JP2599890C - - Google Patents
Info
- Publication number
- JP2599890C JP2599890C JP2599890C JP 2599890 C JP2599890 C JP 2599890C JP 2599890 C JP2599890 C JP 2599890C
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- solder
- solder material
- addition
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 47
- 239000000463 material Substances 0.000 claims description 27
- 229910052725 zinc Inorganic materials 0.000 claims description 23
- 229910052797 bismuth Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 2
- 239000011701 zinc Substances 0.000 description 49
- 229910045601 alloy Inorganic materials 0.000 description 43
- 239000000956 alloy Substances 0.000 description 43
- REDXJYDRNCIFBQ-UHFFFAOYSA-N aluminium(3+) Chemical class [Al+3] REDXJYDRNCIFBQ-UHFFFAOYSA-N 0.000 description 37
- 238000002844 melting Methods 0.000 description 17
- 229910020836 Sn-Ag Inorganic materials 0.000 description 12
- 229910020988 Sn—Ag Inorganic materials 0.000 description 12
- 229910052709 silver Inorganic materials 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000012071 phase Substances 0.000 description 8
- 229910001297 Zn alloy Inorganic materials 0.000 description 6
- 229910002056 binary alloy Inorganic materials 0.000 description 6
- 238000005260 corrosion Methods 0.000 description 6
- 239000006023 eutectic alloy Substances 0.000 description 6
- 150000002739 metals Chemical class 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002244 precipitate Substances 0.000 description 6
- 229910001316 Ag alloy Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 4
- 229910020220 Pb—Sn Inorganic materials 0.000 description 3
- -1 Tin-silver Chemical compound 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910002058 ternary alloy Inorganic materials 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000012300 argon atmosphere Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910052904 quartz Inorganic materials 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 210000001503 Joints Anatomy 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000000996 additive Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 125000004429 atoms Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000003287 optical Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000007670 refining Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
Family
ID=
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2599890B2 (ja) | 無鉛ハンダ材料 | |
| JP3221640B2 (ja) | 改良された力学的性質を持つＰｂを含まない半田 | |
| JP3533017B2 (ja) | 半田付け接合用の鉛なし合金 | |
| KR100400121B1 (ko) | 개선된기계적성질을갖는무연저융점땜납및이를사용하여접합된제품 | |
| JP2001504760A (ja) | 鉛を含まないはんだ | |
| TW201938809A (zh) | 焊錫合金、焊錫膏、焊錫球、含焊劑芯焊錫及焊錫接頭 | |
| TW202045291A (zh) | 無鉛焊錫合金及焊錫接合部 | |
| JP4770733B2 (ja) | はんだ及びそれを使用した実装品 | |
| KR102667732B1 (ko) | 고 신뢰성 응용을 위한 표준 sac 합금에 대한 저은 주석계 대안 땜납 합금 | |
| JP6887183B1 (ja) | はんだ合金および成形はんだ | |
| CN111511494B (zh) | 用于电子应用的具有成本效益的无铅焊料合金 | |
| JP7337822B2 (ja) | 極限環境における電子用途のための高信頼性鉛フリーはんだ合金 | |
| JP2599890C (fr) | ||
| JP4359983B2 (ja) | 電子部品の実装構造体およびその製造方法 | |
| JPWO2014142153A1 (ja) | はんだ接合物及びはんだ接合方法 | |
| KR100374173B1 (ko) | 아연의 산화가 방지되는 주석-아연계 무연 땜납 | |
| Noor et al. | Bi Based Interconnect Systems and Applications | |
| JPH09206981A (ja) | はんだ材料 | |
| JPS63143232A (ja) | リ−ドフレ−ム用銅合金 |