JP2531233Y2 - 電子部品実装機における部品搭載ヘッドの取付構造 - Google Patents

電子部品実装機における部品搭載ヘッドの取付構造

Info

Publication number
JP2531233Y2
JP2531233Y2 JP1988004316U JP431688U JP2531233Y2 JP 2531233 Y2 JP2531233 Y2 JP 2531233Y2 JP 1988004316 U JP1988004316 U JP 1988004316U JP 431688 U JP431688 U JP 431688U JP 2531233 Y2 JP2531233 Y2 JP 2531233Y2
Authority
JP
Japan
Prior art keywords
head
mounting
electronic component
component mounting
mounting head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988004316U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01108999U (en, 2012
Inventor
孝之 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Casio Computer Co Ltd
Original Assignee
Casio Computer Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casio Computer Co Ltd filed Critical Casio Computer Co Ltd
Priority to JP1988004316U priority Critical patent/JP2531233Y2/ja
Publication of JPH01108999U publication Critical patent/JPH01108999U/ja
Application granted granted Critical
Publication of JP2531233Y2 publication Critical patent/JP2531233Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1988004316U 1988-01-18 1988-01-18 電子部品実装機における部品搭載ヘッドの取付構造 Expired - Lifetime JP2531233Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988004316U JP2531233Y2 (ja) 1988-01-18 1988-01-18 電子部品実装機における部品搭載ヘッドの取付構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988004316U JP2531233Y2 (ja) 1988-01-18 1988-01-18 電子部品実装機における部品搭載ヘッドの取付構造

Publications (2)

Publication Number Publication Date
JPH01108999U JPH01108999U (en, 2012) 1989-07-24
JP2531233Y2 true JP2531233Y2 (ja) 1997-04-02

Family

ID=31206723

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988004316U Expired - Lifetime JP2531233Y2 (ja) 1988-01-18 1988-01-18 電子部品実装機における部品搭載ヘッドの取付構造

Country Status (1)

Country Link
JP (1) JP2531233Y2 (en, 2012)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5838301B2 (ja) * 2012-01-20 2016-01-06 パナソニックIpマネジメント株式会社 吸着ノズル及び部品実装装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3605590A1 (de) * 1986-02-21 1987-08-27 Suedfinanz S A H Vorrichtung zur kupplung eines montagewerkzeuges, wie greifer oder dergleichen

Also Published As

Publication number Publication date
JPH01108999U (en, 2012) 1989-07-24

Similar Documents

Publication Publication Date Title
US6526651B1 (en) Printed circuit board transferring apparatus of a surface mounter
US5323528A (en) Surface mount placement system
US6189876B1 (en) Method and apparatus for leveling the upper surface of a PCB
US6968610B2 (en) Electronic component mounting device and mounting head unit for electronic component
JP2531233Y2 (ja) 電子部品実装機における部品搭載ヘッドの取付構造
CN211267292U (zh) 一种自动贴片机
JP3245409B2 (ja) 半導体装置
CN217392816U (zh) 一种pcba板自动翻转点胶设备
JP3886230B2 (ja) 電子部品実装装置における多連式移載ヘッドのノズル交換方法
JPH0464283A (ja) 電子部品実装装置
JP2001156492A (ja) 実装機のフィーダー交換装置
JP3150219B2 (ja) 半導体部品製造用リードフレームに対する半導体チップの供給装置
CN214675927U (zh) 一种新型电路板插件机
CN211280271U (zh) 一种多线路矩阵喷码设备
JP4307330B2 (ja) 多層基板用ピン打ち装置
JP2832992B2 (ja) 電子部品実装方法
CN221288496U (zh) 快换装置和点样设备
CN215647632U (zh) 一种pcb板间连接支架、装配治具及伺服驱动器
JP2001185896A (ja) フィーダー取付構造
JPH0314075Y2 (en, 2012)
JPH02132895A (ja) 部品供給装置の段取り替え方法及び電子部品自動装着装置
CN209094935U (zh) 锁螺丝机
KR200262970Y1 (ko) 표면실장기의 마운팅 헤드
JP4417535B2 (ja) スクリーン印刷機
JP2679215B2 (ja) 半導体チップの実装方法