JP2548357Y2 - ウエーハの熱処理用載置治具 - Google Patents

ウエーハの熱処理用載置治具

Info

Publication number
JP2548357Y2
JP2548357Y2 JP1990016530U JP1653090U JP2548357Y2 JP 2548357 Y2 JP2548357 Y2 JP 2548357Y2 JP 1990016530 U JP1990016530 U JP 1990016530U JP 1653090 U JP1653090 U JP 1653090U JP 2548357 Y2 JP2548357 Y2 JP 2548357Y2
Authority
JP
Japan
Prior art keywords
heat treatment
silicon
wafer
cleaning
mounting jig
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990016530U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03106737U (enrdf_load_stackoverflow
Inventor
安則 岡
和昭 早田
正典 合原
克己 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Original Assignee
Sumitomo Sitix Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Sitix Corp filed Critical Sumitomo Sitix Corp
Priority to JP1990016530U priority Critical patent/JP2548357Y2/ja
Publication of JPH03106737U publication Critical patent/JPH03106737U/ja
Application granted granted Critical
Publication of JP2548357Y2 publication Critical patent/JP2548357Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1990016530U 1990-02-20 1990-02-20 ウエーハの熱処理用載置治具 Expired - Lifetime JP2548357Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990016530U JP2548357Y2 (ja) 1990-02-20 1990-02-20 ウエーハの熱処理用載置治具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990016530U JP2548357Y2 (ja) 1990-02-20 1990-02-20 ウエーハの熱処理用載置治具

Publications (2)

Publication Number Publication Date
JPH03106737U JPH03106737U (enrdf_load_stackoverflow) 1991-11-05
JP2548357Y2 true JP2548357Y2 (ja) 1997-09-17

Family

ID=31519792

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990016530U Expired - Lifetime JP2548357Y2 (ja) 1990-02-20 1990-02-20 ウエーハの熱処理用載置治具

Country Status (1)

Country Link
JP (1) JP2548357Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6433674B2 (ja) * 2014-04-07 2018-12-05 株式会社トクヤマ 多結晶シリコンの洗浄方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59162200A (ja) * 1983-03-03 1984-09-13 Agency Of Ind Science & Technol シリコン基板表面の清浄化法

Also Published As

Publication number Publication date
JPH03106737U (enrdf_load_stackoverflow) 1991-11-05

Similar Documents

Publication Publication Date Title
JP4667860B2 (ja) 材料表面の湿式洗浄方法及びこれを用いた電子、光学、または光電子デバイスの作製プロセス
TW466642B (en) Process for fabricating semiconductor wafers with external gettering
EP0718873A2 (en) Cleaning process for hydrophobic silicon wafers
JPH08264500A (ja) 基板の洗浄方法
US5964953A (en) Post-etching alkaline treatment process
US6375752B1 (en) Method of wet-cleaning sintered silicon carbide
JP2009248021A (ja) シリコンボートの洗浄方法、シリコンボート、シリコンウェハの熱処理方法、及びシリコンウェハ
JPH08172068A (ja) 半導体基板の洗浄方法及び半導体装置の製造方法
JPH09275084A (ja) 半導体基板の洗浄方法
US20090203212A1 (en) Surface Grinding Method and Manufacturing Method for Semiconductor Wafer
JP2548357Y2 (ja) ウエーハの熱処理用載置治具
JP3210800B2 (ja) 半導体基板の洗浄方法
KR101275384B1 (ko) 실리콘 웨이퍼 처리 방법
JP2000169233A (ja) 炭化ケイ素焼結体の湿式洗浄方法
JP4857738B2 (ja) 半導体ウエーハの洗浄方法および製造方法
JP2004031430A (ja) Soiウエーハおよびその製造方法
JPH05109683A (ja) 半導体シリコンウエーハ洗浄液の金属不純物除去方法
JPH056884A (ja) シリコンウエハーの洗浄方法
JPH08264399A (ja) 半導体基板の保管方法および半導体装置の製造方法
JPH05166777A (ja) 半導体ウェーハの洗浄方法
JPH0878376A (ja) 半導体用治工具の洗浄方法
JPH0750281A (ja) シリコンウェハーの洗浄方法
CN117174573B (zh) 一种去除晶圆表面铝金属膜的方法
JPS6293950A (ja) ウエハの製造方法
JP3489329B2 (ja) シリコンウエーハ表面の処理方法