JP3437995B2 - Double side coating device - Google Patents
Double side coating deviceInfo
- Publication number
- JP3437995B2 JP3437995B2 JP29397793A JP29397793A JP3437995B2 JP 3437995 B2 JP3437995 B2 JP 3437995B2 JP 29397793 A JP29397793 A JP 29397793A JP 29397793 A JP29397793 A JP 29397793A JP 3437995 B2 JP3437995 B2 JP 3437995B2
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- holding piece
- main body
- plate
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、薄板を板面と直交する
軸回りに回転させ、両面に液状材料を吹き付けることに
よりほぼ均一な塗膜厚に液状材料を塗布する装置に関
し、特に半導体製造のための試料にレジスト液を塗布す
る場合に適した両面塗布装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for applying a liquid material to a substantially uniform coating thickness by rotating a thin plate around an axis orthogonal to the plate surface and spraying the liquid material on both surfaces, and particularly to semiconductor manufacturing. The present invention relates to a double-sided coating device suitable for coating a resist solution on a sample.
【0002】[0002]
【従来の技術】半導体試料の表面にレジスト被膜を形成
するには、試料を水平回転させてその表面にレジスト液
を滴下し、遠心力によって展延する方法が行なわれてき
た。しかし、この従来の方法によると試料の両面にレジ
スト被膜を形成するために、片面ずつ作業を進めなけれ
ばならない。従って他の片面の作業の際に、既に形成済
の片面の被膜に対しても、加熱工程などについては同じ
作業が繰り返される結果、変質させるおそれがある。ま
た常に片側ずつ作業を進めるため両面の品質を厳密に一
定にするということは不可能に近い。従来片面ずつ作業
を進めて来た理由は、回転部材に試料を吸着保持する必
要から生じたのである。2. Description of the Related Art In order to form a resist film on the surface of a semiconductor sample, a method has been used in which the sample is horizontally rotated and a resist solution is dropped on the surface and spread by centrifugal force. However, according to this conventional method, in order to form a resist film on both surfaces of the sample, it is necessary to work on each surface one by one. Therefore, at the time of the work on the other side, the already-formed one-side coating may be deteriorated as a result of repeating the same work for the heating step and the like. In addition, it is almost impossible to keep the quality of both sides strictly constant because the work is always performed one by one. The reason why the work has conventionally been carried out one by one is that it is necessary to adsorb and hold the sample on the rotating member.
【0003】[0003]
【発明が解決しようとする課題】本発明は前記の点に鑑
みなされたもので、その課題とするところは半導体試料
の両面にレジスト液等を塗布する場合、或いはそれと同
様に薄い板状材の両面に液状材料を塗布するような場合
に、それら薄板の両面に同時に塗布材料を塗布すること
にある。SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and its object is to apply a resist solution or the like to both surfaces of a semiconductor sample, or similarly to a thin plate material. When the liquid material is applied to both surfaces, the application material is applied to both surfaces of the thin plates at the same time.
【0004】また本発明は、薄板の両面に同一の品質の
塗膜を形成すること及び、薄板の形状によらずにそれを
支持し回転させて両面塗布を行なえるようにすることを
目的とする。Another object of the present invention is to form a coating film of the same quality on both sides of a thin plate, and to support and rotate it regardless of the shape of the thin plate so that double-sided coating can be performed. To do.
【0005】[0005]
【課題を解決するための手段】前記課題を解決するため
本発明は、薄板の周縁に係止可能な凹部(12)を有
し、かつ凹部の軸方向上部(14)を下部(15)より
も小形にした保持駒(11)を3個回転中心から半径方
向へ移動可能に本体(10)に設けることにより、薄板
を3点で保持するものとし、保持駒11により薄板を自
動的に保持するために全保持駒11を中心方向へ付勢し
た可動機構20を本体10に組み込み、薄板は該本体1
0を回転させることにより回転する構造とし、その薄板
に液状材料を吹き付けるための一方のノズル31を本体
10の回転の中心部に設けるという手段を講じたもので
ある。In order to solve the above-mentioned problems, the present invention has a recess (12) which can be engaged with the peripheral edge of a thin plate.
And the upper part (14) in the axial direction of the recess is lower than the lower part (15).
By also Rukoto provided in the body (10) to be movable in the radial retention piece which was small (11) from the three center of rotation, the thin plate
Is held at three points, and a movable mechanism 20 that biases all the holding pieces 11 toward the center in order to automatically hold the thin pieces by the holding pieces 11 is incorporated into the main body 10.
It is configured to rotate by rotating 0 and one nozzle 31 for spraying the liquid material on the thin plate is provided at the center of rotation of the main body 10.
【0006】[0006]
【実施例】各図は薄板Dをその板面と直交する軸回りに
回転させ、その両面に液状の材料を吹き付け、均一な塗
膜厚で塗布する装置に関する装置の例示である。Each drawing is an illustration of an apparatus relating to an apparatus for rotating a thin plate D around an axis orthogonal to the plate surface, spraying a liquid material on both surfaces, and applying a uniform coating film thickness.
【0007】外形、サイズが異なる薄板Dの周縁に接し
て3点で保持するため、3個の保持駒11を回転中心か
ら半径方向へ移動可能に本体10に設ける。その本体1
0は、それを回転軸30に取り付ける筒状の軸部32を
中心に有する円形の偏平な基板10aと、軸部32の反
対側の基板面に重ねるように取り付ける、基板10aと
同様に円形の偏平な外板10bとからなり、外板10b
の中心部外側に後述のノズル31が設けられる。In order to hold the thin plate D in contact with the peripheral edge of the thin plate D having different outer shape and size at three points, three holding pieces 11 are provided on the main body 10 so as to be movable in the radial direction from the center of rotation. Its body 1
0 is a circular flat substrate 10a having a cylindrical shaft portion 32 attached to the rotary shaft 30 as a center, and a circular flat substrate 10a attached so as to overlap the substrate surface on the opposite side of the shaft portion 32. Consisting of a flat outer plate 10b, the outer plate 10b
A nozzle 31, which will be described later, is provided outside the central portion of the.
【0008】軸部32は回転軸30を有するモータMに
結合し、その回転軸30の回転によって本体10を回転
させるようにする。回転軸30は管状の軸体からなり、
その内部を通して液状の材料を先端から軸方向へ噴出さ
せる構造である。つまり回転軸30の先端がそのまま前
述のノズル31になっている。しかし回転軸30はモー
タMの軸でなく従動軸でも良い。The shaft portion 32 is connected to a motor M having a rotating shaft 30, and the rotation of the rotating shaft 30 causes the main body 10 to rotate. The rotating shaft 30 is composed of a tubular shaft body,
It is a structure in which a liquid material is ejected axially from the tip through the inside. That is, the tip of the rotary shaft 30 is the nozzle 31 as it is. However, the rotary shaft 30 may be a driven shaft instead of the shaft of the motor M.
【0009】3個の保持駒11は、薄板Dを回転軸30
と直交する回転面で回転させるように保持するため、夫
々薄板Dの周縁と結合可能な隅角状の凹部12を有する
ほぼ鼓型の外形を持つ。その凹部12を構成する軸方向
上下の部分は、上部14を小形、下部15を大形にする
とともに側面の傾斜を調整して、薄板Dをセットし易
く、また落ちにくいようになっている。各保持駒11は
回転軸30と平行に保たれる支軸16の先端に固定して
あり、各支軸16は本体10に組み込まれている可動機
構20の摺動子21に取り付けてある。The three holding pieces 11 have a thin plate D and a rotary shaft 30.
In order to hold the thin plate D so that it can be rotated by a rotation surface orthogonal to, it has a substantially hourglass-shaped outer shape having concave portions 12 each having a corner shape that can be coupled to the peripheral edge of the thin plate D. The upper and lower portions of the recess 12 in the axial direction are configured such that the upper portion 14 is small and the lower portion 15 is large, and the inclination of the side surface is adjusted so that the thin plate D can be easily set and is hard to fall. Each holding piece 11 is fixed to the tip of a support shaft 16 which is kept parallel to the rotary shaft 30, and each support shaft 16 is attached to a slider 21 of a movable mechanism 20 incorporated in the main body 10.
【0010】可動機構20として、3個の保持駒11を
半径方向へ同時に同寸法移動させる機構が採用されてお
り、かつ全保持駒11、11、11を中心方向へ付勢
し、それによって薄板Dを各保持駒11で内方へ押圧し
自動的に保持する。As the movable mechanism 20, a mechanism for simultaneously moving the three holding pieces 11 in the radial direction by the same size is adopted, and all the holding pieces 11, 11, 11 are urged in the center direction, whereby the thin plates. D is pressed inward by each holding piece 11 and automatically held.
【0011】この可動機構20は、薄板Dの大きさに合
わせて保持駒11を可動させるため、本体10の外板1
0b部分に形成した放射状の3個の長溝22と、各長溝
22の内方端に一致する始端23aと同外方端に一致す
る終端23bとを有し、各長溝22と交叉するように彎
曲(傾斜のみでも良い。)したガイド溝23を有する回
動板24と、ガイド溝23に係合するように前記摺動子
21に取り付けた係合突起25とを有する。回動板24
はそれに取り付けたレバー26を操作して回動させるこ
とができるが、レバー26を設けるため本体10の周側
には操作口19が開口してあり、レバー操作範囲は、保
持駒11の長溝22の全可動範囲に対応する。Since the movable mechanism 20 moves the holding piece 11 in accordance with the size of the thin plate D, the outer plate 1 of the main body 10 is moved.
It has three radial long grooves 22 formed in the 0b portion, a start end 23a that coincides with the inner end of each long groove 22 and a terminal end 23b that coincides with the outer end thereof, and is curved so as to intersect with each long groove 22. The rotary plate 24 has a guide groove 23 (which may be inclined only), and an engaging projection 25 attached to the slider 21 so as to engage with the guide groove 23. Rotating plate 24
Can be rotated by operating the lever 26 attached thereto, but since the lever 26 is provided, the operation port 19 is opened on the peripheral side of the main body 10, and the lever operation range is within the long groove 22 of the holding piece 11. It corresponds to the entire movable range of.
【0012】さらに可動機構20には、全保持駒11、
11、11を中心方向へ付勢する手段としてコイルばね
27を取り付ける。例示のばね27は、回動板24とそ
れを収めるため本体基板10aに形成してある凹部の周
壁との間の環状空所18に配置され、一端は後述するロ
ック手段13に掛けられ、他の一端は前記レバー26に
掛けられている。29は隔板であり、長溝下空所22a
を移動する摺動子21の落下を防ぐために基板10aと
外板10bとの間に介装され、係合突起25を通すため
に長溝22と同方向の長溝29aが穿孔してある。Further, the movable mechanism 20 includes all the holding pieces 11,
A coil spring 27 is attached as a means for urging 11, 11 toward the center. The illustrated spring 27 is arranged in an annular space 18 between the rotating plate 24 and the peripheral wall of the recess formed in the main body substrate 10a for accommodating the rotating plate 24, and one end thereof is hooked on the locking means 13 which will be described later. One end of the is hung on the lever 26. Reference numeral 29 is a partition plate, which is a space 22a below the long groove.
A long groove 29a is provided between the substrate 10a and the outer plate 10b in order to prevent the sliding member 21 moving therethrough from falling, and a long groove 29a is formed in the same direction as the long groove 22 for passing the engaging projection 25.
【0013】前述のロック手段13は回動板24を止め
るものであり、例示の場合環状空所18に突出するよう
に本体10の基板10aの周縁にねじ込みにより取り付
けてあるロックねじ13aを有し、その先端13bを回
動板24の周面24aに圧接させている。ロックねじ1
3aとばね掛けとは分離しても良い。而して薄板Dのも
う片方の面に液状材料を吹き付けるノズル33は本体中
心部に向けて配置されるが、これは側方へ退避可能とし
て薄板Dの着脱を容易化すると良い。The above-mentioned locking means 13 is for stopping the rotating plate 24, and in the case of the example, it has a locking screw 13a attached to the peripheral edge of the base plate 10a of the main body 10 by screwing so as to project into the annular space 18. The tip 13b is pressed against the peripheral surface 24a of the rotating plate 24. Lock screw 1
3a and the spring hook may be separated. Thus, the nozzle 33 for spraying the liquid material on the other surface of the thin plate D is arranged toward the center of the main body, but this can be retracted to the side to facilitate the attachment / detachment of the thin plate D.
【0014】上記の両面塗布装置Aは半導体試料の両面
にレジスト被膜を形成する装置に適用することにより好
適な成果が得られるが、その装置の例は図5、6に示し
てある。同装置は装置本体40の上面に円筒形の中筒4
1を有し、その中央部を試料台42としてそこに保持駒
11を上向きに本装置Aを配置したもので、本体上面を
開閉可能に覆う、カバー43の側面から内部へ入り込ま
せた揺動可能なスイングアーム44を有し、その先端部
に前記の片方のノズル33が設けてある。45はアーム
44を支持した回転軸を示す。中筒41内は気流(噴霧
された液状材料を含む。)の乱れを防ぐとともに溶剤に
対する配慮から強制排気手段46を有する。Suitable results can be obtained by applying the above-mentioned double-sided coating device A to a device for forming a resist coating on both sides of a semiconductor sample. An example of the device is shown in FIGS. The device has a cylindrical middle cylinder 4 on the upper surface of the device body 40.
1 in which the device A is arranged with the center part thereof as a sample table 42 with the holding piece 11 facing upward. The upper part of the main body is openably and closably covered, and the rocking is made from the side surface of the cover 43 into the inside. It has a swing arm 44 that can be moved, and the one nozzle 33 is provided at the tip thereof. Reference numeral 45 denotes a rotating shaft that supports the arm 44. The inside of the middle cylinder 41 has a forced evacuation means 46 in order to prevent turbulence of the air flow (including the atomized liquid material) and to consider the solvent.
【0015】この両面塗布装置により塗布作業を実施す
る場合、薄板Dは3個の保持駒11、11、11を開い
て(図3参照)、3点で保持し、モータMを作動させ、
本体10とともに回転している状態で液状材料をノズル
31、33から供給して行なう。半導体試料では多くの
場合薄板Dは円形であり、一部にオリエンテーションフ
ラットと称する平坦辺を有する程度であるが、そこを避
けても避けなくても薄板Dを3点保持可能である。When the coating work is carried out by this double-sided coating device, the thin plate D opens the three holding pieces 11, 11, 11 (see FIG. 3) and holds them at three points to operate the motor M,
The liquid material is supplied from the nozzles 31 and 33 while rotating with the main body 10. In many semiconductor samples, the thin plate D is circular and has a flat side called an orientation flat in part, but the thin plate D can be held at three points with or without avoiding it.
【0016】しかし、そのような円形またはそれと同様
に回転中心を出し易い薄板Dのみならず、例えば割れた
不整形の試料、或いは異形の試料等回転中心を決めにく
い薄板を確実に保持できる点に本発明の特徴がある。図
4はその1例を示しており、半円形の薄板Dを保持して
いるが、このような形状の場合は直線部Sを2個の保持
駒11、11に係止させるとずれ易いため、直線部Sは
1個の保持駒11に係止させた方が安定する。こうした
点にさえ注意すれば、3点保持が可能な薄板Dのあらゆ
る形状のものを安定に保持し、中心を固定して高速回転
させることができる。However, not only such a circular plate or a thin plate D which can easily provide a rotation center, but also a thin plate such as a cracked irregular sample or a deformed sample whose rotation center is difficult to determine can be securely held. There is a feature of the present invention. FIG. 4 shows an example thereof, which holds a semicircular thin plate D. However, in such a shape, if the linear portion S is locked to the two holding pieces 11, 11, it is easily displaced. The linear portion S is more stable when locked to one holding piece 11. If only these points are taken into consideration, it is possible to stably hold all shapes of the thin plate D capable of holding three points, fix the center, and rotate at high speed.
【0017】高速回転中の薄板Dの両面にノズル31、
33から噴射された液状材料は回転中心から遠心力によ
って拡がり、レジスト膜に適した一定の塗膜厚となり、
その膜厚は回転数と対応する。故に膜厚を薄くしたい場
合は高速回転させることとなる。そのとき保持駒11が
遠心力で外方へ移動するおそれがあるが、これについて
はロック手段13により保持駒11をロックしておく、
また形状の不定形な薄板Dでは振動を伴うおそれがある
が、そのようなときは保持駒11による支点を変えてバ
ランスを調整する。Nozzles 31 are provided on both sides of the thin plate D which is rotating at a high speed.
The liquid material sprayed from 33 spreads from the center of rotation by centrifugal force and has a constant coating thickness suitable for the resist film,
The film thickness corresponds to the rotation speed. Therefore, when it is desired to reduce the film thickness, high speed rotation is performed. At that time, the holding piece 11 may move outward due to centrifugal force. For this, the holding piece 11 is locked by the locking means 13.
Further, the thin plate D having an irregular shape may be accompanied by vibration. In such a case, the fulcrum of the holding piece 11 is changed to adjust the balance.
【0018】[0018]
【発明の効果】本発明は以上の如く構成され、かつ作用
するものであるから、薄板の両面に液状材料を同時に塗
付する作業が極めて容易に実施でき、特に薄板がどのよ
うな形状であってもそれを回転させることができるの
で、従来は使用不可能として廃棄された試料等を有効に
活用することができ、凹部12を構成する軸方向上下の
部分は上部14が下部15よりも小形であるから、下部
15に支持されている薄板Dを上部14の間に通すこと
も可能になり、薄板Dをセットし易く、また落ちにくい
ものとなり、半導体試料の両面にレジスト被膜を同時形
成するような場合好適であるという効果を奏する。EFFECTS OF THE INVENTION Since the present invention is constructed and operates as described above, it is extremely easy to apply the liquid material to both sides of the thin plate at the same time. However, since it can be rotated, it is possible to effectively utilize a sample or the like that was conventionally discarded as unusable .
The upper part 14 is smaller than the lower part 15, so the lower part
Passing the thin plate D supported by 15 between the upper parts 14.
It is also possible to set the thin plate D easily, and it is difficult to drop the thin plate D, and there is an effect that it is suitable when the resist film is simultaneously formed on both surfaces of the semiconductor sample.
【図1】本発明に係る両面塗布装置の1実施例を示す平
面図。FIG. 1 is a plan view showing an embodiment of a double-sided coating device according to the present invention.
【図2】図1のII−II線の断面図。FIG. 2 is a sectional view taken along line II-II of FIG.
【図3】同上装置の動作説明図。FIG. 3 is a diagram for explaining the operation of the above apparatus.
【図4】(a)同じく作用説明図。 (b)同じく作用説明図。FIG. 4A is an explanatory view of the same operation. (B) Similarly, the operation explanatory view.
【図5】前記装置を組み込んだ平面図。FIG. 5 is a plan view in which the device is incorporated.
【図6】同じく正面図。FIG. 6 is a front view of the same.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−31419(JP,A) 特開 昭58−100425(JP,A) 特開 昭57−194070(JP,A) 特開 平5−237435(JP,A) 特開 平4−320022(JP,A) 特開 平2−197126(JP,A) 実開 平4−59155(JP,U) (58)調査した分野(Int.Cl.7,DB名) H01L 21/027 B05C 11/08 G03F 7/16 H01L 21/68 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-64-31419 (JP, A) JP-A-58-100425 (JP, A) JP-A-57-194070 (JP, A) JP-A-5- 237435 (JP, A) JP-A-4-320022 (JP, A) JP-A-2-197126 (JP, A) Actual development 4-59155 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) H01L 21/027 B05C 11/08 G03F 7/16 H01L 21/68
Claims (5)
せ、両面に液状材料を吹き付けることによりほぼ均一な
塗膜厚に液状材料を塗布する装置において、薄板の周縁
に係止可能な凹部(12)を有し、かつ凹部の軸方向上
部(14)を下部(15)よりも小形にした保持駒(1
1)を3個回転中心から半径方向へ移動可能に本体(1
0)に設けることにより、薄板を3点で保持するものと
し、保持駒(11)により薄板を自動的に保持するため
に全保持駒(11)を中心方向へ付勢した可動機構(2
0)を本体(10)に組み込み、薄板は本体10を回転
させることにより回転する構造とし、その薄板に液状材
料を吹き付けるための一方のノズル(31)を本体(1
0)の回転の中心部に設けたことを特徴とする両面塗布
装置。1. A device for applying a liquid material to a substantially uniform coating thickness by rotating the thin plate around an axis orthogonal to the plate surface and spraying the liquid material on both surfaces, and a recess that can be locked to the peripheral edge of the thin plate. (12) and on the axial direction of the recess
The holding piece (1 ) in which the part (14) is smaller than the lower part (15)
3) 1) can be moved in the radial direction from the center of rotation.
The Rukoto provided 0), and holds the thin plate at three points
Then , in order to automatically hold the thin plate by the holding pieces (11), a movable mechanism (2) that urges all the holding pieces (11) toward the center.
0) is incorporated in the main body (10), and the thin plate is configured to rotate by rotating the main body 10. One nozzle (31) for spraying a liquid material onto the thin plate is provided with the main body (1).
(2) A double-sided coating device provided at the center of rotation.
取り付けるための軸部(32)を中心に有する基板(1
0a)と、ノズル(31)を設けた外板(10b)とか
らなり、回転軸(30)が管状を為していてその先端を
ノズル(31)とした請求項第1項記載の両面塗布装
置。2. A substrate (1) having a shaft (32) as a center, for attaching the main body (10) to the rotating shaft (30).
0a) and an outer plate (10b) provided with a nozzle (31), wherein the rotary shaft (30) has a tubular shape, the tip of which is the nozzle (31). apparatus.
な凹部(12)を有するほぼ鼓型の外形を備えたもので
ある請求項第1項記載の両面塗布装置。3. The double-sided coating apparatus according to claim 1, wherein the holding piece (11) has a substantially drum-shaped outer shape having a recess (12) engageable with the peripheral edge of the thin plate.
が外方へ移動するのを防止するために保持駒(11)を
本体10にロックするロック手段(13)を設けた請求
項第1項記載の両面塗布装置。4. A holding piece (11) by centrifugal force during rotation.
2. The double-sided coating apparatus according to claim 1, further comprising a lock means (13) for locking the holding piece (11) to the main body 10 in order to prevent the moving of the holding piece outward.
わせて保持駒(11)を移動させるため本体(10)に
形成した放射状の3個の長溝(22)と、各長溝(2
2)の内方端に一致する始端及び外方端に一致する終端
を有しかつ長溝(22)と交叉するように曲がったガイ
ド溝(23)を有する回動板(24)と、各ガイド溝
(23)に係合可能に保持駒(11)と一体に動く部分
に設けた係合突起(25)とを有し、保持駒(11)を
半径方向内方へ付勢するため回動板(24)にばね(2
7)を設けた請求項第1項記載の両面塗布装置。5. The movable mechanism (20) has three radial long grooves (22) formed in the main body (10) for moving the holding piece (11) according to the size of the thin plate, and each long groove (2).
A rotating plate (24) having a guide groove (23) having a start end corresponding to the inner end and a end end corresponding to the outer end of 2) and curved so as to intersect the long groove (22), and each guide. It has an engaging projection (25) provided in a portion that moves integrally with the holding piece (11) so as to be engageable with the groove (23), and rotates to urge the holding piece (11) inward in the radial direction. The spring (2
7. The double-sided coating device according to claim 1, further comprising 7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29397793A JP3437995B2 (en) | 1993-10-29 | 1993-10-29 | Double side coating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29397793A JP3437995B2 (en) | 1993-10-29 | 1993-10-29 | Double side coating device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07130642A JPH07130642A (en) | 1995-05-19 |
JP3437995B2 true JP3437995B2 (en) | 2003-08-18 |
Family
ID=17801651
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29397793A Expired - Fee Related JP3437995B2 (en) | 1993-10-29 | 1993-10-29 | Double side coating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3437995B2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9214372B2 (en) | 2008-08-28 | 2015-12-15 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device and coating device |
US8919756B2 (en) | 2008-08-28 | 2014-12-30 | Tokyo Ohka Kogyo Co., Ltd. | Substrate processing system, carrying device, and coating device |
US8567342B2 (en) | 2009-05-22 | 2013-10-29 | Tokyo Ohka Kogyo Co., Ltd. | Coating device and coating method |
JP5412180B2 (en) | 2009-05-22 | 2014-02-12 | 東京応化工業株式会社 | Coating apparatus and coating method |
JP5666833B2 (en) | 2009-07-06 | 2015-02-12 | 東京応化工業株式会社 | Substrate processing system |
JP5622453B2 (en) | 2009-07-06 | 2014-11-12 | 東京応化工業株式会社 | Coating apparatus and nozzle management method |
JP6019516B2 (en) * | 2012-08-24 | 2016-11-02 | 株式会社Screenホールディングス | Substrate processing equipment |
CN116590673B (en) * | 2023-05-16 | 2023-12-19 | 无锡杰程光电有限公司 | Double-sided coating equipment of backplate at heart rate health monitoring bracelet back |
-
1993
- 1993-10-29 JP JP29397793A patent/JP3437995B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH07130642A (en) | 1995-05-19 |
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