JP2532852B2 - Nozzle sweep mechanism of liquid application device - Google Patents
Nozzle sweep mechanism of liquid application deviceInfo
- Publication number
- JP2532852B2 JP2532852B2 JP61253695A JP25369586A JP2532852B2 JP 2532852 B2 JP2532852 B2 JP 2532852B2 JP 61253695 A JP61253695 A JP 61253695A JP 25369586 A JP25369586 A JP 25369586A JP 2532852 B2 JP2532852 B2 JP 2532852B2
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- coated
- sweep mechanism
- liquid
- adjusting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
Description
【発明の詳細な説明】 ［発明の分野］ 本発明は、半導体製造プロセスにおけるレジストまた
は現像液等の液体塗布装置に関し、特に被塗布面上での
液体の拡散時間を短縮するためのノズル部の改良に関す
る。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid coating apparatus for a resist or a developing solution in a semiconductor manufacturing process, and more particularly to a nozzle unit for shortening the liquid diffusion time on the surface to be coated. Regarding improvement.
［従来の技術］ 従来の半導体ウエハ上にレジストまたは現像液等の薬
液を塗布する装置においては、ウエハ上方に固定された
ノズルよりウエハの中心部に液体を吐出してウエハ全面
に液体を塗布していた。このような従来の液体塗布装置
においては、ウエハ中心部に滴下された液体自身の拡散
作用によりウエハ全面に液体を分散させて広げていたた
め、液体がウエハ周縁部に均一に達するまでに多くの時
間を要しウエハの処理速度の低下を来していた。また、
特に現像液を塗布する場合、ウエハの中心部と周辺部と
で現像時間の差が生じ、現像したパターン寸法にバラつ
きが生ずるという欠点があった。[Prior Art] In a conventional apparatus for applying a chemical solution such as a resist or a developing solution onto a semiconductor wafer, the liquid is discharged from a nozzle fixed above the wafer to the central portion of the wafer to apply the liquid to the entire surface of the wafer. Was there. In such a conventional liquid coating apparatus, since the liquid is dispersed and spread on the entire surface of the wafer by the diffusing action of the liquid dropped on the central portion of the wafer, it takes a lot of time until the liquid reaches the peripheral portion of the wafer uniformly. Therefore, the processing speed of the wafer is reduced. Also,
In particular, when a developing solution is applied, there is a drawback that a difference in developing time occurs between the central portion and the peripheral portion of the wafer, and the developed pattern dimensions vary.
［発明の目的］ 本発明は前記従来技術の欠点に鑑みなされたものであ
って、ノズルのスイープ機構を設けてノズルを被塗布材
表面に対して移動可能とし液体の広がり時間の短縮を図
ることを目的とし、またこのようなノズルのスイープ運
動の速度、移動範囲等を任意に調整可能としさらにプロ
グラムによる自動制御が可能な液体塗布装置のノズルス
イープ機構の提供を目的とする。[Object of the Invention] The present invention has been made in view of the above-mentioned drawbacks of the prior art, and aims to shorten the liquid spreading time by providing a nozzle sweep mechanism to move the nozzle with respect to the surface of the material to be coated. It is also an object of the present invention to provide a nozzle sweep mechanism of a liquid coating apparatus, which can arbitrarily adjust the speed and movement range of such a nozzle sweep motion and can be automatically controlled by a program.
この目的を達成するため本発明の液体塗布装置のノズ
ルスイープ機構は、被塗布材の表面上に液体を吐出する
ためのノズルと、該ノズルを前記被塗布材の表面に平行
な平面内で移動させるためのノズル移動手段を備え、前
記ノズル移動手段は、前記ノズルを保持し、回転可能な
ノズル保持手段と、モータと、前記モータを支持する支
持プレートと、前記支持プレート上に取り付けられ、前
記モータによって回転する回転板と、前記回転板と前記
ノズル保持手段とをそれぞれの回転中心から離れた連結
位置において連結し、前記回転板の回転運動を前記ノズ
ル保持手段に伝達する連結ロッドと、前記連結ロッドと
ノズル保持手段との連結位置を調整して前記ノズルの回
転移動範囲を調整する範囲調整手段と、前記支持プレー
トの位置を調整して前記ノズル先端の吐出口の位置を調
整する位置調整手段とを具備することを特徴とする。In order to achieve this object, the nozzle sweep mechanism of the liquid coating apparatus of the present invention comprises a nozzle for ejecting liquid onto the surface of the material to be coated, and the nozzle moving in a plane parallel to the surface of the material to be coated. A nozzle moving means for holding the nozzle, wherein the nozzle moving means holds the nozzle, is rotatable, a motor, a support plate for supporting the motor, and is mounted on the support plate. A rotating plate that is rotated by a motor; a connecting rod that connects the rotating plate and the nozzle holding means at a connecting position away from their respective rotation centers; and a connecting rod that transmits the rotational movement of the rotating plate to the nozzle holding means, Adjusting the connecting position between the connecting rod and the nozzle holding means to adjust the rotational movement range of the nozzle, and adjusting the position of the support plate. Characterized by comprising a position adjusting means for adjusting the position of the discharge port of the serial nozzle tip.
これによれば、ノズルを被塗布材の表面に平行な平面
内で移動させるとともにノズルの回転移動範囲およびノ
ズル先端の吐出口の位置を調整できるようにしたため、
どのような大きさの被塗布材に対しても、塗布材は、短
時間で単一に拡散され、塗布される。According to this, since it is possible to move the nozzle in a plane parallel to the surface of the material to be coated and adjust the rotational movement range of the nozzle and the position of the discharge port at the tip of the nozzle
No matter what size the material to be coated, the coating material is uniformly diffused and applied in a short time.
［実施例］ 第１図に本発明の実施例を示す。１は薬液を塗布する
ためのノズルであり、先端に吐出口（図示しない）を有
する管材により構成される。２はノズル１を固定保持す
るためのプレート、３はプレート２の回転軸、４はプレ
ート２を回転軸３を中心に回転運動させるための連結ロ
ッド、５は連結ロッド４の取付位置調整ノブ、６は連結
ロッド４の駆動用円板、７はノズル１の原点設定用のセ
ンサ板、８はセンサ板７を検出するセンサ、９は円板６
を回転駆動するモータ、10は円板６およびモータ９を搭
載固定するための支持プレート、11は支持プレート10の
位置を調整するためのノブ、12は薬液を塗布すべきウエ
ハである。連結ロッド４の一端部はノブ５により回転す
るネジ5aに螺着している。ノブ５の操作によりプレート
２の回転軸３と連結ロッド４との間の距離Ａが変り、ノ
ズル１のスイープ動作の範囲（回転移動範囲）が変る。
この場合、距離Ａを大きくすれば回転範囲は小さくな
り、逆に距離Ａを小さくすると回転範囲は大きくなる。
ノズル１の先端が原点（例えばウエハ12の中心）となる
位置でセンサ８がセンサ板７を検出するようにセンサ８
およびセンサ板７の相互位置を予め設定しておく。支持
プレート10はノブ11により回転するネジ11aに螺着して
いる。ノブ11の操作により支持プレート10はネジ11aに
沿って移動し、これによりノズル１の回転角度を変える
ことなくノズル１の吐出位置を変えることができる。ノ
ズル１の移動範囲は、ノズル１の先端が吐出口がウエハ
12の表面から外れた位置（オフセット位置）まで回転移
動するように設定しておく。[Embodiment] FIG. 1 shows an embodiment of the present invention. Reference numeral 1 denotes a nozzle for applying a chemical liquid, which is composed of a pipe material having a discharge port (not shown) at its tip. 2 is a plate for fixing and holding the nozzle 1; 3 is a rotating shaft of the plate 2; 4 is a connecting rod for rotating the plate 2 about the rotating shaft 3; 5 is a mounting position adjusting knob for the connecting rod 4; 6 is a disc for driving the connecting rod 4, 7 is a sensor plate for setting the origin of the nozzle 1, 8 is a sensor for detecting the sensor plate 7, 9 is a disc 6
Is a motor for rotating and driving, a support plate 10 for mounting and fixing the disk 6 and the motor 9, a knob 11 for adjusting the position of the support plate 10, and a wafer 12 to which a chemical solution is applied. One end of the connecting rod 4 is screwed onto a screw 5a rotated by a knob 5. By operating the knob 5, the distance A between the rotary shaft 3 of the plate 2 and the connecting rod 4 changes, and the range of the sweep operation (rotational movement range) of the nozzle 1 changes.
In this case, if the distance A is increased, the rotation range is decreased, and conversely, if the distance A is decreased, the rotation range is increased.
The sensor 8 detects the sensor plate 7 at a position where the tip of the nozzle 1 is the origin (for example, the center of the wafer 12).
And the mutual position of the sensor plate 7 is set in advance. The support plate 10 is screwed onto a screw 11a that rotates with a knob 11. By operating the knob 11, the support plate 10 moves along the screw 11a, whereby the discharge position of the nozzle 1 can be changed without changing the rotation angle of the nozzle 1. In the moving range of the nozzle 1, the tip of the nozzle 1 has a discharge port on the wafer.
It is set so as to rotate and move to a position (offset position) off the surface of 12.
以上のような薬液塗布装置を使用する場合、まず被塗
布材であるウエハ12の大きさに応じてノブ5,11の操作に
よりノズル１の原点位置およびスイープ範囲を設定す
る。このスイープ範囲は、ウエハ12の中心とウエハ12か
ら外れたオフセット位置との間の範囲Ｒでもよいし、ま
たはウエハ12の中心を通りウエハ12の両外側の２つのオ
フセット位置間の範囲Ｄでもよい。このような調整後、
ノズル１をスイープ動作させながら先端の吐出口より薬
液をウエハ12上に塗布する。モータ９の回転数、ノズル
の移動速度、薬液の吐出タイミング等はウエハ12に応じ
てプログラムにより自動制御してもよい。In the case of using the chemical liquid coating apparatus as described above, first, the origin position and the sweep range of the nozzle 1 are set by operating the knobs 5 and 11 according to the size of the wafer 12 as the coating material. The sweep range may be a range R between the center of the wafer 12 and an offset position deviated from the wafer 12, or a range D passing through the center of the wafer 12 and between two offset positions on both outer sides of the wafer 12. . After such adjustment,
While sweeping the nozzle 1, a chemical solution is applied onto the wafer 12 from the discharge port at the tip. The rotation speed of the motor 9, the moving speed of the nozzle, the discharge timing of the chemical liquid, and the like may be automatically controlled by a program according to the wafer 12.
［発明の効果］ 以上説明したように、本発明に係る液体塗布装置のノ
ズルはスイープ動作を行なうように構成されているた
め、従来の固定ノズルの場合に比べ約1/2の時間で液体
を被塗布材表面に均一に拡散させることができる。従っ
て、例えば現像液を塗布する場合、中心部と周辺部での
塗布時間の差が減少し均一な現像作用が達成される。ま
た、ノズルの原点位置及びスイープ範囲を任意に調整で
きるようにしたので、どのような大きさの被塗布材に対
しても短時間に液体を均一に拡散塗布することができる
と共に、ノズルを被塗布材から外れたオフセット位置に
待期させることが可能となり、ウエハ等の被塗布材上へ
の不必要な薬液のボタ落ち等の不具合がなくなる。[Effects of the Invention] As described above, since the nozzle of the liquid application device according to the present invention is configured to perform the sweep operation, the liquid is applied in about half the time as compared with the case of the conventional fixed nozzle. It can be uniformly diffused on the surface of the material to be coated. Therefore, for example, when a developing solution is applied, the difference in application time between the central portion and the peripheral portion is reduced and a uniform developing action is achieved. Further, since the origin position of the nozzle and the sweep range can be adjusted arbitrarily, the liquid can be uniformly applied to the material to be coated of any size in a short time and the nozzle can be coated. It becomes possible to wait for an offset position that is deviated from the coating material, and problems such as unnecessary dripping of the chemical liquid on the coating material such as a wafer are eliminated.
第１図は本発明実施例の構成図である。 1:ノズル、2:プレート、 3:回転軸、4:連結ロッド 5,11:ノブ、6:円板、 9:モータ、10:支持プレート、 12:ウエハ。 FIG. 1 is a block diagram of an embodiment of the present invention. 1: Nozzle, 2: Plate, 3: Rotation axis, 4: Connection rod 5, 11: Knob, 6: Disc, 9: Motor, 10: Support plate, 12: Wafer.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 21/30 ５６４Ｄ ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location H01L 21/30 564D
Claims (5)
ノズルと、該ノズルを前記被塗布材の表面に平行な平面
内で移動させるためのノズル移動手段を備え、前記ノズ
ル移動手段は、 前記ノズルを保持し、回転可能なノズル保持手段と、 モータと、 前記モータを支持する支持プレートと、 前記支持プレート上に取り付けられ、前記モータによっ
て回転する回転板と、 前記回転板と前記ノズル保持手段とをそれぞれの回転中
心から離れた連結位置において連結し、前記回転板の回
転運動を前記ノズル保持手段に伝達する連結ロッドと、 前記連結ロッドとノズル保持手段との連結位置を調整し
て前記ノズルの回転移動範囲を調整する範囲調整手段
と、 前記支持プレートの位置を調整して前記ノズル先端の吐
出口の位置を調整する位置調整手段とを具備することを
特徴とする液体塗布装置のノズルスイープ機構。1. A nozzle moving means comprising: a nozzle for discharging a liquid onto the surface of a material to be coated; and a nozzle moving means for moving the nozzle in a plane parallel to the surface of the material to be coated. Is a nozzle holding means that holds the nozzle and is rotatable; a motor; a support plate that supports the motor; a rotating plate that is mounted on the supporting plate and that is rotated by the motor; A connecting rod for connecting the nozzle holding means to each other at a connecting position distant from the center of rotation, and a connecting rod for transmitting the rotational movement of the rotary plate to the nozzle holding means, and adjusting the connecting position of the connecting rod and the nozzle holding means. Adjusting means for adjusting the rotational movement range of the nozzle, and position adjusting means for adjusting the position of the support plate to adjust the position of the discharge port at the tip of the nozzle. And a nozzle sweep mechanism for a liquid application device.
らなり、該管材の根元部が前記ノズル移動手段に保持さ
れたことを特徴とする特許請求の範囲第１項記載の液体
塗布装置のノズルスイープ機構。2. The liquid applying apparatus according to claim 1, wherein the nozzle is made of a pipe material having a discharge port at a tip thereof, and a root portion of the pipe material is held by the nozzle moving means. Nozzle sweep mechanism.
吐出口が回転軸を中心に円弧軌跡を描くように構成した
ことを特徴とする特許請求の範囲第１項または第２項記
載の液体塗布装置のノズルスイープ機構。3. The liquid according to claim 1, wherein the nozzle moving means is configured such that the discharge port at the tip of the nozzle draws an arc locus about a rotation axis. Nozzle sweep mechanism of coating device.
の中心と被塗布材表面から外れた位置との間を回転移動
するように構成したことを特徴とする特許請求の範囲第
３項記載の液体塗布装置のノズルスイープ機構。4. The nozzle according to claim 3, wherein the nozzle is configured so that its outlet is rotationally moved between the center of the surface of the material to be coated and a position deviated from the surface of the material to be coated. Nozzle sweep mechanism of the liquid application device according to the item.
の中心を通り被塗布材表面の両側の該表面から外れた２
位置間を回転移動するように構成したことを特徴とする
特許請求の範囲第３項記載の液体塗布装置のノズルスイ
ープ機構。5. The nozzle has a discharge port that passes through the center of the surface of the material to be coated and is displaced from the surface on both sides of the surface of the material to be coated.
The nozzle sweep mechanism of the liquid coating apparatus according to claim 3, wherein the nozzle sweep mechanism is configured to rotate between positions.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253695A JP2532852B2 (en) | 1986-10-27 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
| GB8715456A GB2194500B (en) | 1986-07-04 | 1987-07-01 | A wafer handling apparatus |
| DE19873722080 DE3722080A1 (en) | 1986-07-04 | 1987-07-03 | DEVICE FOR PROCESSING SEMICONDUCTOR BOARDS |
| US07/453,188 US5015177A (en) | 1986-07-04 | 1989-12-15 | Wafer handling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253695A JP2532852B2 (en) | 1986-10-27 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107768A JPS63107768A (en) | 1988-05-12 |
| JP2532852B2 true JP2532852B2 (en) | 1996-09-11 |
Family
ID=17254862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61253695A Expired - Lifetime JP2532852B2 (en) | 1986-07-04 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2532852B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4943275B2 (en) * | 2007-08-30 | 2012-05-30 | 株式会社吉野工業所 | Trigger type ejector |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337747A (en) * | 1976-09-18 | 1978-04-07 | Sony Corp | Apparatus for applying adhesive |
| JPS6224860A (en) * | 1985-07-24 | 1987-02-02 | Hitachi Tokyo Electron Co Ltd | Potting device |
| JPS6242946U (en) * | 1985-08-30 | 1987-03-14 | ||
| JPS62194470U (en) * | 1986-05-29 | 1987-12-10 |
-
1986
- 1986-10-27 JP JP61253695A patent/JP2532852B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63107768A (en) | 1988-05-12 |
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Legal Events
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| EXPY | Cancellation because of completion of term |