JPS6112683Y2 - - Google Patents
Info
- Publication number
- JPS6112683Y2 JPS6112683Y2 JP1869480U JP1869480U JPS6112683Y2 JP S6112683 Y2 JPS6112683 Y2 JP S6112683Y2 JP 1869480 U JP1869480 U JP 1869480U JP 1869480 U JP1869480 U JP 1869480U JP S6112683 Y2 JPS6112683 Y2 JP S6112683Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin material
- metal case
- resin
- electronic component
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000463 material Substances 0.000 claims description 38
- 229910052751 metal Inorganic materials 0.000 claims description 34
- 239000002184 metal Substances 0.000 claims description 34
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 229920002050 silicone resin Polymers 0.000 description 15
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 229920001084 poly(chloroprene) Polymers 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000011038 discontinuous diafiltration by volume reduction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
本案は電子部品の封止構体の改良に関するもの
である。[Detailed Description of the Invention] The present invention relates to an improvement of a sealing structure for an electronic component.
一般にこの種封止構体は例えば第１図〜第２図
に示すように、セラミツク板などのプリント基板
Ａに半導体素子Ｂ、抵抗、コンデンサなどを適宜
に固定すると共に、半導体素子Ｂの電極とプリン
ト基板Ａのパツド部とを金属細線Ｃにて接続して
なる電子部品の金属ケースＤに収納固定し、この
金属ケースＤに、金属ケースＤに対する密着性に
乏しいものの緩衝性に優れた第１の樹脂材例えば
シリコン樹脂Ｅを、電子部品が埋没されるように
注入すると共に、シリコン樹脂Ｅ上に、金属ケー
スＤに対する密着性に優れた第２の樹脂材例えば
エポキシ樹脂Ｆを注入して構成されている。 Generally, as shown in FIGS. 1 and 2, in this type of sealing structure, a semiconductor element B, a resistor, a capacitor, etc. are appropriately fixed to a printed circuit board A such as a ceramic board, and the electrodes of the semiconductor element B are connected to a printed circuit board A. An electronic component made by connecting the pad part of the board A with a thin metal wire C is housed and fixed in a metal case D, and a first metal case D that has poor adhesion to the metal case D but has excellent cushioning properties is attached to the metal case D. A resin material such as silicone resin E is injected so that the electronic components are buried therein, and a second resin material such as epoxy resin F having excellent adhesion to the metal case D is injected onto the silicone resin E. ing.
ところで、この封止構体は電子部品がシリコン
樹脂Ｅにて被覆されている上、金属ケースＤの開
口部がエポキシ樹脂Ｆにて封止されている関係
で、電子部品を振動、湿気などから充分に保護す
ることができるものである。 By the way, in this sealed structure, the electronic components are covered with silicone resin E, and the opening of the metal case D is sealed with epoxy resin F, so the electronic components are sufficiently protected from vibrations, moisture, etc. It is something that can be protected.
しかし乍ら、この封止構体は通常、80℃程度以
下の雰囲気下で使用されることが多いのである
が、時には150℃程度にまで温度上昇することが
ある。 However, although this sealed structure is usually used in an atmosphere of about 80°C or lower, the temperature may sometimes rise to about 150°C.
ところがシリコン樹脂Ｅの線膨脹係数は約30×
105／℃、エポキシ樹脂Ｆの線膨脹係数は金属ケ
ースＤのそれに合せる必要があるために約２×
10-5／℃であり、シリコン樹脂Ｅはエポキシ樹脂
Ｆに比べて１桁以上も線膨脹係数が大きくなつて
いるために、使用温度がそれぞれの樹脂Ｅ，Ｆの
熱硬化のために処理温度程度（例えば80℃程度）
であれば何らトラブルは生じないのであるが、例
えば温度が150℃程度にまで上昇した場合には問
題が生ずる。 However, the coefficient of linear expansion of silicone resin E is approximately 30×
10 5 /℃, the coefficient of linear expansion of the epoxy resin F needs to match that of the metal case D, so it is approximately 2×
10 -5 /℃, and because silicone resin E has a coefficient of linear expansion that is more than an order of magnitude larger than epoxy resin F, the operating temperature is higher than the processing temperature for thermal curing of resins E and F. degree (e.g. around 80℃)
If so, no trouble will occur, but if the temperature rises to about 150°C, for example, a problem will occur.
即ち、例えばシリコン樹脂Ｅの厚みを５mmと仮
定すれば、シリコン樹脂Ｅの伸び量はほぼ0.1mm
に達するものの、シリコン樹脂Ｅはその全周面が
金属ケースＤ、エポキシ樹脂Ｆにて強固に包囲さ
れている関係で、シリコン樹脂Ｅの膨脹分を吸収
することは全くできない。 That is, for example, if the thickness of silicone resin E is assumed to be 5 mm, the amount of elongation of silicone resin E is approximately 0.1 mm.
However, since the entire circumferential surface of the silicone resin E is tightly surrounded by the metal case D and the epoxy resin F, the expansion of the silicone resin E cannot be absorbed at all.
このために、シリコン樹脂Ｅにて被覆された電
子部品には過大な圧縮応力が、電子部品の形態に
よつてシリコン樹脂Ｅの被覆厚さが均一化できな
いことにも関連して、不均一に作用する結果、半
導体素子Ｂが破損したり、或いは第３図に示すよ
うに金属細線Ｃが図示点線（正常な状態）より実
線のようにくしやくしやに変形し、ついには断線
したりするという欠点がある。 For this reason, excessive compressive stress is applied to electronic components coated with silicone resin E, which may be uneven due to the fact that the coating thickness of silicone resin E cannot be made uniform depending on the form of the electronic component. As a result of this action, the semiconductor element B may be damaged, or the thin metal wire C may be deformed from the dotted line (normal state) shown in the figure to a comb or a comb, as shown by the solid line, and eventually break, as shown in Figure 3. There are drawbacks.
本案はこのような点に鑑み、使用温度が異常に
上昇しても電子部品に対する影響を効果的に軽減
しうる電子部品の封止構体を提供するもので、以
下実施例について説明する。 In view of these points, the present invention provides a sealing structure for electronic components that can effectively reduce the influence on electronic components even if the operating temperature rises abnormally.Examples will be described below.
第４図〜第６図において、１は例えばアルミニ
ウムなどのように熱伝導性良好なる金属部材にて
構成された金属ケースであつて、例えば上方に開
口部を有する角筒状のケース本体２と、ケース本
体２の開口縁に一体的に形成された取付耳片３と
から構成されている。そして、ケース本体２の取
付耳片３に対向する壁面の上方部分には角形の切
欠き部４が、内壁面の全周に亘つて段部５がそれ
ぞれ形成されている。６は金属ケース１の底部に
接着剤などによつて固定された電子部品であつ
て、例えばセラミツク板などのプリント基板７に
半導体素子８、抵抗、コンデンサなどを接続、固
定すると共に、半導体素子８の電極とプリント基
板７のプリント導体とを金属細線９にて接続して
構成されている。１０は緩衝性を有する第１の樹
脂材であつて、金属ケース１に電子部品６が完全
に埋没するように注入されている。尚、この第１
の樹脂材１０としてはシリコン樹脂が好適し、熱
硬化状態において若干の柔軟性を有する。１１は
可撓性を有する部材にて構成された板材であつ
て、金属ケース１の段部５に、壁面に対して水密
的なるように配置されている。１２は第１の樹脂
材１０の上面と板材１１の下面との間に形成され
た空間部であつて、それの厚みは第１の樹脂材１
０の熱膨脹分を充分に吸収しうる程度に設定され
ている。１３はゴムブツシングであつて、例えば
ブツシング本体と、ブツシング本体の中心に形成
されたリード線挿通孔１４と、ブツシング本体の
両側に形成された溝部１５，１５とから構成され
ている。そして、このゴムブツシング１３は金属
ケース１の切欠き部４に、溝部１５，１５が切欠
き部４の周縁壁面に嵌合されるように装着されて
いる。１６は外部リード線であつて、それの内端
はゴムブツシング１３のリード線挿通孔１４、板
材１１を介して電子部品６の端子部（図示せず）
に半田付けされている。１７は金属ケース１に対
する密着性に優れた第２の樹脂材であつて、板材
１１上に金属ケース１の上方開口部が閉塞される
ように注入されている。尚、この第２の樹脂材１
７としてはエポキシ樹脂が好適し、熱硬化状態に
おいて充分の機械的強度を有する。 4 to 6, reference numeral 1 denotes a metal case made of a metal member with good thermal conductivity, such as aluminum, and includes, for example, a rectangular cylindrical case body 2 having an opening at the top. , and a mounting lug 3 integrally formed on the opening edge of the case body 2. A rectangular notch 4 is formed in the upper part of the wall surface of the case body 2 facing the mounting lug 3, and a stepped portion 5 is formed along the entire circumference of the inner wall surface. Reference numeral 6 denotes an electronic component fixed to the bottom of the metal case 1 with an adhesive or the like. For example, a semiconductor element 8, a resistor, a capacitor, etc. are connected and fixed to a printed circuit board 7 such as a ceramic board. The electrode and the printed conductor of the printed circuit board 7 are connected by a thin metal wire 9. Reference numeral 10 denotes a first resin material having cushioning properties, which is injected into the metal case 1 so that the electronic component 6 is completely buried therein. Furthermore, this first
Silicone resin is suitable as the resin material 10, and has some flexibility in a thermoset state. Reference numeral 11 denotes a plate made of a flexible member, and is disposed on the stepped portion 5 of the metal case 1 so as to be watertight with respect to the wall surface. Reference numeral 12 denotes a space formed between the upper surface of the first resin material 10 and the lower surface of the plate material 11, and the thickness of the space is equal to that of the first resin material 1.
It is set to such an extent that it can sufficiently absorb the thermal expansion of 0. Reference numeral 13 denotes a rubber bushing, which is composed of, for example, a bushing body, a lead wire insertion hole 14 formed at the center of the bushing body, and grooves 15, 15 formed on both sides of the bushing body. This rubber bushing 13 is attached to the notch 4 of the metal case 1 so that the grooves 15, 15 are fitted into the peripheral wall surface of the notch 4. Reference numeral 16 denotes an external lead wire, the inner end of which is connected to the terminal portion (not shown) of the electronic component 6 through the lead wire insertion hole 14 of the rubber bushing 13 and the plate 11.
is soldered to. A second resin material 17 has excellent adhesion to the metal case 1, and is injected onto the plate material 11 so as to close the upper opening of the metal case 1. Note that this second resin material 1
Epoxy resin is suitable as 7, and has sufficient mechanical strength in a thermoset state.
このように第１の樹脂材１０と第２の樹脂材１
７との間には空間部１２が形成されているので、
仮に使用時の温度が150℃程度にまで上昇して
も、第１の樹脂材１０の熱膨脹分を空間部１２の
体積変化によつて吸収できる。このために、電子
部品６に対する第１の樹脂材１０による圧縮応力
は殆んど作用せず、半導体素子８の破損、金属細
線９の変形ないし断線を皆無にできる。 In this way, the first resin material 10 and the second resin material 1
Since a space 12 is formed between 7 and 7,
Even if the temperature during use rises to about 150° C., the thermal expansion of the first resin material 10 can be absorbed by the volume change of the space 12. Therefore, almost no compressive stress is applied to the electronic component 6 by the first resin material 10, and damage to the semiconductor element 8 and deformation or disconnection of the thin metal wire 9 can be completely eliminated.
又、金属ケース１の段部５には可撓性を有する
板材１１が金属ケース１の壁面に対して水密的に
配設されているので、板材１１上に金属ケース１
の上方開口部が封塞されるように液状（未硬化状
態）の第２の樹脂材１７を注入しても、それの空
間部１２への流出をほぼ完全に防止できる。この
ために、空間部１２の容積縮少は完全に防止で
き、上述の圧縮応力に伴うトラブルを皆無にでき
る。 In addition, since a flexible plate 11 is disposed on the stepped portion 5 of the metal case 1 in a watertight manner with respect to the wall surface of the metal case 1, the metal case 1 is placed on the plate 11.
Even if the liquid (uncured state) second resin material 17 is injected so that the upper opening of the resin material 17 is sealed, it is possible to almost completely prevent the second resin material 17 from flowing into the space 12 . Therefore, the volume reduction of the space 12 can be completely prevented, and the troubles associated with the above-mentioned compressive stress can be completely eliminated.
又、第１の樹脂材１０と第２の樹脂材１７との
間に配設された板材１１は可撓性を有するので、
第２の樹脂材１７の熱硬化時に空間部１２の空気
の熱膨脹を板材１１の彎曲によつて吸収できる
上、空気の第２の樹脂材１７への混入を防止でき
る。このために、第１の樹脂材１０と第２の樹脂
材（板材）との間に所定の空間部１２を確保でき
る上、第２の樹脂材１７の金属ケース１の壁面に
対する充分の密着性を得ることができる。 Further, since the plate material 11 disposed between the first resin material 10 and the second resin material 17 has flexibility,
When the second resin material 17 is thermally cured, the thermal expansion of the air in the space 12 can be absorbed by the curvature of the plate material 11, and also air can be prevented from entering the second resin material 17. For this reason, a predetermined space 12 can be secured between the first resin material 10 and the second resin material (plate material), and sufficient adhesion of the second resin material 17 to the wall surface of the metal case 1 can be ensured. can be obtained.
次に具体的実施例について説明する。 Next, specific examples will be described.
実施例 １
32×15×0.635tmmのセラミツク板よりなるプリ
ント基板に半導体素子、抵抗、コンデンサなどを
適宜にマウントすると共に、半導体素子の電極と
プリント基板とを金属細線にて接続してなる電子
部品（自動車用イグナイタ本体）を肉厚が1.5mm
で内寸法が35×18×15mmのアルミニウムケースに
収納固定する。次に液状のシリコン樹脂をアルミ
ニウムケースに、電子部品上の厚みが２mmとなる
ように注入し、熱硬化処理する。次にアルミニウ
ムケースの段部に35.2×18.2×１tmmのネオプレー
ンゴムを載置すると共に、その上に液状のエポキ
シ樹脂を注入し、熱硬化処理する。尚、シリコン
樹脂の上面とネオプレーンゴムの下面との間の空
間部の厚みは２mmである。Example 1 An electronic device is manufactured by appropriately mounting semiconductor elements, resistors, capacitors, etc. on a printed circuit board made of a 32 x 15 x 0.635 t mm ceramic board, and connecting the electrodes of the semiconductor element and the printed circuit board with thin metal wires. The wall thickness of the parts (automobile igniter body) is 1.5mm.
It is stored and fixed in an aluminum case with internal dimensions of 35 x 18 x 15 mm. Next, liquid silicone resin is injected into the aluminum case so that it has a thickness of 2 mm above the electronic components, and heat-cured. Next, neoprene rubber of 35.2 x 18.2 x 1 t mm was placed on the step of the aluminum case, and liquid epoxy resin was injected onto it and heat-cured. The thickness of the space between the upper surface of the silicone resin and the lower surface of the neoprene rubber was 2 mm.
このように製作された封止構体を80℃→150℃
→80℃の温度サイクル試験し、半導体素子、金属
細線に対する影響を調査した処、半導体素子の破
損、金属細線の変形及び断線は全く認められなか
つた。しかし乍ら、従来構造のものはほぼ全数に
金属細線の変形が見られ、半導体素子の破損も５
％に達している。 The sealed structure manufactured in this way was heated from 80℃ to 150℃.
→We conducted a temperature cycle test at 80°C to investigate the effects on semiconductor elements and thin metal wires, and found no damage to the semiconductor elements, no deformation or disconnection of the thin metal wires. However, deformation of the thin metal wires was observed in almost all of the conventional structures, and damage to the semiconductor elements was also observed in 5 cases.
