JP2584414Y2 - 半導体素子用試験装置 - Google Patents
半導体素子用試験装置Info
- Publication number
- JP2584414Y2 JP2584414Y2 JP432591U JP432591U JP2584414Y2 JP 2584414 Y2 JP2584414 Y2 JP 2584414Y2 JP 432591 U JP432591 U JP 432591U JP 432591 U JP432591 U JP 432591U JP 2584414 Y2 JP2584414 Y2 JP 2584414Y2
- Authority
- JP
- Japan
- Prior art keywords
- socket
- contact
- test
- temperature
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 title claims description 57
- 239000004065 semiconductor Substances 0.000 title claims description 16
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 20
- 229910052753 mercury Inorganic materials 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 6
- 230000037431 insertion Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000010998 test method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP432591U JP2584414Y2 (ja) | 1991-01-17 | 1991-01-17 | 半導体素子用試験装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP432591U JP2584414Y2 (ja) | 1991-01-17 | 1991-01-17 | 半導体素子用試験装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0496078U JPH0496078U (cs) | 1992-08-20 |
| JP2584414Y2 true JP2584414Y2 (ja) | 1998-11-05 |
Family
ID=31734015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP432591U Expired - Fee Related JP2584414Y2 (ja) | 1991-01-17 | 1991-01-17 | 半導体素子用試験装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2584414Y2 (cs) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102123052B1 (ko) * | 2014-06-23 | 2020-06-15 | (주)테크윙 | 테스트핸들러 |
| CN114200275B (zh) * | 2020-08-31 | 2024-05-14 | 株洲中车时代半导体有限公司 | 一种碳化硅mosfet器件高温栅偏试验方法及系统 |
-
1991
- 1991-01-17 JP JP432591U patent/JP2584414Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0496078U (cs) | 1992-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |