JP2581436Y2 - Case type electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component, and more particularly, to a case-type electronic component in which an electronic component element is housed and sealed in a case.

[0002]

2. Description of the Related Art As a conventional case-type electronic component in which an electronic component element is housed and sealed in a case, there is, for example, a case-type electronic component whose sectional view is shown in FIG.

[0003] The case-type electronic component is placed in a case 21 having an open upper portion as shown in FIGS.
2 is accommodated, a sealing lid 24 is provided on the opening 23 of the case 21, a sealing resin 25 is applied thereon, and the electronic component element 22 is sealed in the internal space 26 of the case 21. Have been.

[0004]

However, in the above-mentioned conventional case-type electronic component, in the step of applying the sealing resin, the sealing resin 25 is filled with the internal space of the case 21 from the gap between the case 21 and the sealing lid 24. 26, and adheres to the electronic component element 22 to deteriorate its characteristics.

For example, when the electronic component element 22 is a piezoelectric element, the sealing resin 25 flowing into the internal space 26 from the gap between the case 21 and the sealing lid 24 is
It adheres to the piezoelectric element 22 (electronic component element) housed therein, causing a problem such as lowering the resonance characteristics.

The present invention solves the above-mentioned problems, and prevents the sealing resin from flowing into (intruding into) the case, thereby preventing deterioration in characteristics due to the flowing of the sealing resin. It is an object to provide a case-type electronic component.

[0007]

In order to achieve the above object, a case-type electronic component according to the present invention accommodates an electronic component element in a case, provides a sealing lid to an opening of the case, and forms a sealing resin. In the case-type electronic component in which the electronic component element is sealed in the case by fixing the sealing lid to the case, an inner side wall having a height lower than the side wall is formed inside the side wall of the case. Is fitted inside the side wall of the case, the lower surface thereof is brought into contact with the upper surface of the inner side wall, and a sealing resin is applied from above the sealing lid to fix the sealing lid to the case, whereby the electronic component is The element is sealed in a case.

[0008]

A space is formed between the side wall of the case and the inner side wall formed inside the side wall of the case, and the sealing resin flowing from the gap between the sealing lid and the side wall of the case accumulates in the space. Therefore, the sealing resin flowing from the gap between the sealing lid and the side wall of the case flows into the inner space inside the inner side wall and does not reach the electronic component element, and the sealing resin adheres to the electronic component element. As a result, it is possible to reliably prevent the deterioration of characteristics caused by this.

Further, the side wall portion of the case has a double structure of the side wall and the inner side wall, and the heat insulating property of the case is improved. Therefore, the influence of the temperature change on the internal electronic component elements is suppressed, and the characteristic variation is prevented. And reliability can be improved.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view schematically showing the internal structure of a case-type electronic component according to an embodiment of the present invention.
FIG. 3 is a perspective view showing a structure of a case.

In the case type electronic component of this embodiment, an electronic component element 2 is housed in a case 1, a sealing lid 4 is provided on an opening 3 of the case 1, and a sealing resin 5 is applied thereon. Is formed by sealing the electronic component element 2 in the internal space 6 of the case 1.

In the case type electronic component of this embodiment, an inner side wall 7 having a height lower than the side wall 1a is formed inside the side wall 1a of the case 1, and between the side wall 1a and the inner side wall 7. Is formed with a space 8 for storing the sealing resin 5 that has entered.

The sealing lid 4 is fitted inside the side wall 1 a of the case 1, and is provided such that its lower surface is in contact with the upper surface of the inner side wall 7. Then, a sealing resin 5 is applied on the sealing lid 4, and a gap between the side wall 1 a of the case 1 and the sealing lid 4 is sealed by the sealing resin 5.

In the case-type electronic component of this embodiment configured as described above, even if the sealing resin 5 flows from the gap between the side wall 1a of the case 1 and the sealing cover 4, 5 does not penetrate into the internal space 6 in which the electronic component element 2 is accommodated by being blocked by the internal side wall 7,
It accumulates in a space 8 formed between the side wall 1a and the inner side wall 7.

Therefore, it is possible to prevent the sealing resin 5 from flowing into the internal space 6 of the case 1 and to surely prevent the deterioration of the characteristics due to the adhesion of the sealing resin 5 to the electronic component element 2. Become. In addition, since the side wall portion of the case 1 has a double structure of the side wall 1a and the inner side wall 7, the heat insulating property of the case 1 is improved, and the influence of a temperature change on the internal electronic component element 2 is suppressed, so that the characteristic variation. Can be prevented, and the reliability can be improved.

FIG. 3 shows a case-type electronic component according to another embodiment of the present invention, that is, a case-type electronic component (piezoelectric component) in which the electronic component element is a piezoelectric element. In the case-type electronic component (piezoelectric component) of this embodiment, the electronic component element (piezoelectric element) housed in the case 1 is:
The piezoelectric element 12 is formed by forming a vibration electrode 13 on a piezoelectric substrate 11 and soldering terminals 14 that are electrically connected to the vibration electrode 13 to both ends thereof. Note that in FIG.
5 indicates solder.

In the case type electronic component of this embodiment, the piezoelectric element 12 is housed in the internal space 6 of the case 1, and the terminal 14 is connected to a through hole (not shown) of the sealing lid 4. It is exposed to the outside. The sealing lid 4 is in contact with an inner side wall 7 formed inside the side wall 1 a of the case 1, and a sealing resin 5 is applied on the sealing lid 4 to seal the side wall 1 a of the case 1. The gap with the lid 4 is sealed by the sealing resin 5.

In the case-type electronic component of this embodiment formed as described above, the sealing resin 5 is inserted into the internal space 6 of the case 1 similarly to the case-type electronic component shown in FIGS. , And the deterioration of the characteristics due to the sealing resin 5 adhering to the electronic component element 2 can be reliably prevented. Further, since the side wall portion of the case 1 has a double structure of the side wall 1a and the inner side wall 7, the heat insulating property of the case 1 is improved, and the influence of a temperature change on the internal electronic component element (piezoelectric element) 2 is suppressed. Thus, variations in characteristics can be prevented, and reliability can be improved.

In the case-type electronic component of the present invention, the type of the electronic component element housed and sealed in the case is not particularly limited, and a case type in which various electronic component elements are housed and sealed in the case. It can be applied to electronic components.

Further, regarding the shape of the case and the sealing lid,
Various applications can be added as long as the effects of the present invention are not impaired.

[0021]

As described above, in the case-type electronic component of the present invention, the inner side wall is formed inside the side wall of the case, the sealing lid is fitted inside the side wall of the case, and the lower surface is formed on the upper surface of the inner side wall. The electronic components are sealed in the case by applying sealing resin from the top of the sealing lid and fixing the sealing lid to the case. Of the sealing resin can be prevented, and the deterioration of the characteristics due to the adhesion of the sealing resin to the electronic component element can be surely prevented.

Further, since the side wall portion of the case has a double structure of the side wall of the case and the inner side wall, the heat insulating property of the case is improved, and the influence of temperature change on the internal electronic component elements is suppressed, and the variation in characteristics is reduced. Can be prevented, and the reliability of the electronic component can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a case-type electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a structure of a case used in the case type electronic component according to one embodiment of the present invention;

FIG. 3 is a perspective view showing a main part of a case-type electronic component according to another embodiment of the present invention.

FIG. 4 is a cross-sectional view showing the structure of a conventional case-type electronic component.

FIG. 5 is a perspective view showing a structure of a case used in a conventional case-type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Case 1a Case side wall 2 Electronic component element 3 Case opening 4 Sealing lid 5 Sealing resin 6 Case internal space 7 Internal side wall 8 Space

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int. Cl. ⁶ , DB name) H01L 23/00-23/10 H01C 1/024 H03H 9/02 H05K 5/06 H05K 7/12

Claims (1)

(57) [Scope of request for utility model registration] An electronic component element is sealed in a case by accommodating an electronic component element in a case, providing a sealing lid to an opening of the case, and fixing the sealing lid to the case with a sealing resin. In the case-type electronic component, an inner side wall having a height lower than the side wall is formed inside the side wall of the case,
By fitting the sealing lid inside the side wall of the case and bringing the lower surface into contact with the upper surface of the inner side wall, applying a sealing resin from above the sealing lid and fixing the sealing lid to the case. A case-type electronic component, wherein an electronic component element is sealed in a case.