% has been reached.
実施例 ２
実施例１において、エポキシ樹脂をウレタン樹
脂（ハードタイプ）に変更した処、実施例と同様
の結果が得られた。Example 2 In Example 1, the epoxy resin was changed to urethane resin (hard type), and the same results as in Example were obtained.
尚、本案において、第１の樹脂材はシリコン樹
脂、第２の樹脂材はエポキシ樹脂、ウレタン樹脂
にのみ制約されることなく、他の樹脂材を用いる
こともできる。又、電子部品より外部に導出され
るリード線は第７図に示すように可撓性を有する
板材に付設した端子１８に中継接続した上で導出
させることもできる。 In the present invention, the first resin material is not limited to silicone resin, and the second resin material is not limited to epoxy resin or urethane resin, but other resin materials may also be used. Further, the lead wire led out from the electronic component can be led out after being relay-connected to a terminal 18 attached to a flexible plate material, as shown in FIG.
以上のように本案によれば、金属ケースの温度
が異常に上昇しても電子部品に対する影響を効果
的に回避でき、長時間に亘つて高品位に保つこと
ができる。 As described above, according to the present invention, even if the temperature of the metal case rises abnormally, the influence on electronic components can be effectively avoided, and high quality can be maintained for a long time.
第１図は従来例の側断面図、第２図は第１図の
要部破断平面図、第３図は温度サイクル後におけ
る状態を示す要部拡大断面図、第４図は本案の一
実施例を示す平面図、第５図は第４図の−断
面図、第６図は本案に係る金属ケースの斜視図、
第７図は本案の他の実施例を示す側断面図であ
る。
図中、１は金属ケース、５は段部、６は電子部
品、１０は第１の樹脂材、１１は板材、１２は空
間部、１７は第２の樹脂材である。
Fig. 1 is a side sectional view of the conventional example, Fig. 2 is a cutaway plan view of the main part of Fig. 1, Fig. 3 is an enlarged sectional view of the main part showing the state after temperature cycling, and Fig. 4 is an implementation of the present invention. A plan view showing an example, FIG. 5 is a cross-sectional view of FIG. 4, and FIG. 6 is a perspective view of the metal case according to the present invention.
FIG. 7 is a side sectional view showing another embodiment of the present invention. In the figure, 1 is a metal case, 5 is a step, 6 is an electronic component, 10 is a first resin material, 11 is a plate material, 12 is a space, and 17 is a second resin material.
Claims (1)
た金属ケースに緩衝性を有する第１の樹脂材を、
電子部品が埋没しかつ底部から段部までの中間位
置まで注入すると共に、段部に可撓性を有する板
材を配設して密閉し第１の樹脂材と板材との間に
空間部を形成し、前記板材を底面とする金属ケー
ス内に金属ケースに対する密着性に優れた第２の
樹脂材を注入した封止したことを特徴とする電子
部品の封止構体。 A first resin material having cushioning properties is placed in a metal case with a stepped portion formed on the inner circumferential wall and electronic components stored at the bottom.
The electronic component is buried and injected to an intermediate position from the bottom to the stepped portion, and a flexible plate is placed in the stepped portion to seal it and form a space between the first resin material and the plate. A sealed structure for an electronic component, characterized in that a second resin material having excellent adhesion to the metal case is injected into a metal case having the plate material as a bottom surface and sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1869480U JPS6112683Y2 (en) | 1980-02-15 | 1980-02-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1869480U JPS6112683Y2 (en) | 1980-02-15 | 1980-02-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56121292U JPS56121292U (en) | 1981-09-16 |
| JPS6112683Y2 true JPS6112683Y2 (en) | 1986-04-19 |
Family
ID=29614989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1869480U Expired JPS6112683Y2 (en) | 1980-02-15 | 1980-02-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6112683Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60254643A (en) * | 1984-05-31 | 1985-12-16 | Toshiba Corp | Resin-sealed semiconductor device |
-
1980
- 1980-02-15 JP JP1869480U patent/JPS6112683Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56121292U (en) | 1981-09-16 |
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