JP2554207Y2 - 半導体式熱感知器 - Google Patents
半導体式熱感知器Info
- Publication number
- JP2554207Y2 JP2554207Y2 JP1989135323U JP13532389U JP2554207Y2 JP 2554207 Y2 JP2554207 Y2 JP 2554207Y2 JP 1989135323 U JP1989135323 U JP 1989135323U JP 13532389 U JP13532389 U JP 13532389U JP 2554207 Y2 JP2554207 Y2 JP 2554207Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- thermistor
- main body
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 230000001012 protector Effects 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 3
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Fire-Detection Mechanisms (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135323U JP2554207Y2 (ja) | 1989-11-24 | 1989-11-24 | 半導体式熱感知器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989135323U JP2554207Y2 (ja) | 1989-11-24 | 1989-11-24 | 半導体式熱感知器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0374097U JPH0374097U (enrdf_load_stackoverflow) | 1991-07-25 |
| JP2554207Y2 true JP2554207Y2 (ja) | 1997-11-17 |
Family
ID=31682597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989135323U Expired - Fee Related JP2554207Y2 (ja) | 1989-11-24 | 1989-11-24 | 半導体式熱感知器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2554207Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4570242B2 (ja) * | 2000-12-21 | 2010-10-27 | 株式会社鷺宮製作所 | 抵抗率計の電極 |
| JP6470559B2 (ja) * | 2014-12-12 | 2019-02-13 | 新コスモス電機株式会社 | 光電式煙感知器 |
| JP7321669B2 (ja) * | 2018-02-28 | 2023-08-07 | 能美防災株式会社 | 熱感知器 |
| JP7387273B2 (ja) * | 2019-03-25 | 2023-11-28 | 能美防災株式会社 | 熱検知器 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60155231A (ja) * | 1984-01-24 | 1985-08-15 | Toshiba Corp | 芳香族ポリエステルアミド共重合体の製造方法 |
| JPS61170045U (enrdf_load_stackoverflow) * | 1985-04-12 | 1986-10-22 | ||
| JPS6262936U (enrdf_load_stackoverflow) * | 1985-10-09 | 1987-04-18 |
-
1989
- 1989-11-24 JP JP1989135323U patent/JP2554207Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0374097U (enrdf_load_stackoverflow) | 1991-07-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |