JP2531283Y2 - 半硬銅線の製造装置 - Google Patents
半硬銅線の製造装置Info
- Publication number
- JP2531283Y2 JP2531283Y2 JP1990010405U JP1040590U JP2531283Y2 JP 2531283 Y2 JP2531283 Y2 JP 2531283Y2 JP 1990010405 U JP1990010405 U JP 1990010405U JP 1040590 U JP1040590 U JP 1040590U JP 2531283 Y2 JP2531283 Y2 JP 2531283Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper wire
- semi
- hard copper
- hard
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 52
- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 238000005491 wire drawing Methods 0.000 claims description 6
- 238000005482 strain hardening Methods 0.000 claims description 4
- 238000000137 annealing Methods 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Manufacturing Of Electric Cables (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990010405U JP2531283Y2 (ja) | 1990-02-05 | 1990-02-05 | 半硬銅線の製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990010405U JP2531283Y2 (ja) | 1990-02-05 | 1990-02-05 | 半硬銅線の製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03101818U JPH03101818U (enrdf_load_stackoverflow) | 1991-10-23 |
| JP2531283Y2 true JP2531283Y2 (ja) | 1997-04-02 |
Family
ID=31513977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990010405U Expired - Lifetime JP2531283Y2 (ja) | 1990-02-05 | 1990-02-05 | 半硬銅線の製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2531283Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5952231B2 (ja) * | 1977-01-18 | 1984-12-18 | 住友電気工業株式会社 | ヘツデイング加工性の良好な電子部品リ−ド材の製法 |
| JPS6289520A (ja) * | 1985-10-15 | 1987-04-24 | Tatsuta Electric Wire & Cable Co Ltd | 電子機器部品用端子リ−ド線の接造方法 |
-
1990
- 1990-02-05 JP JP1990010405U patent/JP2531283Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03101818U (enrdf_load_stackoverflow) | 1991-10-23 |
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