JPS63107768A - Nozzle sweep mechanism of liquid coating apparatus - Google Patents
Nozzle sweep mechanism of liquid coating apparatusInfo
- Publication number
- JPS63107768A JPS63107768A JP25369586A JP25369586A JPS63107768A JP S63107768 A JPS63107768 A JP S63107768A JP 25369586 A JP25369586 A JP 25369586A JP 25369586 A JP25369586 A JP 25369586A JP S63107768 A JPS63107768 A JP S63107768A
- Authority
- JP
- Japan
- Prior art keywords
- nozzle
- sweep mechanism
- coated
- liquid
- liquid coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 28
- 230000007246 mechanism Effects 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims description 11
- 238000000576 coating method Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000007599 discharging Methods 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 10
- 230000007480 spreading Effects 0.000 abstract description 2
- 238000003892 spreading Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 19
- 230000000694 effects Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 238000010408 sweeping Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の分野］
本発明は、半導体製造プロセスにおけるレジストまたは
現像液等の液体塗布装置に関し、特に被塗布面上での液
体の拡散時間を短縮するためのノズル部の改良に関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to a device for applying a liquid such as a resist or a developer in a semiconductor manufacturing process, and particularly to a device for applying a liquid such as a resist or a developer on a surface to be coated. Regarding improvements.
［従来の技術］
従来の半導体ウェハ上にレジストまたは現像液等の薬液
を塗布する装置においては、ウェハ上方に固定されたノ
ズルよりクエへの中心部に液体を吐出してウェハ全面に
液体を塗布していた。このような従来の液体塗布装置に
おいては、ウェハ中心部に滴下された液体自身の拡散作
用によりウェハ全面に液体を分散させて広げていたため
、液体がウニ八周縁部に均一に達するまでに多くの時間
を要しウェハの処理速度の低下を来していた。また、特
に現像液を塗布する場合、ウェハの中心部と周辺部とで
現像時間の差が生じ、現像したパターン寸法にバラつき
が生ずるという欠点があった。[Prior Art] In conventional equipment for applying chemical solutions such as resist or developer onto semiconductor wafers, the liquid is applied to the entire surface of the wafer by discharging the liquid from a nozzle fixed above the wafer to the center of the square. Was. In such conventional liquid coating equipment, the liquid dropped onto the center of the wafer uses its own diffusion effect to disperse and spread the liquid over the entire surface of the wafer. This took time and resulted in a decrease in wafer processing speed. In addition, especially when applying a developer, there is a disadvantage that there is a difference in development time between the center and the periphery of the wafer, resulting in variations in the dimensions of the developed pattern.
［発明の目的］
本発明は前記従来技術の欠点に鑑みなされたものであっ
て、ノズルのスィーブ機構を設けてノズルを被塗布材表
面に対して駆動可能とし液体の広がり時間の短縮を図る
ことを目的とし、またこのようなノズルのスイープ運動
の速度、移動範囲等を任意に調整可能としさらにプログ
ラムによる自動制御が可能な液体塗布装置のノズルスイ
ープ機構の提供を目的とする。[Object of the Invention] The present invention has been made in view of the drawbacks of the prior art, and provides a nozzle sweep mechanism to enable the nozzle to be driven relative to the surface of the material to be coated, thereby shortening the spreading time of the liquid. Another object of the present invention is to provide a nozzle sweep mechanism for a liquid coating device in which the speed, movement range, etc. of such a nozzle sweep movement can be arbitrarily adjusted and can be automatically controlled by a program.
［実施例］
第１図に本発明の実施例を示す。１は薬液を塗布するた
めのノズルであり、先端に吐出口（図示しない）を有す
る管材により構成される。２はノズル１を固定保持する
ためのプレート、３はプレート２の回転軸、４はプレー
ト２を回転軸３を中心に回転運動させるための連結ロッ
ド、５は連結ロッド４の取付位置調整ノブ、６は連結ロ
ッド４の駆動用円板、７はノズル１の原点設定用のセン
サ板、８はセンサ板７を検出するセンサ、９は円板６を
回転駆動するモータ、１０は円板６およびモータ９を搭
載固定するための支持プレート、１１は支持プレートｌ
Ｏの位置を調整するためのノブ、１２は薬液を塗布すべ
きウェハである。連結ロッド４の一端部はノブ５により
回転するネジ５ａに螺着している。ノブ５の操作により
プレート２の回転軸３と連結ロッド４との間の距＠Ａが
変り、ノズルｌのスイープ動作の範囲（回転移動範囲）
が変る。この場合、距離Ａを大きくすれば回転範囲は小
さくなり、逆に距１１１ｉＡを小さくすると回転範囲は
大きくなる。ノズル１の先端が原点（例えばウェハ１２
の中心）となる位置でセンサ８がセンサ板７を検出する
ようにセンサ８およびセンサ板７の相互位置を予め設定
しておく。支持プレート１０はノブ１１により回転する
ネジｌｌａに螺着している。[Example] FIG. 1 shows an example of the present invention. Reference numeral 1 denotes a nozzle for applying a chemical solution, and is composed of a tube having a discharge port (not shown) at its tip. 2 is a plate for fixing and holding the nozzle 1; 3 is a rotating shaft of the plate 2; 4 is a connecting rod for rotating the plate 2 around the rotating shaft 3; 5 is a knob for adjusting the mounting position of the connecting rod 4; 6 is a driving disc for the connecting rod 4; 7 is a sensor plate for setting the origin of the nozzle 1; 8 is a sensor for detecting the sensor plate 7; 9 is a motor for rotationally driving the disc 6; 10 is the disc 6 and A support plate for mounting and fixing the motor 9, 11 is a support plate l
A knob 12 is used to adjust the position of O, and 12 is a wafer to which a chemical solution is to be applied. One end of the connecting rod 4 is screwed onto a screw 5a rotated by a knob 5. By operating the knob 5, the distance @A between the rotation axis 3 of the plate 2 and the connecting rod 4 changes, and the sweep operation range (rotational movement range) of the nozzle l changes.
changes. In this case, increasing the distance A will decrease the rotation range, and conversely, decreasing the distance 111iA will increase the rotation range. The tip of nozzle 1 is the origin (for example, wafer 12
The mutual positions of the sensor 8 and the sensor plate 7 are set in advance so that the sensor 8 detects the sensor plate 7 at a position that is the center of the sensor plate 7. The support plate 10 is screwed onto a screw lla which is rotated by a knob 11.
ノブ１１の操作により支持プレート１０はネジｌｌａに
沿って駆動し、これによりノズル１の回転角度を変える
ことなくノズル１の吐出位置を変えることができる。ノ
ズル１の移動範囲は、ノズル１の先端の吐出口がウェハ
１２の表面から外れた位置（オフセット位置）まで回転
移動するように設定しておく。By operating the knob 11, the support plate 10 is driven along the screw lla, thereby making it possible to change the discharge position of the nozzle 1 without changing the rotation angle of the nozzle 1. The movement range of the nozzle 1 is set so that the discharge port at the tip of the nozzle 1 rotates to a position away from the surface of the wafer 12 (offset position).
以上のような薬液塗布装置を使用する場合、まず被塗布
材であるウェハ１２の大きさに応じてノブ５．１１の操
作によりノズル１の原点位置およびスィーブ範囲を設定
する。このスィーブ範囲は、ウェハ１２の中心とウェハ
１２から外れたオフセット位置との間の範囲Ｒでもよい
し、またはウェハ１２の中心を通りウェハ１２の両性側
の２つのオフセット位置間の範囲りでもよい。このよう
な調整後、ノズル１をスィーブ動作させながら先端の吐
出口より薬液をウェハ１２上に塗布する。モータ９の回
転数、ノズルの移動速度、薬液の吐出タイミング等はウ
ェハ１２に応じてプログラムにより自動制御してもよい
。When using the chemical liquid coating apparatus as described above, first, the origin position and sweep range of the nozzle 1 are set by operating the knob 5.11 according to the size of the wafer 12, which is the material to be coated. This sweep range may be a range R between the center of the wafer 12 and an offset position off the wafer 12, or it may be a range R through the center of the wafer 12 and between two offset positions on either side of the wafer 12. . After such adjustment, the chemical liquid is applied onto the wafer 12 from the discharge port at the tip while the nozzle 1 is operated in a sweeping motion. The rotation speed of the motor 9, the moving speed of the nozzle, the discharge timing of the chemical solution, etc. may be automatically controlled by a program according to the wafer 12.
［発明の効果コ
以上説明したように、本発明に係る液体塗布装置のノズ
ルはスィーブ動作を行なうように構成されているため、
従来の固定ノズルの場合に比べ約局の時間で液体を被塗
布材表面に均一に拡散させることができる。従）て、例
えば現像液を塗布する場合、中心部と周辺部での塗布時
間の差が減少し均一な現像作用が達成される。また、ノ
ズルを被塗布材から外れたオフセット位置に待期させる
ことが可能となり、ウェハ等の被塗布材上への不必要な
薬液のボタ落ち等の不具合がなくなる。[Effects of the Invention] As explained above, since the nozzle of the liquid coating device according to the present invention is configured to perform a sweeping operation,
The liquid can be uniformly spread over the surface of the material to be coated in about a minute compared to the case of conventional fixed nozzles. Therefore, for example, when applying a developer, the difference in application time between the center and the periphery is reduced, and a uniform development effect is achieved. Furthermore, it is possible to set the nozzle at an offset position away from the material to be coated, thereby eliminating problems such as unnecessary droplets of chemical solution onto the material to be coated, such as wafers.
第１図は本発明実施例の構成図である。 １：ノズル、 ２ニブレート、 ３：回転軸、 ４：連結ロッド、 ５．１１ニツプ、６：円板、 ９：モータ、 １０：支持プレート、 １２：ウェハ。 −７さ さ FIG. 1 is a block diagram of an embodiment of the present invention. 1: Nozzle, 2 nibrate, 3: Rotating shaft, 4: Connecting rod, 5.11 nip, 6: disc, 9: Motor, 10: Support plate, 12: Wafer. -7sa difference
Claims (1)
、該ノズルを前記被塗布材の表面に平行な平面内で移動
させるためのノズル移動手段を具備したことを特徴とす
る液体塗布装置のノズルスイープ機構。 ２、前記ノズルは先端に吐出口を有する管材からなり、
該管材の根元部が前記ノズル移動手段に保持されたこと
を特徴とする特許請求の範囲第１項記載の液体塗布装置
のノズルスイープ機構。 ３、前記ノズル移動手段は、前記ノズル先端の吐出口が
回転軸を中心に円弧軌跡を描くように構成したことを特
徴とする特許請求の範囲第１項または第２項記載の液体
塗布装置のノズルスイープ機構。 ４、前記ノズルは、その吐出口が被塗布材表面の中心と
被塗布材表面から外れた位置との間を回転移動するよう
に構成したことを特徴とする特許請求の範囲第３項記載
の液体塗布装置のノズルスイープ機構。 ５、前記ノズルは、その吐出口が被塗布材表面の中心を
通り被塗布材表面の両側の該表面から外れた２位置間を
回転移動するように構成したことを特徴とする特許請求
の範囲第３項記載の液体塗布装置のノズルスイープ機構
。 ６、前記ノズル移動手段は、ノズル保持手段と、ノズル
回転移動用のモータと、該モータの回転運動を前記ノズ
ル保持手段に伝達するための連結ロッドにより構成した
ことを特徴とする特許請求の範囲第１項から第Ｓ項まで
のいずれか１項記載の液体塗布装置のノズルスイープ機
構。 ７、前記連結ロッドとノズル保持手段との連結位置を調
整して前記ノズルの回転移動範囲を調整可能としたこと
を特徴とする特許請求の範囲第６項記載の液体塗布装置
のノズルスイープ機構。 ８、前記モータは支持プレート上に搭載され、該支持プ
レート上に前記連結ロッド駆動用の回転板を前記モータ
に連結して装着したことを特徴とする特許請求の範囲第
６項または第７項記載の液体塗布装置のノズルスイープ
機構。 ９、前記支持プレートは位置調整可能であって、該支持
プレートの位置調整により前記ノズル先端の吐出口の位
置を調整可能としたことを特徴とする特許請求の範囲第
８項記載の液体塗布装置のノズルスイープ機構。[Scope of Claims] 1. A nozzle for discharging a liquid onto the surface of a material to be coated, and a nozzle moving means for moving the nozzle in a plane parallel to the surface of the material to be coated. A nozzle sweep mechanism for a liquid coating device featuring: 2. The nozzle is made of a tube having a discharge port at its tip,
2. A nozzle sweep mechanism for a liquid coating device according to claim 1, wherein a root portion of said tube member is held by said nozzle moving means. 3. The liquid coating device according to claim 1 or 2, wherein the nozzle moving means is configured such that the discharge port at the tip of the nozzle draws an arcuate locus around a rotation axis. Nozzle sweep mechanism. 4. The nozzle is configured such that its discharge port rotates between the center of the surface of the material to be coated and a position off the surface of the material to be coated. Nozzle sweep mechanism of liquid applicator. 5. Claims characterized in that the nozzle is configured such that its discharge port passes through the center of the surface of the material to be coated and rotates between two positions on both sides of the surface of the material to be coated and away from the surface. The nozzle sweep mechanism of the liquid coating device according to item 3. 6. Claims characterized in that the nozzle moving means is constituted by a nozzle holding means, a motor for rotationally moving the nozzle, and a connecting rod for transmitting the rotational movement of the motor to the nozzle holding means. A nozzle sweep mechanism of a liquid coating device according to any one of Items 1 to S. 7. The nozzle sweep mechanism for a liquid coating device according to claim 6, wherein the rotational movement range of the nozzle can be adjusted by adjusting the connection position between the connecting rod and the nozzle holding means. 8. The motor is mounted on a support plate, and a rotary plate for driving the connecting rod is mounted on the support plate in connection with the motor. A nozzle sweep mechanism of the liquid application device described. 9. The liquid application device according to claim 8, wherein the support plate is adjustable in position, and the position of the discharge port at the tip of the nozzle can be adjusted by adjusting the position of the support plate. nozzle sweep mechanism.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253695A JP2532852B2 (en) | 1986-10-27 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
| GB8715456A GB2194500B (en) | 1986-07-04 | 1987-07-01 | A wafer handling apparatus |
| DE19873722080 DE3722080A1 (en) | 1986-07-04 | 1987-07-03 | DEVICE FOR PROCESSING SEMICONDUCTOR BOARDS |
| US07/453,188 US5015177A (en) | 1986-07-04 | 1989-12-15 | Wafer handling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61253695A JP2532852B2 (en) | 1986-10-27 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63107768A true JPS63107768A (en) | 1988-05-12 |
| JP2532852B2 JP2532852B2 (en) | 1996-09-11 |
Family
ID=17254862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61253695A Expired - Lifetime JP2532852B2 (en) | 1986-07-04 | 1986-10-27 | Nozzle sweep mechanism of liquid application device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2532852B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009056372A (en) * | 2007-08-30 | 2009-03-19 | Yoshino Kogyosho Co Ltd | Trigger type sprayer |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337747A (en) * | 1976-09-18 | 1978-04-07 | Sony Corp | Apparatus for applying adhesive |
| JPS6224860A (en) * | 1985-07-24 | 1987-02-02 | Hitachi Tokyo Electron Co Ltd | Potting device |
| JPS6242946U (en) * | 1985-08-30 | 1987-03-14 | ||
| JPS62194470U (en) * | 1986-05-29 | 1987-12-10 |
-
1986
- 1986-10-27 JP JP61253695A patent/JP2532852B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5337747A (en) * | 1976-09-18 | 1978-04-07 | Sony Corp | Apparatus for applying adhesive |
| JPS6224860A (en) * | 1985-07-24 | 1987-02-02 | Hitachi Tokyo Electron Co Ltd | Potting device |
| JPS6242946U (en) * | 1985-08-30 | 1987-03-14 | ||
| JPS62194470U (en) * | 1986-05-29 | 1987-12-10 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009056372A (en) * | 2007-08-30 | 2009-03-19 | Yoshino Kogyosho Co Ltd | Trigger type sprayer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2532852B2 (en) | 1996-09-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |