JP2549651Y2 - チップ可変抵抗器 - Google Patents
チップ可変抵抗器Info
- Publication number
- JP2549651Y2 JP2549651Y2 JP1989011278U JP1127889U JP2549651Y2 JP 2549651 Y2 JP2549651 Y2 JP 2549651Y2 JP 1989011278 U JP1989011278 U JP 1989011278U JP 1127889 U JP1127889 U JP 1127889U JP 2549651 Y2 JP2549651 Y2 JP 2549651Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal plate
- hollow shaft
- synthetic resin
- variable resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 229920003002 synthetic resin Polymers 0.000 claims description 40
- 239000000057 synthetic resin Substances 0.000 claims description 40
- 239000002184 metal Substances 0.000 claims description 13
- 238000003780 insertion Methods 0.000 claims description 9
- 230000037431 insertion Effects 0.000 claims description 9
- 238000007493 shaping process Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 17
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Adjustable Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011278U JP2549651Y2 (ja) | 1989-01-31 | 1989-01-31 | チップ可変抵抗器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989011278U JP2549651Y2 (ja) | 1989-01-31 | 1989-01-31 | チップ可変抵抗器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02102703U JPH02102703U (enrdf_load_stackoverflow) | 1990-08-15 |
| JP2549651Y2 true JP2549651Y2 (ja) | 1997-09-30 |
Family
ID=31219690
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989011278U Expired - Fee Related JP2549651Y2 (ja) | 1989-01-31 | 1989-01-31 | チップ可変抵抗器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2549651Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH039286Y2 (enrdf_load_stackoverflow) * | 1984-09-28 | 1991-03-08 | ||
| JPS625603U (enrdf_load_stackoverflow) * | 1985-06-27 | 1987-01-14 |
-
1989
- 1989-01-31 JP JP1989011278U patent/JP2549651Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02102703U (enrdf_load_stackoverflow) | 1990-08-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |