GB2049277A - A temperature detecting device - Google Patents
A temperature detecting device Download PDFInfo
- Publication number
- GB2049277A GB2049277A GB8012107A GB8012107A GB2049277A GB 2049277 A GB2049277 A GB 2049277A GB 8012107 A GB8012107 A GB 8012107A GB 8012107 A GB8012107 A GB 8012107A GB 2049277 A GB2049277 A GB 2049277A
- Authority
- GB
- United Kingdom
- Prior art keywords
- heat
- semiconductor device
- stem
- transistor
- metal tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/01—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using semiconducting elements having PN junctions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
- G01K7/22—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements the element being a non-linear resistance, e.g. thermistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Nonlinear Science (AREA)
- Fire-Detection Mechanisms (AREA)
Abstract
A temperature detecting device includes a casing 1 and a heat detecting section 10 mounted on the casing 1. The heat detecting section 10 includes a semiconductor device 5, e.g. transistor, a stem supporting the semiconductor device 5 and provided with electrical leads connected to corresponding terminals of the semiconductor device 5 and a metal tube 2 which is fixedly secured at one end to the casing 1. The stem and the semiconductor device 5 are disposed in the metal tube 2 such that an upper surface of the semiconductor device 5 is in thermal contact with a surface of the other end of the metal tube 2 or with a heat collector 4 thermally coupled to the heat detecting section 10. In addition, the stem and the semiconductor device 5 are fixedly secured to the metal tube 2 with an adhesive material 11' having a high thermal conductivity. <IMAGE>
Description
SPECIFICATION
A temperature detecting device
The present invention relates to a temperature detecting device. More particularly, the invention relates to a temperature detecting device for use in electronic fire alarm systems having a heat detecting section provided with a heat collector in which a semiconductor element is employed as a heat detecting element.
In general, it is well know in the art that a forward voltage drop developed across the P-N junction of a semi-conductor diode will vary linearly over a wide range of temperature when the forward current thereof is held constant. Hence, semiconductor diodes have widely been used as heat detecting elements because of their stable and reliable characteristics. Since it is necessary to both detect the variations in temperature and then amplify the derived signal representing variations, it has been proposed that the P-N junction of a transistor be used as a semiconductor diode.
Figure 1 shows an example of a conventional temperature detecting device in which a transistor is employed as a heat detecting element. The conventional temperature detecting device shown in Figure 1 includes a casing 1 which houses a reference voltage generating circuit, a comparator circuit, a switching circuit and the like, and a metal protective tube 2 having a high heat conductivity mounted on the casing 1. So as to improve the heat response characteristics, a transistor 5 hermetically sealed within a metal case is provided in the free end portion of the metal tube 2 and is held in place by an insulating adhesive agent.The transistor is provided with three electrical leads, one of which is electrically connected to a metal case of the transistor 5 and an insulating material 11, such as alumina, is provided between the transistor 5 and the metal protective tube 2 so that they are electrically insulated. To provide for the electrical insulation, a metal tube having a large internal diameter must be employed as the metal protective tube 2. This results in an increase in the heat capacity of the metal protective tube 2 because of the presence of the insulating material 11. Furthermore, with the above described construction, the transistor pellet within its metal case is necessarily spaced from the metal protective tube 2 and, accordingly, the heat response characteristics of the device are impaired.
Accordingly, the conventional temperature detecting device has the disadvantage of poor heat response characeristics. Therefore, the abovementioned conventional temperature detecting device cannot be employed in a fire alarm system which must detect unusually rapid increases in ambient temperature.
In order to improve the heat response characteristics of temperaure detecting devices, it has been proposed to provide the heat detecting section of the device with a heat collector. Where the temperature detecting device employs a bimetallic device or a semiconductor as the heat detecting element, it has been proposed in, for example, Unexamined Published Japanese Utility Model Application Nos.
25490/1975 and 98090/1976, to stack the heat collector on the heat detecting section or, as disclosed in
Unexamined Published Japanese Utility Model Application No. 130691/1977, the heat collector may be secured to the heat detecting section by spot welding or by an adhesive agent. However, these conventional techniques require a large number of manufacturing steps as a result of which maufacturing costs are high. In addition, where the heat collector is secured by the use of an adhesive agent, the endothermic action of the adhesive agent results in a decrease of the heat collecting effect of the heat collector.
An object of the present invention is provide to an improved temperature detecting device which has excellent heat response characteristics, and which is simple in construction and economical to produce.
Accordingly, the invention resides in a temperature detecting device including casing means, and heat detecting means mounted on said casing means and comprising a semiconductor device, a stem for supporting said semiconductor device and provided with electrical leads connected to corresponding terminals of said semiconductor device, a metal tube which is fixedly secured at one end to said casing means, said stem and said semiconductor device being disposed in said metal tube such that an upper surface of said semiconductor device is in thermal contact with a surface of the other end of said metal tube or with heat collecting means thermally coupled to the heat detecting means, and said stem and said semiconductor device being fixedly secured to said metal tube with an adhesive material having a high thermal conductivity.
In the acompanying drawings:
Figure 1 is a schematic diagram partly cut-away of a conventional temperature detecting device;
Figure 2 is a top view of a temperature detecting device according to a first example of the invention;
Figure 3 is a side view of the temperature detecting device of the first example;
Figure 4 is a cross-sectional view taken along a line IV-IV in Figure 2;
Figure 5 is an exploded view of part of the temperature detecting device of the first example;
Figure 6 is a schematic perspective view illustrating the mechanical connections between various parts of the temperature detecting device of the first example,
Figure 7 is a schematic top view of a resin mold transistor employed in the temperature detecting device of the first example;
Figure 8 is a schematic perspective view of the resin mold transistor shown in Figure 7 when mounted on a stem;;
Figure 9 is a cross-sectional view of the stem and the transistor shown in Figure 8;
Figure 10 is a cross-sectional view illustrating a temperature detecting device according to a second example of the invention;
Figure 11 is a cross-sectional view of part of a temperature detecting device according to a third example of the invention;
Figure 12 is a side view of part of a device according to a fourth example; and
Figure 13 is a front view of the stem shown in
Figure 12.
Referring to Figures 2 to 6, in the temperature detecting device of the first example, a heat collector 4 is engaged with a metal protective tube 2 having a high heat conductivity of a heat detecting section 10 which is mounted on a casing 1 ofthetemperture detecting device. The heat collector 4 is secured to the casing 1 by the engagement of a protective member 9 which protects the heat collector 4 and the heat detecting section 10. The casing 1 is provided with a plurality of equi-angularly spaced, upstanding ribs 3.
The metal protective tube 2 which supports the heat collector 4, serves as a holder and casing for a resin mold transistor 5 and its stem 13 (shown in
Figures 7 to 9) thereby protecting the transistor 5 from damage caused by harmful gases. It is preferred that the size of the metal protective tube 2 be as small as possible in orderto minimise the heat capacity thereof. It is thus desirable that the inside diameter of the pipe 2 where the stem 13 is received and secured be minimised as well as the thickness of the peripheral wall of the tube 2. The pipe 2 is generally made of stainless steel. However, because stainless steel will corrode if exposed to hydrogen chloride gas, a resin coating may be required to provide acceptable anti-corrosion protection.In this case, assuming for example that the surface of the tube 2 is coated with a resin having a high adhesion, it is possible to simultaneously use the resin to attach the heat collector to the tube 2.
The heat collector 4 is provided so as to absorb radiant heat or convection heat from high temperature air due to a fire and to transmit the collected heat to the resin mold transistor 5. Therefore, the collector 4 is attached to the metal protective tube 2 in thermal contact therewith. The heat collector 4 may also be made of stainless steel, but stainless steel has the disadvantage described above and thus an anti-corrosion coating is required. However, because of manufacturing difficulties, the thickness of the coating may be too high at the periphery of the heat collector 4 or it may be non-uniform. To overcome these difficulties, titanium may be used for the heat collector 4. This results in a heat collector having a high anti-corrosion property with respect to corrosive gases such as hydrogen chloride. The heat collector 4 may also be formed of aluminium.
The heat detecting section 10 is composed of the resin mold transistor 5, its stem 13, the heat collector 4 and the metal protective tube 2 containing the other elements therein so as to protect them from damage. The resin mold transistor 5 is mounted on a transistor holder 13d of the stem 13 with the terminals of the transistor 5 electrically connected to corresponding lead wires of the stem 13. The stem 13 together with the transistor 5 is inserted into the metal protective tube 2 iri such a manner that the top surface of the transistor 5 is in contact with the closed free end surface 2a of the metal protective tube 2 whereafter the transistor 5 and the transistor holder 13d are fixedly secured to the metal protective tube 2 by a filler 11' of a resin such as an epoxy resin having a high thermal conductivity.By potting the transistor 5 and the transistor holder 13d of the stem 13 in the filler 11', a water-tight seal is provided and the anti-corrosion properties thereof are improved. It should be noted that these functions of the filler 11' can be sufficiently achieved by potting only the transistor 5 and the transistor holder 13d of the stem 13. If the entire interior of the metal protective tube 2 were to be filled with the filler, this would result in a high heat capacity. Therefore it is necessary to avoid the use of excessive filler.
Shoulder portions 6 for receiving the heat connector 4 are formed at radial extending inside regions of the top options of the ribs 3 and the protective member 9 is formed with engaging members 7 which engage with the shoulder portions 6 respectively to hold the heat collector 4 in place relative to the ribs 3. That is, as shown in Figure 5, the heat collector 4 is generally disc shaped and has a central opening formed therein adapted to receive the metal protective tube 2. Thus, the collector 4 is firstly engaged with the metal protective tube 2 of the heat detecting section 10 and is received by the shoulder portions 6. Then by engagement of members 7 of the protective member 9 with the shoulder portions 6, the heat collector 4 is secured to the ribs 3.
More specifically, the protective member 9 is annular with the engaging members 7 being formed as resilient hooks which extend downwardly from the inner periphery of the protective member. The hooks are designed to engage with corresponding shoulder portions 6 of the ribs 3. In the preferred embodiment of Figures 2 - 6, there are four ribs 3 and a corresponding number of engaging members although any practical number may be used depending upon the overall physical size of the device and the particular application concerned.
On either side of each of the engaging members 7 there is provided a conically shaped protrusion 8 which prevents the protective member 9 from rotating. The conical protrusions 8 extend from the lower suface of the protective member 9 at positions so as to closely abut the upper part of the ribs 3 above the shoulder portions 6 with one protrusion 8 on each side of each rib 3. With this construction, the device is essentially tamperproof as the engaging members 7 cannot be disengaged from the shoulder portions 6 and the protective member 9 cannot be rotated so that the protective member 9 canot be removed once in place other than by physically breaking it.
The ribs 3 may be integrally formed with the casing 1 or may be provided as separate members which are attached to the casing 1. The protective member 9 may be provided with a separate set of engaging members which are used primarilyto hold the heat collector 4 against the ribs if so desired.
Also, the protrusions 8 may be omitted and replaced by protrusions each adapted to be received in a corresponding hole provided in each rib. Moreover, the shape of the protective member may be modified to other than the annular shape described, again depending upon the application to which the invention is put. Still further, as shown in Figure 5, the heat collector 4 may be provided with a small sleeve portion which extends axially around its central mounting hole end which receives the closed end of the protective tube 2. Other modifications are possible of this structure as discussed below including one in which the free end of the tube 2 is open.
Referring to Figures 7 to 9, the resin mold transistor 5 is formed by resin molding into an integral unit three bent metal electrodes Sa, Sb and 5c and a transistor pellet 5d which is mounted on the middle electrode 5b. The resultant resin body 5e fixes the electrodes at a predetermined distance from each other and isolates the transistor pellet 5d from the atmosphere. Preferably, the resin body is made as thin as possible so as to reduce the heat capacity of the molded resin body 5e and thereby improve the heat response characteristics of the transistor 5.Especially, it is desirable that the thickness of the resin above the electrode 5b be as small as possible in orderto improve the heat response characteristics of the transistor 5.
The stem 13 serves to support and hold the transistor 5 thereon and further to support the leads 13a, 13b and 13which couple the transistor 5 to electric processing circuits such as a reference voltage generating circuit disposed within the casing
1 of the temperature detecting device. The stem 13 is produced by drilling holes at positions on the transistor holder 13d corresponding to the electrodes Sa, Sb and 5c, force fitting lead wires 13a, 13b and 13e to the transistor holder 13d.
The resin mould transistor 5 is coupled to the upper surface of the stem 13 as shown in Figures 8 and 9 in such a manner that each electrode of the transistor is electrically connected to a correspond
ing lead wire of the stem 13 by soldering. The soldering is accomplished by disposing solder
pieces 14 between the electrodes Sa, Sb and 5c and the lead wires 13a, and 13c after which both the transistor 5 and the stem 13 are placed in an electric furnace to melt the solder and consequently, on resolidification of the solder, electrically connect the electrodes to the lead wires.
While Figures 2 through 6 illustrate a temperature detecting device in which the heat collector 4 is attached to the casing 1 by the protective member 9, as an alternative it is possible, as shown in Figure 10, to arrange that the heat collector 4 is secured directly to the casing 1. Thus in the second example shown
in Figure 10, a circular guide portion 4a of the central
opening in the heat collector 4 is fitted around the
metal protective tube 2 and then fixedly secured thereto with an adhesive agent having a high thermal conductivity.
The temperature detecting device provided with
the heat detecting section 10 constructed as de
scribed above operates to detect unusual ambient
temperature changes and to produce in response to
such an unusual change an emergency signal such
as a fire warning signal which is sent to a control
station. For this purpose, electrical circuits (not
shown) such as a reference voltage detecting circuit,
a comparator circuit and a switching circuit are
provided in the casing 1. In addition, the casing is
adapted to be mounted on a ceiling.
As is apparent from the above description, since the resin mold transistor is formed by merely molding resin around the transistor pellet 5d, the size of the transistor is minimised. Consequently, the size of the metal protective tube 2 which encases the transistor 5 and the stem 13 is reduced and, accordingly, the heat capacity thereof is also decreased. Furthermore, because the transistor pellet 5d is in close thermal contact with the free end surface 2a of the tube 2 through a thin resin layer and the electrode 5b, the heat response characteristics of the heat detecting section are improved over prior art constructions.In fact, with a heat detecting section constructed according to the invention, abrupt unusual changes in ambienttemperaure which were difficult if not impossible to detect with a conventional temperature detecting device can be accurately detected. Hence, a temperature detecting device utilising the heat sensing section of the invention will have a high sensitivity making it excellent for use in fire alarm systems.
Moreover, as the resin mold transistor 5 is mounted on the transistor holder 13dwhich is made of an insulating material, when the stem 13 is inserted into the tube 2 together with the transistor 5, there is no need to maintain insulation between the transistor and the metal tube as in the conventional case in which the transistor is hermetically sealed within a metal case. Therefore, the heat detecting section of the invention has definite manufacturing advantages over the prior art constructions.
Figure 11 is a cross-sectional view illustrating a third example of a temperature detecting device according to the invention. In this example, a metal tube 2' having open ends is employed as the metal protective tube 2. The heat detecting section 10 includes the metal tube 2', a heat collector 4 provided on one surface thereof with an annular guide portion 4a so as to receive the end of the metal protective tube 2', a stem 13 and a resin mold transistor 5. The stem 13 with the transistor 5 is inserted into the metal protective tube 2' in such a manner that the upper surface of the transistor 5 is in thermal contact with the heat collector 4 and that the transistor holder 13d of the stem and the transistor 5 are attached to the tube 2' with a filler 11'.
With the above described construction of the heat detection section 10, a tube having both ends open can be used as the metal protective tube 2 thereby resulting in a further reduction of manufacturing cost. In addition, because heat can be directly conducted from the heat collector 4 to the resin mold transistor 5, it is possible to yet further improve the heat response characteristics of the heat detecting section.
Figures 12 and 13 show a fourth example of the invention in which the stem 13 is provided with a printed circuit board 14 upon which connectors 14a to 14c have previously been printed. In this example, lead wires 1 3a to 13c of the stem 13 are connected to corresponding connectors 14a to 14c. Thus, when the stem 13 is inserted into a protective metal tube 2, problems due to the bending of the lead wires 13a to 13c or lead wires accidentally contacting the tube 2 and/or becoming entangled so resulting in a short circuit are eliminated. Furthermore, certain contact between the transistor 5 and the bottom of the tube 2 or the heat collector 4 is obtained.
As is clear from the above description, each of the above examples provides a temperature detecting device which uses a semiconductor as a heat detecting element, which has a low heat capacity and thus good heat response characteristics and which is economical in comparison with the conventional devices ofthe same general type.
Yet further modifications of the preferred embodiments are possible within the scope of the present invention. Specifically, the heat detecting section 10 as described above utilizes a semiconductor detecting element. However, it is not intended that the scope of the invention be restricted to any particular type of heat sensing element. For example, a bimetallic heat sensing element can be used. Yet further, as shown in Figures 2 - 6, the casing 1 is provided with a pair of threaded holes 12 forfixedly securing the casing to a ceiling. Instead, however, a socket-type casing may be employed in which a plate adapted to receive the casing is secured to the ceiling in advance.
Claims (9)
1. Atemperature detecting device including casing means, and heat detecting means mounted on said casing means and comprising a semiconductor device, a stem for supporting said semiconductor device and provided with electrical leads connected to corresponding terminals of said semiconductor device, a metal tube which is fixedly secured at one end to said casing means, said stem and said semiconductor device being disposed in said metal tube such that an upper surface of said semiconductor device is in thermal contact with a surface of the other end of said metal tube or with heat collecting means thermally coupled to the heat detecting means, and said stem and said semiconductor device being fixedly secured to said metal tube with an adhesive material having a high thermal conductivity.
2. A device as claimed in claim 1, wherein said casing means is provided with a plurality of rib portions each having a shoulder adapted to receive said heat collecting means and wherin the device also includes a protective member adapted to engage with said rib portions such that said heat collecting means is fixedly supported on said casing means by engagement of said rib portions and said protective member.
3. A device as claimed in claim 2, wherein said protective member comprises engaing pawis adapted to engage said rib portions respectively.
4. A device as claimed in claim 3, wherein said protective member is generally annular and is provided with projections adapted to prevent rotation of said protective member.
5. A device as defined in claim 4, wherein said projections are positioned to abut sides of said rib portions.
6. A device as claimed in claim 4, wherein said projections mate with corresponding depressions in said rib portions.
7. The temperature detecting device as claimed in any preceding claim, wherein said heat collecting means includes a thermally conductive disc formed with a central opening adapted to receive said metal tube of said heat detecting means.
8. Atemperature detecting device comprising the combination and arrangement of parts substantially as hereinbefore described with reference to, and as shown in, Figures 2 to 9, or Figure 10, or Figure 11, or Figures 12 and 13 of the accompanying drawings.
9. An electronic fire alarm system including a temperature detecting device as claimed in any preceding claim.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1979046986U JPS5838467Y2 (en) | 1979-04-11 | 1979-04-11 | fire detector |
| JP1979085583U JPS5838468Y2 (en) | 1979-06-22 | 1979-06-22 | thermal sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2049277A true GB2049277A (en) | 1980-12-17 |
| GB2049277B GB2049277B (en) | 1983-06-15 |
Family
ID=26387157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8012107A Expired GB2049277B (en) | 1979-04-11 | 1980-04-11 | Temperature detecting device |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU540952B2 (en) |
| DE (1) | DE3013831C2 (en) |
| GB (1) | GB2049277B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0067392A2 (en) * | 1981-06-15 | 1982-12-22 | HOLDENBECK Trading Company Limited | A temperature indicating device for a cooking pot and device-pot combination |
| EP0217620A2 (en) * | 1985-09-25 | 1987-04-08 | Imi Pactrol Limited | Temperature sensor |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63253223A (en) * | 1987-04-09 | 1988-10-20 | Terumo Corp | Temperature measuring instrument |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1267554A (en) * | 1968-11-25 | 1972-03-22 | Matsushita Electric Works Ltd | Heat detection electric switch |
-
1980
- 1980-04-10 AU AU57343/80A patent/AU540952B2/en not_active Ceased
- 1980-04-10 DE DE19803013831 patent/DE3013831C2/en not_active Expired
- 1980-04-11 GB GB8012107A patent/GB2049277B/en not_active Expired
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0067392A2 (en) * | 1981-06-15 | 1982-12-22 | HOLDENBECK Trading Company Limited | A temperature indicating device for a cooking pot and device-pot combination |
| EP0067392A3 (en) * | 1981-06-15 | 1984-09-05 | HOLDENBECK Trading Company Limited | A temperature indicating device for a cooking pot and device-pot combination |
| EP0217620A2 (en) * | 1985-09-25 | 1987-04-08 | Imi Pactrol Limited | Temperature sensor |
| EP0217620A3 (en) * | 1985-09-25 | 1987-11-25 | Imi Pactrol Limited | Temperature sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| AU540952B2 (en) | 1984-12-13 |
| GB2049277B (en) | 1983-06-15 |
| DE3013831A1 (en) | 1980-10-30 |
| DE3013831C2 (en) | 1985-07-11 |
| AU5734380A (en) | 1980-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4015229A (en) | Thermally responsive switch | |
| US6540963B2 (en) | Detector | |
| US20030058117A1 (en) | Fire sensor | |
| US4295371A (en) | Temperature detecting device | |
| GB2049277A (en) | A temperature detecting device | |
| US4292844A (en) | Temperature detecting device | |
| JPS6332874A (en) | Temperature sensor fitting structure for storage battery | |
| JPS6326918A (en) | Temperature fuse | |
| WO2003071131A1 (en) | Thermally-actuated switch | |
| CN216750372U (en) | Elastic conduction temperature measurement assembly and socket | |
| JP6880482B2 (en) | Temperature sensor | |
| JP2554207Y2 (en) | Semiconductor heat detector | |
| JP2515067Y2 (en) | Thermistor temperature sensor | |
| US5043836A (en) | Noise proof capacitor unit for a vehicular generator | |
| JP3849721B2 (en) | Fire detector | |
| JPH0120664Y2 (en) | ||
| JP3559915B2 (en) | Humidity sensor | |
| CA1335512C (en) | Liquid leakage sensor | |
| CN214843692U (en) | Conduction temperature measurement assembly | |
| JP2678090B2 (en) | Semiconductor heat detector | |
| CN221549872U (en) | Dual-redundancy temperature sensor | |
| JPS60334A (en) | Fitting device of heat-sensitive element | |
| CN216770837U (en) | Be applied to PCB temperature measuring structure who fills electric pile | |
| JPH0523070U (en) | Infrared detector | |
| JPS5838512Y2 (en) | Overcurrent protection device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930411 |