JP2543126B2 - Electrical connection structure between boards - Google Patents
Electrical connection structure between boardsInfo
- Publication number
- JP2543126B2 JP2543126B2 JP63057250A JP5725088A JP2543126B2 JP 2543126 B2 JP2543126 B2 JP 2543126B2 JP 63057250 A JP63057250 A JP 63057250A JP 5725088 A JP5725088 A JP 5725088A JP 2543126 B2 JP2543126 B2 JP 2543126B2
- Authority
- JP
- Japan
- Prior art keywords
- connect
- substrate
- pattern
- substrates
- electrical connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、２つの基板間の導通と非導通が容易に確認
できるようにした基板間の電気的コネクト構造に関する
ものである。Description: TECHNICAL FIELD The present invention relates to an electrical connection structure between substrates that allows easy confirmation of conduction and non-conduction between two substrates.
［従来の技術］ 最近では、電子配線の増加に従い、基板間のコネクト
数も増え、このコネクト部の信頼性のチェックが大切に
なってきた。[Prior Art] Recently, as the number of electronic wirings has increased, the number of connections between substrates has increased, and it has become important to check the reliability of the connection section.
従来は、コネクト部の導通、非導通を測定しようとし
た場合、２つの基板のそれぞれに、コネクト部に電気的
につながるパットを形成し、それぞれに設けられたパッ
トをピン等によりチェックすることで確認を行なわなけ
ればならなかった。Conventionally, when trying to measure the continuity and non-conduction of the connect part, by forming a pad electrically connected to the connect part on each of the two substrates and checking the putt provided on each by pins or the like. I had to confirm.
［発明が解決しようとする課題］ 前述の従来の技術においては、実際には、コネクト後
に２つの基板両方ともがチェックできるように表面に表
われることが稀であり、一方の基板についてはチェック
ができても、他方の基板についてはチェックが難かしい
ため、コネクト部の導通の信頼性を測定することが困難
であるという問題点があった。[Problems to be Solved by the Invention] In the above-described conventional technology, in reality, it is rare that both of the two boards appear on the surface so that both boards can be checked after connection, and one board cannot be checked. Even if it is possible, since it is difficult to check the other substrate, there is a problem that it is difficult to measure the reliability of the continuity of the connecting portion.
本発明は、このような問題点を解決しようとするもの
である。すなわち、本発明は、２つの基板間の導通と非
導通を容易に確認することができる基板間の電気的コネ
クト構造を提供することを目的とするものである。The present invention is intended to solve such a problem. That is, it is an object of the present invention to provide an electrical connection structure between substrates that allows easy confirmation of conduction and non-conduction between two substrates.
［課題を解決するための手段］ 上記目的を達成するために、本発明は、両者のコネク
トパターンの面接触によって第１の基板と第２の基板の
間の導通を行なう基板間の電気的コネクト構造におい
て、前記第１の基板に形成されて前記第２の基板のパタ
ーンと導通されるコネクトパターンが２つに分断されて
いて、２つに分断されている前記コネクトパターンの一
方である第１のコネクトパターンが電気回路に、他方で
ある第２のコネクトパターンがチェック用のパットに、
それぞれ、接続されており、前記第２の基板には面接触
によって前記第１のコネクトパターンと第２のコネクト
パターンの両方に接触する第３のコネクトパターンが形
成されているものとした。[Means for Solving the Problems] In order to achieve the above-mentioned object, the present invention provides an electrical connection between substrates in which electrical continuity is established between a first substrate and a second substrate by surface contact between both connection patterns. In the structure, a connect pattern formed on the first substrate and electrically connected to the pattern of the second substrate is divided into two, and one of the connect patterns is divided into two. The connect pattern of is the electric circuit, the second connect pattern of the other is the check pad,
It is assumed that they are connected to each other and a third connect pattern is formed on the second substrate so as to come into contact with both the first connect pattern and the second connect pattern by surface contact.
［作用］ 本発明によれば、コネクト後に表面に出ていてチェッ
クが可能な第１の基板に形成されたコネクト部のコネク
トパターンが２つに分断されていて、その一方である第
１のコネクトパターンが電気回路に、他方である第２の
コネクトパターンが信号をチェックするためのチェック
パットに接続されており、第２の基板には面接触によっ
て前記第１のコネクトパターンと第２のコネクトパター
ンの両方に接触する第３のコネクトパターンが形成され
ているので、前記両基板がコネクトにより導通が成立す
ることで、前記チェックパットから信号のチェックがで
きると同時に、２つの基板間の導通の確認も可能とな
る。[Operation] According to the present invention, the connect pattern of the connect portion formed on the first substrate that is exposed on the surface after connection and can be checked is divided into two, and one of them is the first connect. The pattern is connected to an electric circuit and the other second connect pattern is connected to a check pad for checking a signal, and the second connect pattern is connected to the second substrate by surface contact. Since the third connect pattern is formed so as to be in contact with both of the substrates, the connection between the both substrates establishes the connection, so that the signal can be checked from the check pad and the conduction between the two substrates can be confirmed. Will also be possible.
［実施例］ 第１図は本発明の一実施例を示したもので、１はコネ
クト部を下から押える地板で、位置決め用ダボ1aを有す
る。２は第１の基板、３は第２の基板で、両基板2,3と
も、それぞれ位置決め用穴2a,3aと、コネクトされる相
手の基板に対する面にコネクト部2b,3bを有し、さら
に、第１の基板２はチェックパット2cおよびコネクト部
2bとチェックパット2cを電気的につなぐスルーホール2d
を有している。また４はコネクト部を上から弾力的に押
すシリコンゴム、５はコネクト部を押さえる押え板、６
はコネクト部を締付けるビスである。[Embodiment] FIG. 1 shows an embodiment of the present invention, in which reference numeral 1 is a base plate for pressing the connecting portion from below, which has a positioning dowel 1a. Reference numeral 2 is a first board, 3 is a second board, and both boards 2 and 3 have positioning holes 2a and 3a, respectively, and connecting portions 2b and 3b on the surface with respect to the mating board. , The first board 2 is a check pad 2c and a connecting portion
Through hole 2d for electrically connecting 2b and check pad 2c
have. Further, 4 is a silicone rubber that elastically pushes the connecting portion from above, 5 is a holding plate that holds down the connecting portion, 6
Is a screw for tightening the connect portion.
第２図は第１の基板２のパターンの詳細を示したもの
で、前記コネクトパターン2bは、電気回路につながる一
方のコネクトパターン2b1と、スルーホール2dを通して
チェックパット2cにつながる他方のコネクトパターン2b
2に分断されている。FIG. 2 shows the details of the pattern of the first substrate 2. The connect pattern 2b is one connect pattern 2b 1 connected to an electric circuit and the other connect pattern connected to the check pad 2c through the through hole 2d. 2b
Divided into two .
図示のように構成された基板間の電気的コネクト構造
においては、２つの基板2,3の間でコネクトが行なわれ
ていないとき、第１の基板２に形成された２つのコネク
トパターン2b1,2b2は電気的につながれていない。しか
し、第２の基板３とコネクトされ、導通がなされると、
一方のコネクトパターン2b1とコネクト部3b、他方のコ
ネクトパターン2b2とコネクト部3bが導通することで、
両コネクトパターン2b1,2b2の導通がはかれる。コネク
ト後、第１の基板２に形成されたチェックパット2cにピ
ン等をあてて、チェックを行なうことにより、信号のチ
ェックと同時に、コネクト部での導通が確認できる。In the electrical connection structure between the substrates configured as shown, when the two substrates 2 and 3 are not connected to each other, the two connection patterns 2b 1 on the first substrate 2 are formed. 2b 2 is not electrically connected. However, when connected to the second substrate 3 and made conductive,
By connecting one connect pattern 2b 1 and the connect part 3b, and the other connect pattern 2b 2 and the connect part 3b,
The two connection patterns 2b 1 and 2b 2 are electrically connected. After connection, by applying a pin or the like to the check pad 2c formed on the first substrate 2 to perform the check, it is possible to check the signal and the continuity at the connect portion at the same time.
［発明と実施例の対応］ 以上の実施例において、２が第１の基板、３が第２の
基板であるが、2b1が本発明の第１のコネクトパターン
に2b2が同じく第２のコネクトパターンに、3bが同じく
第３のコネクトパターンに相当する。In the above embodiment [correspondence invention Example, 2 first substrate, although 3 is a second substrate, 2b 1 is first connect patterns 2b 2 also second of the present invention The connect pattern 3b similarly corresponds to the third connect pattern.
［発明の効果］ 以上説明したように、本発明によれば、第１の基板の
コネクト部のコネクトパターンが２つに分断されてい
て、その一方である第１のコネクトパターンが電気回路
に、他方である第２のコネクトパターンがチェックパッ
トに、それぞれ、接続されており、第２の基板には面接
触によって前記第１のコネクトパターンと第２のコネク
トパターンの両方に接触する第３のコネクトパターンが
形成されているので、そのチェックパットをチェックす
るだけで、信号のチェックと同時に、２つの基板間の導
通の確認が可能である。[Effects of the Invention] As described above, according to the present invention, the connect pattern of the connect portion of the first substrate is divided into two, and the first connect pattern, which is one of them, is used in an electric circuit. The second connect pattern, which is the other one, is connected to the check pad, respectively, and the third connect is in contact with both the first connect pattern and the second connect pattern by surface contact with the second substrate. Since the pattern is formed, it is possible to check the signal and the conduction between the two substrates at the same time by checking the check pad.
第１図は本発明の一実施例を示した分解斜視図、第２図
は第１の基板に形成されたコネクトパターンの説明図で
ある。 １……地板、２……第１の基板、 2b……コネクト部、 2b1,2b2……コネクトパターン、 2c……チェックパット、３……第２の基板、 3b……コネクト部、４……シリコンゴム、 ５……押さえ板、６……ビス。FIG. 1 is an exploded perspective view showing an embodiment of the present invention, and FIG. 2 is an explanatory view of a connect pattern formed on a first substrate. 1 ... ground plate, 2 ... first substrate, 2b ... connecting part, 2b 1 , 2b 2 ... connecting pattern, 2c ... check pad, 3 ... second substrate, 3b ... connecting part, 4 …… Silicon rubber, 5 …… Pressing plate, 6 …… Screw.
Claims (1)
第１の基板と第２の基板の間の導通を行なう基板間の電
気的コネクト構造において、前記第１の基板に形成され
て前記第２の基板のパターンと導通されるコネクトパタ
ーンが２つに分断されていて、２つに分断されている前
記コネクトパターンの一方である第１のコネクトパター
ンが電気回路に、他方である第２のコネクトパターンが
チェック用のパットに、それぞれ、接続されており、前
記第２の基板には面接触によって前記第１のコネクトパ
ターンと第２のコネクトパターンの両方に接触する第３
のコネクトパターンが形成されていることを特徴とする
基板間の電気的コネクト構造。1. An electrical connection structure between substrates, wherein electrical continuity between a first substrate and a second substrate is established by surface contact of both connection patterns, and the second substrate is formed on the first substrate. The connect pattern that is electrically connected to the pattern of the substrate is divided into two, the first connect pattern that is one of the two connect patterns that is divided into two is an electric circuit, and the second connect pattern that is the other Are connected to the check pads, respectively, and the third substrate is in contact with both the first connect pattern and the second connect pattern by surface contact with the second substrate.
An electrical connection structure between substrates, wherein the connection pattern is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63057250A JP2543126B2 (en) | 1988-03-10 | 1988-03-10 | Electrical connection structure between boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63057250A JP2543126B2 (en) | 1988-03-10 | 1988-03-10 | Electrical connection structure between boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01230287A JPH01230287A (en) | 1989-09-13 |
| JP2543126B2 true JP2543126B2 (en) | 1996-10-16 |
Family
ID=13050280
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63057250A Expired - Fee Related JP2543126B2 (en) | 1988-03-10 | 1988-03-10 | Electrical connection structure between boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2543126B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2595652B2 (en) * | 1988-05-16 | 1997-04-02 | ミノルタ株式会社 | Structure for mounting printed circuit boards on equipment |
| JP2003069182A (en) * | 2001-08-29 | 2003-03-07 | Canon Inc | Connector |
-
1988
- 1988-03-10 JP JP63057250A patent/JP2543126B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01230287A (en) | 1989-09-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |