JPS6224860A - Potting device - Google Patents

Abstract

PURPOSE:To stably supply a pasty material having specified characteristics by constituting a supply nozzle for the pasty material of a potting device in such a manner that the nozzle can move in the plane direction. CONSTITUTION:The potting device is attached with a syringe 5 having the nozzle for supplying the paste at the top end of an arm 3 and turnably supports the same to a pin 4 of a stage 2. A post 6 is connected to a driving part. The paste is potted to a lead frame on a frame feeder 1 by vertically moving the arm 3 in an ordinary operation. The arm 3 is held slightly lifted from the top surface of the stage 2 and is turned to the left so as to be moved to an offline position where the arm 3 is made to stand by while the potting into the hole 11a of a test potting part 11 is repeated during the interruption of the operation. The pasty material having the specified characteristics is thereby stably supplied.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a technique that is effective when applied to a potting device.

[Background technology]

One of the bullet mounting methods when manufacturing semiconductor devices is
Some use so-called silver paste as an adhesive.

The above method can be automated by installing a potting device on the frame feeder before the pellet loading device. In this case, a predetermined amount of silver paste is sequentially supplied to predetermined portions of a lead frame fed by a frame feeder.

When the silver paste is repeatedly supplied in this manner, stable attachment of the semiconductor pellet is achieved.

Incidentally, it may be necessary to temporarily stop the pellet mounting work due to work management reasons or the like.

In such cases, it is clear that as the silver paste hardens in the supply nozzle, etc., the quality of the silver paste supplied after restarting deteriorates, making it impossible to attach the pellet in a reliable and stable manner. was made into

In addition, the inventor also pointed out that when the silver paste hardens as described above, there is a problem in that it is not possible to restart the work smoothly because the deteriorated silver paste must be removed in advance. Found out.

The mounting technology for semiconductor pellets was developed in 1982.
November 20th, “Electronic Materials J” published by Kogyo Kenkyukai Co., Ltd.
It is explained in detail in the 1984 special volume, pages 108 to 113.

[Purpose of the invention]

An object of the present invention is to provide a technique that can stably supply a paste-like material with constant properties.

Another object of the present invention is to provide a technique that can smoothly supply a paste material.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

That is, by making the supply nozzle of the paste material in the potting device movable in the plane direction, the supply nozzle can be moved to a predetermined position off the line when work is stopped, and the deterioration of the paste material at that position can be prevented. By being able to continue the potting operation, the stable potting operation can be resumed by simply returning the supply nozzle to a predetermined position, and the above object is achieved.

〔Example〕

FIG. 1 is a schematic partial perspective view showing a potting device according to an embodiment of the present invention along with its usage mode.

The potting device of this embodiment is a device for supplying so-called glue paste, which is an adhesive, to the pellet/7-toe weir attachment portion of a lead frame (not shown) in the process of attaching semiconductor pellets. It is installed at a predetermined location close to. Therefore, after potting the paste, the lead frame is transferred to the frame feeder for the next process, the pellet mounting process.
It will be transported by.

In the potting device described above, an arm 3 is attached to the stage 2 so as to be rotatable about a pin 4, and a syringe 5 having a nozzle for supplying silver paste is attached to the tip of the arm 3. A column 6 is connected to the lower portion of the stage 2, and the lower portion of the column 6 is connected to a drive section 7.

FIG. 2 is a schematic explanatory diagram showing the state.

A control section (control means) 8 for controlling the speed of vertical movement of the column 6 is connected to the drive section 7 connected to the column 6 .

FIG. 3 is an enlarged partial sectional view showing the potting device of this embodiment.

In this figure, the state in which the stage 2 and the arm 3 supported by the stage 2 are engaged is shown in an enlarged manner. That is, a support 6 is connected to the lower part of the stage 2, which has a substantially U-shaped cross section, and one end of the arm 3 is connected to a pin 4 on the upper surface.
The flange 4- at the lower end of the bottle 4 is engaged through the flange 4-
A spring 9 is attached between a and the back surface of the upper part of the stage. Therefore, the arm 3 is attracted toward the upper surface of the stage 2, and at the same time is rotatable about the bin 4.

Further, a protrusion 3a is formed on the back surface of the 7-m 3, and the protrusion 3a is fitted into a recess 2a formed on the upper surface of the stage 2. By forming the recess 2a at a predetermined position of the stage 2, the arm 3 can be fixed at an accurate position. When a plurality of recesses 2a are formed, by rotating the arm 3 with the height equivalent to the protrusion 3a floating above the top surface of the stage 2, it is possible to easily move from one recess 2a to the other recess 2a. It can be moved and the arm 3 can be accurately positioned at that location.

Furthermore, a syringe 5 connected to the other end of the arm 3
There is a nozzle 5a at the lower end of the nozzle 5a, and a pipe 10 for supplying silver paste is connected to the upper end of the nozzle 5a.

Next, the operation of this embodiment will be explained.

During normal operation, silver paste potting work is performed by moving the arm 3 up and down at the position shown by the solid line in Figure 1. However, if the work is interrupted, the arm 3 is moved slightly above the top surface of the stage 2. Raise it to the top and rotate it to the left for two points! Move to the offline position indicated by the line. Then, the arm 3 is moved up and down at that position, and the potting part 11 is kept waiting until the formal potting work is resumed while the potting operation is repeated.

The hole 11a communicates with a waste section (not shown),
Potted silver paste is automatically discarded.

Note that this potting operation at the off-line position is performed to prevent deterioration of the root paste due to long-term suspension of the potting operation. Therefore, it is not necessary to perform potting at the same speed as during normal operation, and it is sufficient to perform potting at a speed that prevents deterioration such as hardening. In that case, the speed adjustment is carried out by the control section 8 shown in FIG.
This is achieved by controlling the silver paste supply section (not shown).

When resuming work, the arm 3 is returned to its original position and the speed is increased to easily return to the normal working state.

As mentioned above, since the potting device of this embodiment repeats the potting operation even when work is stopped, it is possible to supply silver paste with a predetermined performance as soon as work is resumed, thereby enabling stable potting work. It is something. That is, if the work is stopped for a long time and the potting device is not operated during that time, the quality of the silver paste changes inside the syringe 5 or the nozzle 5a, and in some cases hardens. Therefore, before restarting the work, it is necessary to perform trial potting to stabilize the properties of the silver paste discharged from the nozzle 5a. However, the potting device of this embodiment does not have the above-mentioned problems and has the advantage that stable potting work can be resumed at any time.

〔effect〕

(1) By making the supply nozzle of the paste material of the potting device movable in the plane direction, potting work can be performed at a predetermined speed at an offline position when work is stopped. By being able to prevent material deterioration such as hardening, stable potting work can be resumed simply by returning the supply nozzle to a predetermined position.

(2) The above-mentioned fil makes it possible to constantly supply a paste-like material that has not undergone any deterioration such as hardening, thereby achieving potting with stable performance.

(3) When potting WW is applied to supply adhesive for attaching semiconductor paste, semiconductor pellets with high reliability can be stably bonded by the above (2).

I can do it.

(4) According to (1) above, since there is no need for potting preparation work in advance, potting work can be resumed quickly, resulting in an improvement in the operating rate.

will be accomplished.

(5) According to (2) and (4) above, even if the work is stopped midway through, the highly reliable potting work can be quickly restarted.

(6) With the above (2), the yield can be improved.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in the embodiment, the arm to which the nozzle is attached is rotatable as a means for enabling the movement of the nozzle in the plane direction, but the present invention is not limited to this. Any device may be used as long as it has a function that allows it to be moved.

Furthermore, even if a rotatable arm is used as in the embodiment, the arm positioning and rotation may be performed using other methods, such as using an air cylinder connected to a part of the arm with a solenoid valve, etc. Needless to say, it is also possible to use a method in which the potting device is driven by a rotor, and by doing so, complete automation of the potting work can be achieved.

[Application field]

In the above explanation, the invention made by the present inventor was mainly applied to the mounting of semiconductor pellets, which is the background field of application, but the invention is not limited thereto. This technique is also effective when applied to the attachment of semiconductor pellets and the supply of paste-like materials such as coating resins to semiconductor pellets that have been attached.

[Brief explanation of the drawing]

FIG. 1 is a schematic partial perspective view showing a potting device according to an embodiment of the present invention along with its usage mode. FIG. 2 is a schematic explanatory diagram showing a potting device of this embodiment. FIG. 2 is an enlarged partial cross-sectional view of an example potting device. , 1... Frame feeder, 2... Stage, 2a
... recess, 3... arm, 3a... protrusion, 4.
...Pin, 4a...Brim, 5...Syringe, 5a...
... Nozzle, 6... Support, 7... Drive part, 8...
Control unit (control means), 9... spring, 10...
Tube, 11... Trial writing 1 Figure

Claims (1)

[Scope of Claims] 1. A potting device for potting a paste-like material at a predetermined location, the potting device comprising a supply nozzle movable in a plane direction. 2. The potting device according to claim 1, wherein the supply nozzle is supported by a rotatable arm. 3. The potting device according to claim 1, wherein a speed control means is connected to the vertical drive section of the supply nozzle.