JP2533551Y2 - 半導体ウエハ保持治具 - Google Patents
半導体ウエハ保持治具Info
- Publication number
- JP2533551Y2 JP2533551Y2 JP1988111223U JP11122388U JP2533551Y2 JP 2533551 Y2 JP2533551 Y2 JP 2533551Y2 JP 1988111223 U JP1988111223 U JP 1988111223U JP 11122388 U JP11122388 U JP 11122388U JP 2533551 Y2 JP2533551 Y2 JP 2533551Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- holding
- wall
- semiconductor wafer
- holding groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 13
- 235000013372 meat Nutrition 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 62
- 238000010438 heat treatment Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988111223U JP2533551Y2 (ja) | 1988-08-26 | 1988-08-26 | 半導体ウエハ保持治具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988111223U JP2533551Y2 (ja) | 1988-08-26 | 1988-08-26 | 半導体ウエハ保持治具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0233427U JPH0233427U (enrdf_load_stackoverflow) | 1990-03-02 |
JP2533551Y2 true JP2533551Y2 (ja) | 1997-04-23 |
Family
ID=31349086
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988111223U Expired - Lifetime JP2533551Y2 (ja) | 1988-08-26 | 1988-08-26 | 半導体ウエハ保持治具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2533551Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS516664A (ja) * | 1974-07-05 | 1976-01-20 | Hitachi Ltd | Itajobutsushijijigu |
JPS51161071U (enrdf_load_stackoverflow) * | 1975-06-16 | 1976-12-22 | ||
JPS62201928U (enrdf_load_stackoverflow) * | 1986-06-13 | 1987-12-23 |
-
1988
- 1988-08-26 JP JP1988111223U patent/JP2533551Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0233427U (enrdf_load_stackoverflow) | 1990-03-02 |
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