JPH0436246U - - Google Patents
Info
- Publication number
- JPH0436246U JPH0436246U JP1990077541U JP7754190U JPH0436246U JP H0436246 U JPH0436246 U JP H0436246U JP 1990077541 U JP1990077541 U JP 1990077541U JP 7754190 U JP7754190 U JP 7754190U JP H0436246 U JPH0436246 U JP H0436246U
- Authority
- JP
- Japan
- Prior art keywords
- shaped groove
- semiconductor device
- frame
- groove deeper
- frame width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例による半導体装置
を示す断面側面図、第２図及び第３図はこの考案
の他の実施例を示す側面断面図、第４図及び第５
図は従来の半導体装置を示す断面側面図である。
図において、１は半導体チツプ、２はＢｅＯ基
板、３は放熱フイン、４はアルミナ基板、５は入
力リード、６は出力リード、７は側壁フレーム、
８はフタ、９は接着剤、１０はパツケージ、１１
はメタライズ、１２は半田、１３は金属フレーム
を示す。なお、図中、同一符号は同一、又は相当
部分を示す。
FIG. 1 is a sectional side view showing a semiconductor device according to one embodiment of this invention, FIGS. 2 and 3 are side sectional views showing other embodiments of this invention, and FIGS.
The figure is a cross-sectional side view showing a conventional semiconductor device. In the figure, 1 is a semiconductor chip, 2 is a BeO substrate, 3 is a heat dissipation fin, 4 is an alumina substrate, 5 is an input lead, 6 is an output lead, 7 is a side wall frame,
8 is the lid, 9 is the adhesive, 10 is the package, 11
12 represents metallization, 12 represents solder, and 13 represents metal frame. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
設け、Ｖ字型溝にフレーム幅より深くはめ込まれ
るフタを備えた半導体装置。 A semiconductor device in which a side wall frame is provided with a V-shaped groove deeper than the frame width, and a lid is fitted into the V-shaped groove deeper than the frame width.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077541U JPH0436246U (en) | 1990-07-20 | 1990-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077541U JPH0436246U (en) | 1990-07-20 | 1990-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436246U true JPH0436246U (en) | 1992-03-26 |
Family
ID=31620026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990077541U Pending JPH0436246U (en) | 1990-07-20 | 1990-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436246U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0573952U (en) * | 1992-03-13 | 1993-10-08 | 株式会社村田製作所 | Case type electronic parts |
| JP2011187697A (en) * | 2010-03-09 | 2011-09-22 | Fuji Electric Co Ltd | Assembling method of semiconductor package |
| WO2014010074A1 (en) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | Semiconductor device |
-
1990
- 1990-07-20 JP JP1990077541U patent/JPH0436246U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0573952U (en) * | 1992-03-13 | 1993-10-08 | 株式会社村田製作所 | Case type electronic parts |
| JP2011187697A (en) * | 2010-03-09 | 2011-09-22 | Fuji Electric Co Ltd | Assembling method of semiconductor package |
| WO2014010074A1 (en) * | 2012-07-13 | 2014-01-16 | 三菱電機株式会社 | Semiconductor device |
| US9363914B2 (en) | 2012-07-13 | 2016-06-07 | Mitubishi Electric Corporation | Semiconductor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0436246U (en) | ||
| JPS6316457U (en) | ||
| JPH0270450U (en) | ||
| JPS5834742U (en) | Heat dissipation structure for resin-encapsulated semiconductor devices | |
| JPH0236047U (en) | ||
| JPS6068656U (en) | Semiconductor device with heat sink | |
| JPS59107157U (en) | GaAs semiconductor device | |
| JPS6013762U (en) | semiconductor laser | |
| JPH0268451U (en) | ||
| JPH03122548U (en) | ||
| JPH03101541U (en) | ||
| JPH01146549U (en) | ||
| JPS60141142U (en) | Heat dissipation fins for semiconductor devices | |
| JPS6122351U (en) | Resin-encapsulated semiconductor device | |
| JPH0265347U (en) | ||
| JPH03126363U (en) | ||
| JPS59111097U (en) | semiconductor equipment | |
| JPS6318851U (en) | ||
| JPS6344453U (en) | ||
| JPS6324841U (en) | ||
| JPH01115247U (en) | ||
| JPS5820539U (en) | Semiconductor integrated circuit device | |
| JPS62131449U (en) | ||
| JPH02127038U (en) | ||
| JPS59182939U (en) | Semiconductor package cage with radiator |