of the method for manufacturing a thin film magnetic head according to the present invention in the order of steps, FIG. 7 is a plan view for explaining the structure of the thin film magnetic head, and FIG. The figure is a sectional view of the main part taken along the line A-A' shown in Fig. 7, and Figs. 9 to 12 are enlarged views of the main part to explain an example of a conventional thin-film magnetic head manufacturing method in the order of steps. FIG. In the figure, 1 is a non-magnetic substrate, 5 is a gap layer, 6 is a resin insulating layer having a thin film coil forming surface, 21 is a first frame pattern, 12 and 23 are resist films, 22
24 is a conductive base layer, 24 is a second frame pattern, and 25 is a conductive base layer.
2 indicates a Cu conductor layer, and 26 indicates a thin film coil.
Claims (1)
成した後、該下部磁性層上にギヤツプ層及び絶縁
層を介して薄膜コイル、絶縁層及び上部磁性層を
順に積層形成する薄膜磁気ヘツドの製造方法にお
いて、上記絶縁層上に薄膜コイルを形成する際
に、該絶縁層上にレジスト膜を塗布した後、該レ
ジスト膜を所定パターンにパターニングして第１
枠状パターンを形成する工程と、該第１枠状パタ
ーンが形成された絶縁層上に導電性下地膜を被着
した後、その上に再びレジスト膜を塗布し、該レ
ジスト膜を前記第１枠状パターンと同様の所定パ
ターンにパターニングして第２枠状パターンを形
成する工程とを行い、前記第１、第２枠状パター
ンをマスクにして薄膜コイルをメツキ法により形
成することを特徴とする薄膜磁気ヘツドの製造方
法。1 Manufacturing a thin film magnetic head by depositing a lower magnetic layer on a substrate in a predetermined pattern, and then sequentially laminating a thin film coil, an insulating layer, and an upper magnetic layer on the lower magnetic layer via a gap layer and an insulating layer. In the method, when forming a thin film coil on the insulating layer, a resist film is applied on the insulating layer, and then the resist film is patterned into a predetermined pattern.
After forming a frame pattern and depositing a conductive base film on the insulating layer on which the first frame pattern is formed, a resist film is again applied thereon, and the resist film is applied to the first frame pattern. forming a second frame pattern by patterning into a predetermined pattern similar to the frame pattern, and forming a thin film coil by a plating method using the first and second frame patterns as masks. A method for manufacturing a thin film magnetic head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13353984A JPS6111915A (en) | 1984-06-27 | 1984-06-27 | Production of thin film magnetic film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13353984A JPS6111915A (en) | 1984-06-27 | 1984-06-27 | Production of thin film magnetic film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6111915A JPS6111915A (en) | 1986-01-20 |
| JPH0316686B2 true JPH0316686B2 (en) | 1991-03-06 |
Family
ID=15107174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13353984A Granted JPS6111915A (en) | 1984-06-27 | 1984-06-27 | Production of thin film magnetic film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6111915A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333830B2 (en) * | 1998-11-09 | 2001-12-25 | Read-Rite Corporation | Low resistance coil structure for high speed writer |
-
1984
- 1984-06-27 JP JP13353984A patent/JPS6111915A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6111915A (en) | 1986-01-20 |
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