JP2533689B2 - Method for manufacturing multilayer circuit board - Google Patents
Method for manufacturing multilayer circuit boardInfo
- Publication number
- JP2533689B2 JP2533689B2 JP2402109A JP40210990A JP2533689B2 JP 2533689 B2 JP2533689 B2 JP 2533689B2 JP 2402109 A JP2402109 A JP 2402109A JP 40210990 A JP40210990 A JP 40210990A JP 2533689 B2 JP2533689 B2 JP 2533689B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- prepreg
- resin
- layer circuit
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、インナービアホールを
形成した多層回路板の製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a multilayer circuit board having inner via holes.
【０００２】[0002]
【従来の技術】近年、プリント回路板について配線の高
密度化、高性能化等の要求が強くなっており、回路の多
層化が進んでいる。このように回路の多層化が進むと、
各層間の回路の接続は回路板の表裏に貫通するスルーホ
ールだけでは確保することができず、インナービアホー
ルによっても接続をおこなう必要がある。2. Description of the Related Art In recent years, there has been an increasing demand for higher density wiring and higher performance of printed circuit boards, and the multilayering of circuits is progressing. In this way, as the number of circuits increases,
The connection of the circuits between the layers cannot be ensured only by the through holes penetrating the front and back of the circuit board, and it is necessary to make the connection also by the inner via holes.
【０００３】図３は多層回路板Ａの一例を示すものであ
り、多層回路板Ａの表裏に貫通するスルーホールＢを設
けると共に内層ＣにインナービアホールＤを設け、スル
ーホールＢの内周に設けたメッキ層Ｇで外層Ｅ及び一部
の内層Ｃに形成した回路Ｆを電気的に導通接続し、また
インナービアホールＤの内周のメッキ層Ｈでこのインナ
ービアホールＤを設けた内層Ｃに形成した回路Ｆ同士を
導通接続するようにしてある。FIG. 3 shows an example of the multilayer circuit board A. Through holes B penetrating the front and back of the multilayer circuit board A are provided, an inner via hole D is provided in an inner layer C, and the inner periphery of the through hole B is provided. The circuit F formed on the outer layer E and part of the inner layer C is electrically connected by the plated layer G, and the inner layer C provided with the inner via hole D is formed by the plated layer H on the inner periphery of the inner via hole D. The circuits F are electrically connected to each other.
【０００４】そして上記のようなインナービアホールを
有する多層回路板の製造は、ビアホール（スルーホール
と称されることもある）を表裏に貫通させて設けた内層
回路板にプリプレグを介して他の内層回路板や外層回路
板、金属箔等の積層材を重ね、これを加熱加圧して多層
成形することによっておこなうことができる。[0006] In order to manufacture the multilayer circuit board having the inner via holes as described above, the inner layer circuit board provided with the via holes (also referred to as through holes) penetrating the front and back sides is provided with another inner layer through the prepreg. It can be performed by stacking laminated materials such as a circuit board, an outer layer circuit board, and a metal foil, and heating and pressing the laminated materials to form a multilayer.
【０００５】[0005]
【発明が解決しようとする課題】しかしこのようにして
多層回路板を製造するにあたって、内層回路板のビアホ
ール内には加熱加圧成形をおこなう際にプリプレグの樹
脂が溶融流動して充填されることになるが、プリプレグ
からビアホールに流れる樹脂量が不足するとビアホール
内に空隙が発生するおそれがある。そしてこのように空
隙が発生すると完成された多層回路板の耐熱性等に問題
が生じるものである。すなわち、多層回路板を製造する
工程で半田付け等の際に高温（約２６０〜３００℃）が
作用することになるが、多層回路板の内部に空隙が存在
するとこの部分でフクレ等の欠陥が生じることになるの
である。However, in manufacturing a multilayer circuit board in this way, the resin of the prepreg is melted and fluidized and filled in the via hole of the inner layer circuit board during heat and pressure molding. However, if the amount of resin flowing from the prepreg into the via hole is insufficient, voids may occur in the via hole. When such voids are generated, a problem occurs in heat resistance and the like of the completed multilayer circuit board. That is, a high temperature (about 260 to 300 ° C.) acts during soldering or the like in the process of manufacturing a multilayer circuit board, but if voids are present inside the multilayer circuit board, defects such as blisters occur at this portion. It will happen.
【０００６】本発明は上記の点に鑑みてなされたもので
あり、耐熱性に優れた多層回路板の製造方法を提供する
ことを目的とするものである。The present invention has been made in view of the above points, and an object thereof is to provide a method for manufacturing a multilayer circuit board having excellent heat resistance.
【０００７】[0007]
【課題を解決するための手段】本発明に係る多層回路板
の製造方法は、ビアホール１を設けた内層回路板２に複
数枚のプリプレグ３を介して他の内層回路板や外層回路
板、金属箔等の積層材４を重ね、これを加熱加圧して多
層成形することによってビアホール１にプリプレグ３の
樹脂を充填させた多層回路板を製造するにあたって、上
記複数枚のプリプレグ３のうち内層回路板２に接するよ
う配置されるプリプレグ３ａとしてガラス不織布を基材
とすると共に溶融粘度が５０００ＰＳ以下の樹脂を含浸
して作成されたものを用い、上記複数枚のプリプレグ３
のうち他のプリプレグ３ｂとしてガラス織布を基材とす
ると共に溶融粘度が上記内側のプリプレグ３ａの樹脂よ
り大きい樹脂を上記内側のプリプレグ３ａよりも小さい
レジンコンテントで含浸して作成されたものを用いるこ
とを特徴とするものである。A method for manufacturing a multilayer circuit board according to the present invention comprises an inner circuit board 2 provided with a via hole 1 and another inner circuit board, an outer circuit board, and a metal via a plurality of prepregs 3. When manufacturing a multilayer circuit board in which the via holes 1 are filled with the resin of the prepreg 3 by laminating laminated materials 4 such as foils and heating and pressing the layers, an inner layer circuit board among the plurality of prepregs 3 is prepared. As the prepreg 3a arranged so as to be in contact with 2, a glass prepreg made of a non-woven fabric is impregnated with a resin having a melt viscosity of 5000 PS or less.
Among the other prepregs 3b, a prepreg 3b made of a glass woven fabric and impregnated with a resin having a melt viscosity larger than that of the resin of the inner prepreg 3a with a resin content smaller than that of the inner prepreg 3a is used. It is characterized by that.
【０００８】以下、本発明を詳細に説明する。内層回路
板２としては常法で作成されたものを用いることができ
る。すなわち、ガラス基材等にエポキシ樹脂やポリイミ
ド樹脂、トリアジン樹脂等の熱硬化性樹脂を含浸乾燥し
て調製したプリプレグを複数枚重ねると共にその両側に
銅箔等の金属箔を重ねて加熱加圧成形することによっ
て、金属箔張り積層板を作成し、この金属箔をエッチン
グ加工等して表裏面に回路１０の形成をおこなうことに
よって内層回路板２を作成することができる。そして本
発明ではビアホール１を設けた内層回路板２を用いる。
ビアホール１は内層回路板２の表裏に貫通するように形
成されているものであり、その内周にはスルーホールメ
ッキ処理によってメッキ層１１を設けて表裏の回路１０
を導通接続するようにしてある。The present invention will be described in detail below. As the inner layer circuit board 2, one prepared by a conventional method can be used. That is, a plurality of prepregs prepared by impregnating and drying a glass substrate or the like with a thermosetting resin such as an epoxy resin, a polyimide resin, or a triazine resin are piled up, and metal foils such as copper foils are piled on both sides of the prepreg to heat and press mold By doing so, the metal foil-clad laminate is prepared, and the inner layer circuit board 2 can be prepared by forming the circuit 10 on the front and back surfaces by etching the metal foil. In the present invention, the inner layer circuit board 2 provided with the via hole 1 is used.
The via hole 1 is formed so as to penetrate the front and back surfaces of the inner layer circuit board 2, and a plating layer 11 is provided on the inner periphery of the inner layer circuit board 2 by through hole plating to form the circuit 10 on the front and back surfaces.
Are electrically connected.
【０００９】上記のようにビアホール１を設けた内層回
路板２を用いて多層回路板を製造するにあたっては、図
１に示すように名内層回路板２の表裏両面に複数枚のプ
リプレグ３を重ねると共にこのプリプレグ３を介して積
層材４を重ねる。積層材４としては、他の内層回路板や
外層回路板、銅箔等の金属箔などを用いることができ
る。When manufacturing a multilayer circuit board using the inner layer circuit board 2 provided with the via holes 1 as described above, a plurality of prepregs 3 are stacked on both front and back surfaces of the name inner layer circuit board 2 as shown in FIG. Along with this prepreg 3, the laminated material 4 is stacked. As the laminated material 4, other inner layer circuit boards, outer layer circuit boards, metal foils such as copper foils, and the like can be used.
【００１０】プリプレグ３としては、基材にエポキシ樹
脂やポリイミド樹脂、トリアジン樹脂等の熱硬化性樹脂
を含浸乾燥して作成したものを用いることができるが、
本発明ではこの複数枚のプリプレグ３のうち、内層回路
板２に接するよう配置されるプリプレグ３ａは、基材と
してガラス不織布を用いてこのガラス不織布に上記熱硬
化性樹脂のワニスを含浸乾燥して作成したものを使用す
る。プリプレグ３の基材としては一般的にガラス織布が
使用されるが、ガラス織布はガラス繊維の糸を織成して
形成されているために布の組織が緻密であって樹脂を多
量に含浸させることが難しく、また加圧されてもガラス
織布はあまり圧縮されないために含浸された樹脂は容易
に流れ出していかないが、これに対してガラス不織布は
ガラス繊維が絡み合った状態の組織で織成されていない
ために布の組織は粗の状態にあり、樹脂を多量に含浸さ
せることが容易であると共に、ガラス不織布は加圧され
ると容易に圧縮されるために含浸された樹脂は容易に流
れ出していくものである。このプリプレグ３ａのガラス
不織布基材としては単重が２０〜１５０g/m2の範囲のも
のが好ましく、樹脂の含浸量はガラス不織布７０ｇに対
して樹脂固形分で８０〜２００ｇ程度の範囲が好まし
い。従ってプリプレグ３ａはレジンコテントが５０重量
％以上になるように多量の樹脂を含浸して作成するのが
好ましい。またこのプリプレグ３ａに含浸する樹脂はそ
の溶融粘度が５０〜５０００ＰＳ（ポイズ：測定温度１
３０℃−以下同じ）、特に１００〜３０００ＰＳの範囲
になるように調整するのが好ましく、溶融粘度は少なく
とも５０００ＰＳ以下に設定するのが良い。またこのプ
リプレグ３ａの樹脂にはガラス粉や水酸化アルミニウム
などの無機質充填剤を配合することができる。樹脂に無
機質充填剤を配合してもガラス不織布の基材には容易に
含浸させることができるものであり、７０ｇのガラス不
織布基材に対して無機質充填剤は４０〜１５０ｇ程度の
範囲で使用するのが好ましい。As the prepreg 3, a prepreg prepared by impregnating and drying a base material with a thermosetting resin such as an epoxy resin, a polyimide resin, or a triazine resin can be used.
In the present invention, among the plurality of prepregs 3, the prepreg 3a arranged so as to be in contact with the inner layer circuit board 2 uses a glass non-woven fabric as a base material and impregnates the glass non-woven fabric with the varnish of the thermosetting resin to dry it. Use the created one. A glass woven cloth is generally used as a base material of the prepreg 3, but since the glass woven cloth is formed by weaving glass fiber threads, the cloth has a dense structure and is impregnated with a large amount of resin. However, the impregnated resin does not flow out easily because the woven glass fabric is not compressed so much even when pressed, whereas the non-woven glass fabric is woven with a structure in which glass fibers are entangled. Since the structure of the cloth is coarse, it is easy to impregnate a large amount of resin, and the glass nonwoven fabric is easily compressed when pressed, so the impregnated resin flows out easily. It is something that goes. The glass nonwoven fabric base material of the prepreg 3a preferably has a unit weight in the range of 20 to 150 g / m 2 , and the resin impregnation amount is preferably in the range of 80 to 200 g in terms of resin solid content with respect to 70 g of the glass nonwoven fabric. Therefore, the prepreg 3a is preferably made by impregnating a large amount of resin so that the resin content is 50% by weight or more. The resin with which the prepreg 3a is impregnated has a melt viscosity of 50 to 5000 PS (poise: measurement temperature 1
30 ° C.-same as below), particularly preferably adjusted to be in the range of 100 to 3000 PS, and the melt viscosity is preferably set to at least 5000 PS or less. Further, the resin of the prepreg 3a may be blended with an inorganic filler such as glass powder or aluminum hydroxide. Even if the resin is mixed with an inorganic filler, the glass non-woven fabric substrate can be easily impregnated, and the inorganic filler is used in the range of 40 to 150 g per 70 g of the glass non-woven fabric substrate. Is preferred.
【００１１】また、上記複数枚のプリプレグ３のうち、
内層回路板２に接するよう配置されるプリプレグ３ａ以
外のプリプレグ３ｂは、その基材としてガラス不織布を
用いて作成したものを使用する必要はなく、ガラス織布
を基材として作成されたものを用いることができる。そ
して内層回路板２に接するよう配置されるプリプレグ３
ａは、そのレジンコンテントがそれ以外のプリプレグ３
ｂよりも高く且つその含浸樹脂の溶融粘度がそれ以外の
プリプレグ３ｂよりも小さいものを用いるものである。Of the plurality of prepregs 3 described above,
The prepreg 3b other than the prepreg 3a arranged so as to be in contact with the inner layer circuit board 2 does not need to be made of a glass nonwoven fabric as a base material thereof, but is made of a glass woven fabric as a base material. be able to. And the prepreg 3 arranged so as to contact the inner circuit board 2
a is a prepreg 3 whose resin content is other than that.
The prepreg 3b having a melt viscosity higher than that of b and a melt viscosity of the impregnated resin is smaller than that of the other prepregs 3b.
【００１２】しかしてこのように内層回路板２に複数枚
のプリプレグ３を介して積層材４を重ねた後に、これを
加熱加圧して多層積層成形することによって、図２のよ
うな、プリプレグ３によるボンディング層１２で内層回
路板２に積層材４を積層して多層に回路形成をした多層
回路板Ａを得ることができるものであり、多層回路板Ａ
の層内には内層回路板２に設けたビアホール１でインナ
ービアホールが形成されるものである。そして図２に示
すようにインナービアホールとなるビアホール１内には
プリプレグ３から流れ出る溶融樹脂が流入し、樹脂５で
充填されて埋められるものである。ここで、本発明で
は、複数枚のプリプレグ３のうち内層回路板２に接する
よう配置されるプリプレグ３ａとしてガラス不織布を基
材として作成したものを用いており、ガラス不織布には
多量の樹脂を含浸させてプリプレグ３ａのレジンコンテ
ントを高く形成することができるために、積層成形時に
内層回路板２に接するプリプレグ３ａからは多量の樹脂
がビアホール１に供給されることになり、ビアホール１
内を樹脂５で良好に充填させることができるものであ
る。特に内層回路板２に接するこのプリプレグ３ａの含
浸樹脂の溶融粘度を５０００ＰＳ以下に低く調整してお
くことによって、積層成形時に樹脂は容易に流動してビ
アホール１内に容易に流入するとになる。従って、イン
ナービアホールとなるビアホール１の部分において多層
回路板Ａ内に空隙部が生じることを防ぐことができ、空
隙の存在による半田の際のフクレの発生を防止すると共
に耐熱性を高めることができるものである。Thus, after stacking the laminated material 4 on the inner-layer circuit board 2 via the plurality of prepregs 3 and then heating and pressing the laminated material 4 to form a multi-layer laminate, the prepreg 3 as shown in FIG. It is possible to obtain the multilayer circuit board A in which the multilayer material 4 is laminated on the inner layer circuit board 2 by the bonding layer 12 according to
The inner via hole is formed by the via hole 1 provided in the inner layer circuit board 2 in the layer. Then, as shown in FIG. 2, the molten resin flowing out from the prepreg 3 flows into the via hole 1 serving as an inner via hole, and is filled and filled with the resin 5. Here, in the present invention, a prepreg 3a arranged so as to be in contact with the inner layer circuit board 2 among the plurality of prepregs 3 is made of a glass nonwoven fabric as a base material, and the glass nonwoven fabric is impregnated with a large amount of resin. Therefore, since the resin content of the prepreg 3a can be formed high, a large amount of resin is supplied to the via hole 1 from the prepreg 3a which is in contact with the inner layer circuit board 2 during the lamination molding.
The inside can be satisfactorily filled with the resin 5. Particularly, by adjusting the melt viscosity of the impregnated resin of the prepreg 3a in contact with the inner layer circuit board 2 to be 5000 PS or less, the resin easily flows during the laminating and molding and easily flows into the via hole 1. Therefore, it is possible to prevent a void portion from being formed in the multilayer circuit board A in the portion of the via hole 1 which is an inner via hole, to prevent generation of blisters during soldering due to the presence of the void and to improve heat resistance. It is a thing.
【００１３】尚、複数枚のプリプレグ３のうち、内層回
路板２に接しないプリプレグ３ｂも内層回路板２に接す
るプリプレグ３ａと同じようにガラス不織布を基材とし
て作成してレジンコンテントを高くすると、各プリプレ
グ３の全体から多量の樹脂が流出して多層回路板Ａに板
厚のばらつきが発生することになり、また場合によって
は多量の樹脂の流れで成形時に積層の位置ずれ不良が発
生することになるために、好ましくない。また、プリプ
レグ３ａで内層回路板２の表裏両面を挟むようにして積
層することによって、樹脂５によるビアホール１の充填
は一層良好になる。Of the plurality of prepregs 3, the prepreg 3b not in contact with the inner layer circuit board 2 is made of glass non-woven fabric as the base material in the same manner as the prepreg 3a in contact with the inner layer circuit board 2 to increase the resin content. A large amount of resin flows out from the entire prepreg 3 to cause variations in the board thickness of the multilayer circuit board A, and in some cases, a large amount of resin flow may cause misalignment of lamination during molding. Is not preferable. Moreover, by filling the inner layer circuit board 2 with both sides of the inner layer circuit board sandwiched by the prepreg 3a, the filling of the via hole 1 with the resin 5 is further improved.
【００１４】[0014]
【実施例】次に、本発明を実施例によって例証する。実施例１ 直径０．９mmのビアホール１を設けたエポキ
シ樹脂系の厚み０．２mmの内層回路板２を用い、図１の
ように、この内層回路板２の表面と裏面にそれぞれ３枚
づつプリプレグ３を重ねると共にさらにその外側に銅箔
４を重ねた。ここで内層回路板２に接するプリプレグ３
ａは、基材として日本バイリーン社製ガラス不織布（単
量７５g/m2）を用い、溶融粘度を３００ＰＳに調整する
ようにエポキシ樹脂（油化シェル社製エピコート５０５
１Ｆ−硬化剤ジシアンジアミド−）を含浸させて、ガラ
ス不織布７５g/m2に対して２００g/m2（レジンコンテン
ト７４重量％）付着させて調製したものを用いた。また
他の２枚のプリプレグ３ｂは基材として日東紡績社製ガ
ラス織布ＷＥ１１６Ｅ（単量１０４g/m2）を用い、溶融
粘度を５００ＰＳに調整するようにエポキシ樹脂を含浸
させて、レジンコンテント５０重量％に調製したものを
用いた。そしてこれを１７０℃、３０kg/cm2、９０分の
条件で加熱加圧して多層成形することによって、多層回
路板を得た。The invention will now be illustrated by the examples. Example 1 Using an epoxy resin-based inner layer circuit board 2 having a thickness of 0.2 mm provided with a via hole 1 having a diameter of 0.9 mm, as shown in FIG. 3 was piled up and copper foil 4 was further piled up on the outer side. Here, the prepreg 3 in contact with the inner layer circuit board 2
a is used in Japan Vilene Co., Ltd. nonwoven glass fabric (monomer 75 g / m 2) as a substrate, an epoxy resin so as to adjust the melt viscosity 300PS (Yuka Shell Co., Ltd. Epikote 505
1F-curing agent dicyandiamide-) was impregnated, and 200 g / m 2 (resin content 74% by weight) was adhered to 75 g / m 2 of glass non-woven fabric. The other two prepregs 3b were made of Nitto Boseki's glass woven fabric WE116E (unit weight 104 g / m 2 ), impregnated with epoxy resin so as to adjust the melt viscosity to 500 PS, and resin content 50. What was adjusted to weight% was used. Then, this was heated and pressed under the conditions of 170 ° C., 30 kg / cm 2 and 90 minutes to perform multi-layer molding to obtain a multi-layer circuit board.
【００１５】実施例２ 内層回路板２の表面と裏面にそ
れぞれ４枚づつプリプレグ３を重ねるようにし、内層回
路板２側の２枚をプリプレグ３ａとしてガラス不織布基
材で作成したものを用いると共に他の２枚をプリプレグ
３ｂとしてガラス織布基材で作成したものを用いるよう
にした他は、実施例１と同様にして多層回路板を得た 。 実施例３ エポキシ樹脂にガラス粉を混合して用
い、内層回路板２に接するプリプレグ３ａとして、ガラ
ス不織布７５g/m2に対してエポキシ樹脂を２００g/m2、
ガラス粉を１５０g/m2付着させて調製したものを使用す
るようにした他は、実施例１と同様にして多層回路板を
得た。 Example 2 Four prepregs 3 were stacked on each of the front surface and the back surface of the inner layer circuit board 2, and two pieces on the inner layer circuit board 2 side were used as the prepregs 3a made of a glass non-woven fabric substrate. A multilayer circuit board was obtained in the same manner as in Example 1 except that two prepregs 3b made of a glass woven fabric base material were used. Example 3 Epoxy resin using a mixture of glass powder, as a prepreg 3a in contact with the inner layer circuit board 2, 200 g / m 2 of epoxy resin to the glass non-woven fabric 75 g / m 2,
A multilayer circuit board was obtained in the same manner as in Example 1 except that the glass powder prepared by depositing 150 g / m 2 was used.
【００１６】実施例４ 含浸樹脂としてエポキシ樹脂を
用いる代わりに、ポリイミド樹脂を用いるようにして作
成したプリプレグ３ａ，３ｂを使用するようにし、さら
に多層積層条件を２００℃、４０kg/cm2、９０分に設定
するようにした他は、実施例１と同様にして多層回路板
を得た。比較例１ 内層回路板２の表面と裏面にそれぞれ３枚づ
つ重ねるプリプレグ３として、全てガラス織布を基材と
したエポキシ樹脂のプリプレグ３ｂを用いるようにした
他は、実施例１と同様にして多層回路板を得た。 Example 4 Instead of using an epoxy resin as the impregnating resin, prepregs 3a and 3b prepared by using a polyimide resin were used, and the multilayer lamination conditions were 200 ° C., 40 kg / cm 2 , 90 minutes. A multilayer circuit board was obtained in the same manner as in Example 1 except that the setting was made. Comparative Example 1 The same procedure as in Example 1 was carried out except that an epoxy resin prepreg 3b made of a glass woven fabric was used as the prepreg 3 on each of which the front and back surfaces of the inner-layer circuit board 2 were laminated three by three. A multilayer circuit board was obtained.
【００１７】比較例２ 内層回路板２の表面と裏面にそ
れぞれ３枚づつ重ねるプリプレグ３として、全てガラス
織布を基材としたポリイミド樹脂のプリプレグ３ｂを用
いるようにした他は、実施例４と同様にして多層回路板
を得た。比較例３ 実施例１においてプリプレグ３ａをその含浸
樹脂の溶融粘度が６０００ＰＳになるように調製するよ
うにした他は、実施例１と同様にして多層回路板を得
た。COMPARATIVE EXAMPLE 2 Except that the prepreg 3 made of a glass woven fabric as a base material was used as the prepreg 3 on each of the front surface and the back surface of the inner-layer circuit board 2 in the same manner as in the fourth embodiment. A multilayer circuit board was obtained in the same manner. Comparative Example 3 A multilayer circuit board was obtained in the same manner as in Example 1 except that the prepreg 3a was prepared so that the impregnated resin had a melt viscosity of 6000 PS.
【００１８】上記のように実施例１〜４及び比較例１〜
３で得た多層回路板について、インナービアホールの空
隙発生率、オーブン耐熱温度を測定すると共に半田工程
でのフクレ不良の発生率を調べた。結果を次表に示す。As described above, Examples 1 to 4 and Comparative Examples 1 to 1
With respect to the multilayer circuit board obtained in 3, the void generation rate of the inner via hole and the oven heat-resistant temperature were measured, and the occurrence rate of blister defects in the soldering process was examined. The results are shown in the table below.
【００１９】[0019]
【表１】 [Table 1]
【００２０】表にみられるように、内層回路板２に接す
るように配置されるプリプレグ３ａをガラス不織布を基
材として作成して樹脂の含有量を高くすることによっ
て、インナービアホールに空隙が発生することを低減し
て耐熱性を高めることができると共にフクレ不良の発生
率を低減できることが確認される。また比較例３にみら
れるように、内層回路板２に接するように配置されるプ
リプレグ３ａの含浸樹脂の溶融粘度が高いと空隙が発生
し易くなって耐熱性が低下すると共にフクレ不良が発生
し易くなることも確認される。As can be seen from the table, a void is generated in the inner via hole by making the prepreg 3a arranged so as to be in contact with the inner layer circuit board 2 with a glass non-woven fabric as a base material to increase the resin content. It is confirmed that the heat resistance can be improved by reducing the above-mentioned problems and the occurrence rate of blistering defects can be reduced. Further, as seen in Comparative Example 3, when the melt viscosity of the impregnated resin of the prepreg 3a arranged so as to be in contact with the inner layer circuit board 2 is high, voids are easily generated, heat resistance is deteriorated, and blistering defects occur. It is also confirmed that it will be easier.
【００２１】[0021]
【発明の効果】上記のように本発明は、内層回路板に接
するよう配置されるプリプレグとしてガラス不織布を基
材として樹脂含浸して作成されたものを用いるようにし
たので、ガラス不織布は組織が粗であってこのガラス不
織布を基材とするプリプレグは樹脂を多量に含浸させる
ことが容易であると共に含浸された樹脂は加圧されると
容易に流れ出していくものであって、内層回路板に接す
るこのプリプレグからは多量の樹脂がビアホールに供給
されてビアホール内に良好に充填されることになり、し
かもこの内層回路板に接するよう配置されるプリプレグ
として溶融粘度が５０００ＰＳ以下の樹脂を含浸して作
成されたものを用いるようにしたので、この溶融粘度の
樹脂は積層成形時に容易に流動してプリプレグからビア
ホールに容易に流入してビアホール内に良好に充填され
ることになり、インナービアホールとなるビアホールの
部分において多層回路板内に空隙部が生じることを防ぐ
ことができ、空隙の存在による半田の際のフクレの発生
を防止すると共に耐熱性を高めることができるものであ
る。しかも、上記複数枚のプリプレグのうち他のプリプ
レグとしてガラス織布を基材とすると共に溶融粘度が上
記内側のプリプレグの樹脂より大きい樹脂を上記内側の
プリプレグよりも小さいレジンコンテントで含浸して作
成されたものを用いるようにしたので、内側のプリプレ
グの樹脂は積層成形時に容易に流動するものの、総ての
プリプレグの樹脂の流動が過剰に大きくならないように
することができ、積層成形時に多量の樹脂が流出するこ
とを防いで板厚にばらつきが発生したり積層の位置ずれ
が発生したりすることを防止することができるものであ
る。As described above, according to the present invention, as the prepreg arranged so as to be in contact with the inner layer circuit board, the one prepared by impregnating the glass non-woven fabric with the resin is used. The prepreg, which is rough and uses this glass nonwoven fabric as a base material, is easy to impregnate a large amount of resin, and the impregnated resin easily flows out when pressure is applied to the inner circuit board. A large amount of resin is supplied from the contacting prepreg to the via hole and the via hole is well filled, and the prepreg arranged so as to be in contact with the inner layer circuit board is impregnated with a resin having a melt viscosity of 5000 PS or less. Since the one prepared was used, the resin of this melt viscosity easily flows during the lamination molding and flows easily from the prepreg to the via hole. As a result, it is possible to prevent the formation of voids in the multilayer circuit board at the portion of the via hole that will be the inner via hole, and to prevent blistering during soldering due to the presence of the voids. It is possible to prevent it and improve heat resistance. Moreover, it is prepared by impregnating a resin having a melt viscosity larger than that of the inner prepreg with a resin content smaller than the inner prepreg while using a glass woven fabric as a base material as another prepreg among the plurality of prepregs. However, since the resin of the inner prepreg easily flows during the lamination molding, it is possible to prevent the flow of the resin of all the prepregs from becoming excessively large. Can be prevented from flowing out, thereby preventing variations in the plate thickness and displacement of the stack.
【図１】本発明の一実施例の多層成形の前の概略断面図
である。FIG. 1 is a schematic cross-sectional view before multilayer molding according to an embodiment of the present invention.
【図２】本発明の一実施例の多層成形後の概略断面図で
ある。FIG. 2 is a schematic cross-sectional view after multilayer molding according to an embodiment of the present invention.
【図３】多層回路板の断面図である。FIG. 3 is a cross-sectional view of a multilayer circuit board.
１ ビアホール ２ 内層回路板 ３ プリプレグ３ａ 内側のプリプレグ ３ｂ 外側のプリプレグ ４ 積層材1 via hole 2 inner layer circuit board 3 prepreg 3a inner prepreg 3b outer prepreg 4 laminated material
Claims (1)
のプリプレグを介して他の内層回路板や外層回路板、金
属箔等の積層材を重ね、これを加熱加圧して多層成形す
ることによってビアホールにプリプレグの樹脂を充填さ
せた多層回路板を製造するにあたって、上記複数枚のプ
リプレグのうち内層回路板に接するよう配置される内側
のプリプレグとしてガラス不織布を基材とすると共に溶
融粘度が５０００ＰＳ以下の樹脂を含浸して作成された
ものを用い、上記複数枚のプリプレグのうち他のプリプ
レグとしてガラス織布を基材とすると共に溶融粘度が上
記内側のプリプレグの樹脂より大きい樹脂を上記内側の
プリプレグのレジンコンテントよりも小さいレジンコン
テントで含浸して作成されたものを用いることを特徴と
する多層回路板の製造方法。1. A laminated material such as another inner layer circuit board, an outer layer circuit board, and a metal foil is laminated on an inner layer circuit board provided with a via hole via a plurality of prepregs, and this is heated and pressed to form a multilayer. When manufacturing a multilayer circuit board in which a via hole is filled with a prepreg resin, a glass nonwoven fabric is used as a base material as an inner prepreg arranged so as to contact the inner layer circuit board among the plurality of prepregs, and a melt viscosity is 5000 PS or less. Using a resin impregnated with the resin, a glass woven cloth as a base material is used as another prepreg among the plurality of prepregs, and a resin having a melt viscosity larger than that of the inner prepreg is used as the inner prepreg. Of a multi-layer circuit board characterized by using an impregnated resin content smaller than that of Build method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2402109A JP2533689B2 (en) | 1990-12-14 | 1990-12-14 | Method for manufacturing multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2402109A JP2533689B2 (en) | 1990-12-14 | 1990-12-14 | Method for manufacturing multilayer circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04215497A JPH04215497A (en) | 1992-08-06 |
| JP2533689B2 true JP2533689B2 (en) | 1996-09-11 |
Family
ID=18511923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2402109A Expired - Fee Related JP2533689B2 (en) | 1990-12-14 | 1990-12-14 | Method for manufacturing multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2533689B2 (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54163360A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS54163359A (en) * | 1978-06-16 | 1979-12-25 | Hitachi Ltd | Method of producing multiilayer printed circuit board |
| JPS61174796A (en) * | 1985-01-30 | 1986-08-06 | 新神戸電機株式会社 | Manufacture of multilayer circuit board |
| JPH0212990A (en) * | 1988-06-30 | 1990-01-17 | Shin Kobe Electric Mach Co Ltd | Multilayer printed circuit board |
| JPH02177498A (en) * | 1988-12-28 | 1990-07-10 | Shin Kobe Electric Mach Co Ltd | Multilayer printed wiring board |
-
1990
- 1990-12-14 JP JP2402109A patent/JP2533689B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04215497A (en) | 1992-08-06 |
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