JP2531010B2 - Method of carrying articles and holding tape - Google Patents

Method of carrying articles and holding tape

Info

Publication number
JP2531010B2
JP2531010B2 JP1298718A JP29871889A JP2531010B2 JP 2531010 B2 JP2531010 B2 JP 2531010B2 JP 1298718 A JP1298718 A JP 1298718A JP 29871889 A JP29871889 A JP 29871889A JP 2531010 B2 JP2531010 B2 JP 2531010B2
Authority
JP
Japan
Prior art keywords
holding tape
tape
holding
heating
articles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1298718A
Other languages
Japanese (ja)
Other versions
JPH03162261A (en
Inventor
健司 川端
淳一 糴川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP1298718A priority Critical patent/JP2531010B2/en
Publication of JPH03162261A publication Critical patent/JPH03162261A/en
Application granted granted Critical
Publication of JP2531010B2 publication Critical patent/JP2531010B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Packages (AREA)
  • Packaging Frangible Articles (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、多数の物品を所定ピッチで粘着保持した保
持テープを加熱工程を経由して搬送する物品の搬送方法
及びその実施に使用する保持テープに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of conveying an article in which a holding tape, in which a large number of articles are adhesively held at a predetermined pitch, is conveyed through a heating step, and a holding tape used for carrying out the method. .

従来の技術 電子部品の製造工程において、保持テープに所定ピッ
チで粘着保持された多数のワークを搬送する工程があ
る。第4図(a)、(b)はかかる搬送方法の一従来例
を示しており、パレット等の搬送プレート1上に貼着し
た保持テープ2で多数のワーク3…を所定のピッチaで
貼着保持し、搬送プレート1及び保持テープ2を搬送し
てワーク3の搬送を行う搬送形態をとる。ここに、保持
テープ2としてはポリエステルや紙等を基材とする低価
格の粘着テープが一般に使用される。
2. Description of the Related Art In the manufacturing process of electronic components, there is a process of conveying a large number of works that are adhesively held at a predetermined pitch on a holding tape. FIGS. 4 (a) and 4 (b) show a conventional example of such a conveying method, in which a large number of works 3 are attached at a predetermined pitch a by a holding tape 2 attached on a conveying plate 1 such as a pallet. The work is carried and held, and the carrying plate 1 and the holding tape 2 are carried to carry the work 3. Here, as the holding tape 2, a low-cost adhesive tape having a base material such as polyester or paper is generally used.

発明が解決しようとする課題 ところで、電子部品の製造工程には、ワーク3の外面
に形成される外装樹脂等を加熱・乾燥させる等の樹脂硬
化工程を含むものがあり、上記材質の保持テープ2を用
いてワーク3を樹脂硬化工程を経由して搬送するものと
すれば、樹脂硬化工程中に保持テープ2が大きく収縮
し、加熱工程を得たワーク3…間に熱収縮に起因する位
置ズレα、β…(第4図(b)参照)が発生し、ピッチ
ズレ(a−α、a−β、…)が生じる。かかるピッチズ
レが発生すると、後工程において、例えばチャッキング
装置によりワーク3をチャッキングする際にワーク3が
所望の位置にないためチャッキングミスやワーク3の破
損を招来するという欠点がある。また、稼動率が低下す
るという欠点がある。
SUMMARY OF THE INVENTION By the way, there are processes for manufacturing electronic components that include a resin curing process such as heating and drying an exterior resin or the like formed on the outer surface of the work 3, and the holding tape 2 made of the above material. If the work 3 is conveyed through the resin curing step by using, the holding tape 2 is largely shrunk during the resin curing step, and the work 3 that has undergone the heating step is misaligned due to heat shrinkage. .. (see FIG. 4 (b)) and pitch deviations (a-.alpha., a-.beta., ...) Occur. If such a pitch shift occurs, there is a drawback that, in the subsequent process, when the work 3 is chucked by a chucking device, the work 3 is not in a desired position, and thus a chucking error or a damage to the work 3 is caused. In addition, there is a drawback that the operating rate decreases.

かかる欠点が解消する方法として、例えばポリイミド
系の材料の如き熱収縮率の極めて低い材料で保持テープ
2を作製することが考えられるが、このような材料から
なる保持テープ2は高価であるため、電子部品のコスト
アップに繋がるという新たな欠点がある。
As a method of solving such a defect, it is possible to manufacture the holding tape 2 with a material having an extremely low heat shrinkage rate such as a polyimide-based material. However, since the holding tape 2 made of such a material is expensive, There is a new drawback that leads to an increase in the cost of electronic parts.

本発明はかかる現状に鑑みてなされたものであり、高
温条件下においても保持テープに粘着された多数の物品
相互間のピッチを維持した状態で搬送できる物品の搬送
方法及びその実施に使用する保持テープを提供すること
を目的とする。
The present invention has been made in view of the above circumstances, and a method of conveying an article that can be conveyed in a state in which a pitch between a large number of articles adhered to a holding tape is maintained even under a high temperature condition, and a holding method used for carrying the same. Intended to provide tape.

課題を解決するための手段 上記目的を達成するため、本発明は、多数の物品を保
持テープによって所定ピッチで粘着保持し、加熱工程を
経由して搬送する物品の搬送方法において、前記保持テ
ープを前記加熱工程における加熱温度と同等若しくはそ
れ以上の温度で予め加熱して熱収縮させた後の粘着テー
プで作製し、これにより前記物品を粘着保持して搬送す
ることを特徴としている。
Means for Solving the Problems In order to achieve the above object, the present invention is a method for conveying an article in which a large number of articles are adhesively held at a predetermined pitch by a holding tape, and the article is conveyed through a heating step. It is characterized in that the article is prepared by using an adhesive tape which is preheated at a temperature equal to or higher than the heating temperature in the heating step to be heat-shrinked, and thereby the article is adhesively held and conveyed.

また、本発明は、多数の物品を所定ピッチで粘着保持
し、加熱工程を経由して前記物品を搬送するために供せ
られる保持テープにおいて、前記保持テープが前記加熱
工程における加熱温度と同等若しくはそれ以上の温度で
予め加熱して熱収縮させた後の粘着テープから成ること
を特徴としている。
Further, the present invention, in a holding tape provided for holding a large number of articles by an adhesive at a predetermined pitch and for delivering the article via a heating step, wherein the holding tape has a heating temperature equal to or higher than the heating temperature in the heating step. It is characterized by comprising an adhesive tape which has been preheated at a temperature higher than that to be heat-shrinked.

作用 上記の如く予め所定温度で加熱して熱収縮させた後の
粘着テープで保持テープを作製し、これにより物品を粘
着保持して搬送すると、当該保持テープには既に熱収縮
が発生しているので、その後の搬送工程において、保持
テープが加熱炉等により加熱されたとしても、保持テー
プが当初の状態から大きく収縮することがない。従っ
て、かかる保持テープで多数の物品を所定ピッチで粘着
保持し、加熱工程を経由して搬送させる場合に物品間の
ピッチ変動を可及的に低減できる。
Action As described above, when a holding tape is manufactured by the adhesive tape after being heated at a predetermined temperature to be heat-shrinked in advance, and the article is adhesively held and conveyed by this, heat-shrinkage has already occurred in the holding tape. Therefore, even if the holding tape is heated by a heating furnace or the like in the subsequent conveying step, the holding tape does not significantly shrink from the initial state. Therefore, when a large number of articles are adhesively held at a predetermined pitch with the holding tape and conveyed through the heating process, the pitch fluctuation between the articles can be reduced as much as possible.

実 施 例 以下本発明の一実施例を地面に従って具体的に説明す
る。第1図は本発明に係る保持テープを用いた物品の搬
送方法を電子部品の製造工程に適用した実施例を示す図
面である。
Example Hereinafter, one example of the present invention will be specifically described according to the ground. FIG. 1 is a drawing showing an embodiment in which the method of conveying an article using a holding tape according to the present invention is applied to a manufacturing process of electronic parts.

図上右側の後工程に向けて搬送される搬送プレート
(例えば、パレット)1上には保持テープ2が貼着さ
れ、保持テープ2上には多数のヴーク3…が所定のピッ
チaを設けて粘着される。ワーク3の搬送域には加熱炉
等からなる加熱装置4が設けられる。加熱装置4は、ワ
ーク3を加熱し、例えばこれの外面に形成される外装樹
脂を乾燥させる樹脂硬化工程を行う。
A holding tape 2 is attached on a carrying plate (for example, a pallet) 1 that is carried toward a subsequent process on the right side of the drawing, and a large number of vukes 3 ... Are provided on the holding tape 2 at a predetermined pitch a. To be stuck. A heating device 4 including a heating furnace is provided in the transfer area of the work 3. The heating device 4 performs a resin curing step of heating the work 3 and drying the exterior resin formed on the outer surface of the work 3, for example.

乾燥工程(加熱工程)を経たワーク3…は次いでチャ
ッキング装置5の位置に搬送され、ここで一個ずつチャ
ッキングされて保持テープ2から剥ぎ取られる。剥ぎ取
られたワーク3は、例えば基板に対する実装工程を自動
的に行う自動機に挿入される。
The works 3 that have undergone the drying process (heating process) are then conveyed to the position of the chucking device 5, where they are chucked one by one and peeled off from the holding tape 2. The stripped work 3 is inserted into, for example, an automatic machine that automatically performs a mounting process on a substrate.

保持テープ1は両面粘着テープを予め熱処理して作製
される。それ故、上記作用の項で述べた理由により、ワ
ーク3…を粘着保持した保持テープ2を加熱工程に供し
たとしてもワーク3…間にピッチズレを発生することが
ない。
The holding tape 1 is manufactured by heat-treating a double-sided adhesive tape in advance. Therefore, due to the reason described in the section of the above-mentioned action, even if the holding tape 2 holding the works 3 ... Adhesively is subjected to the heating step, no pitch deviation occurs between the works 3.

第2図は縦軸に収縮率〔%〕を、横軸に熱処理温度
〔℃〕をとって所定の加熱温度、熱処理時間で熱処理し
た保持テープ2を加熱温度が150℃で処理時間が1時間
の樹脂硬化搬送工程を用いた場合の保持テープ2の収縮
率と熱処理条件との関係を示すグラフである。但し、供
試用の保持テープ2としてポリエステルを基材とする粘
着テープを所定の加熱条件下で熱処理したものを用い
た。
In FIG. 2, the vertical axis represents the shrinkage rate [%], the horizontal axis represents the heat treatment temperature [° C], and the holding tape 2 heat-treated at a predetermined heating temperature and heat treatment time is heated at 150 ° C for 1 hour. 6 is a graph showing the relationship between the shrinkage rate of the holding tape 2 and the heat treatment conditions when the resin curing and transporting process is used. However, as the holding tape 2 for the test, an adhesive tape based on polyester which was heat-treated under a predetermined heating condition was used.

第2図から明らかなように、125℃以上の温度で加熱
処理すると、保持テープ2の収縮率が1%以下になるこ
とがわかる。従って、120℃以上の加熱温度で熱処理し
た粘着テープで保持テープ2を作製すると、高温条件下
の搬送工程においてワーク3…間に発生するピッチズレ
を可及的に低減できることになる。
As is clear from FIG. 2, when the heat treatment is performed at a temperature of 125 ° C. or higher, the shrinkage rate of the holding tape 2 becomes 1% or less. Therefore, when the holding tape 2 is made of the adhesive tape that is heat-treated at a heating temperature of 120 ° C. or higher, the pitch deviation generated between the works 3 in the conveying process under high temperature conditions can be reduced as much as possible.

なお、粘着テープの材質としては、ポリエステルを基
材とするものに限定されるものではなく、基材の材質や
基材テープの厚み或いは搬送工程中における加熱条件等
に応じた種々の熱処理条件を設定することにより、高温
条件下における寸法安定性の優れた種々の保持テープを
実現できる。殊に、ポリエテテルの如き安価な基材から
なる粘着テープを熱処理するだけで、ポリイミド系の基
材からなる保持テープなみの寸法安定性が得られるの
で、材料費を大幅に節約でき、電子部品のコストダウン
を図る上で極めて有効なものになる。
The material of the adhesive tape is not limited to the one using polyester as the base material, and various heat treatment conditions according to the material of the base material, the thickness of the base material tape, the heating conditions during the carrying process, etc. may be used. By setting, various holding tapes having excellent dimensional stability under high temperature conditions can be realized. In particular, heat treatment of an adhesive tape made of an inexpensive base material such as polyether can provide dimensional stability similar to that of a holding tape made of a polyimide base material. It is extremely effective in reducing costs.

また、基材としてポリイミド系のものを用いる場合は
収縮率を飛躍的に低減できるので、ワーク3…間の位置
決めが高精度(±0.2%以下)に要求される搬送工程に
使用する場合に特に有効のものになる。
In addition, when a polyimide-based material is used as the base material, the shrinkage rate can be dramatically reduced, so especially when it is used in the transfer process where positioning between the works 3 is required with high accuracy (± 0.2% or less). It becomes effective.

変 形 例 第3図本発明の変形例を示しており、この変形例では
片面粘着テープを熱処理した保持テープ2でワーク3…
を搬送する形態をとる。即ち、この変形例では搬送プレ
ート1を用いず、ワーク3…を粘着した保持テープ2の
みを搬送してワーク3…の搬送行う搬送形態とる。
Modification Example FIG. 3 shows a modification example of the present invention. In this modification example, the work 3 is made up of the holding tape 2 obtained by heat-treating the single-sided adhesive tape.
To take the form. That is, in this modified example, the carrying plate 1 is not used, and only the holding tape 2 to which the works 3 are adhered is carried to carry the works 3.

かかる変形例によれば、搬送手段の構成を簡潔化でき
る利点がある。
According to such a modified example, there is an advantage that the structure of the conveying means can be simplified.

上記実施例では、本発明を電子部品の製造工程中の搬
送工程に適用する場合について述べたが、搬送対象とし
ては上記の如きワークに限定されるものではなく、搬送
工程中に加熱処理を必要とする物品一般の搬送工程に広
く適用できる。
In the above embodiment, the case where the present invention is applied to the carrying step in the manufacturing process of the electronic component is described, but the carrying object is not limited to the work as described above, and the heat treatment is required during the carrying step. It can be widely applied to the transportation process of general articles.

発明の効果 請求項1記載の物品の搬送方法によれば、加熱工程を
得た物品間のピッチズレを可及的に低減できる。従っ
て、物品相互間の位置決め精度の向上が図れ、後工程に
おける物品のチャッキング動作等を迅速、確実に行な
え、物品に破損等の品質上の不具合を発生することがな
い。また、稼動率の向上が図れ、物品の大幅コストダウ
ンが実現できる利点がある。
Advantageous Effects of Invention According to the article transporting method of the first aspect, it is possible to reduce the pitch deviation between the articles that have undergone the heating step. Therefore, the positioning accuracy between the articles can be improved, the chucking operation and the like of the articles in the post-process can be performed quickly and surely, and there is no occurrence of quality problems such as damage to the articles. Further, there is an advantage that the operating rate can be improved and the cost of the article can be significantly reduced.

請求項2記載の保持テープによれば、高温下での寸法
安定性の優れた安価な保持テープを実現できる。
According to the holding tape of the second aspect, it is possible to realize an inexpensive holding tape having excellent dimensional stability at high temperatures.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明に係る搬送体を用いた物品の搬送方法を
示す図面、第2図は縦軸に収縮率〔%〕を、横軸に熱処
理温度〔℃〕をとって所定の加熱温度、熱処理時間で熱
処理した保持テープを加熱温度が150℃で処理時間が1
時間の樹脂硬化搬送工程に用いた場合の保持テープの収
縮率と熱処理条件との関係を示すグラフ、第3図は本発
明の変形例を示す図面である。 第4図は従来の搬送方法を示す図面である。 1……搬送プレート、2……保持テープ、3……ワー
ク、4……加熱装置、5……チャッキング装置。
FIG. 1 is a drawing showing a method of transporting an article using a carrier according to the present invention, and FIG. 2 is a predetermined heating temperature in which the vertical axis represents shrinkage rate [%] and the horizontal axis represents heat treatment temperature [° C.]. , The holding tape that has been heat-treated for the heat treatment time is heated to 150 ° C and the treatment time is 1
FIG. 3 is a graph showing the relationship between the shrinkage rate of the holding tape and the heat treatment conditions when it is used in the resin curing and conveying step for a certain time, and FIG. 3 is a drawing showing a modified example of the present invention. FIG. 4 is a drawing showing a conventional conveying method. 1 ... Transport plate, 2 ... Holding tape, 3 ... Work, 4 ... Heating device, 5 ... Chucking device.

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】多数の物品を保持テープによって所定ピッ
チで粘着保持し、加熱工程を経由して搬送する物品の搬
送方法において、 前記保持テープを前記加熱工程における加熱温度と同等
若しくはそれ以上の温度で予め加熱して熱収縮させた後
の粘着テープで作製し、これにより前記物品を粘着保持
して搬送することを特徴とする物品の搬送方法。
1. A method of conveying an article, wherein a large number of articles are adhesively held by a holding tape at a predetermined pitch and conveyed through a heating step, wherein the holding tape has a temperature equal to or higher than a heating temperature in the heating step. A method of transporting an article, which is produced by using an adhesive tape that has been preheated and heat-shrinked by the above method, and thereby the article is adhesively held and transported.
【請求項2】多数の物品を所定ピッチで粘着保持し、加
熱工程を経由して前記物品を搬送するために供せられる
保持テープにおいて、 前記保持テープが前記加熱工程における加熱温度と同等
若しくはそれ以上の温度で予め加熱して熱収縮させた後
の粘着テープから成ることを特徴とする保持テープ。
2. A holding tape provided for holding a large number of articles with a predetermined pitch by adhesion and conveying the articles via a heating step, wherein the holding tape has a temperature equal to or higher than a heating temperature in the heating step. A holding tape comprising an adhesive tape which is preheated at the above temperature and heat-shrinked.
JP1298718A 1989-11-16 1989-11-16 Method of carrying articles and holding tape Expired - Lifetime JP2531010B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1298718A JP2531010B2 (en) 1989-11-16 1989-11-16 Method of carrying articles and holding tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1298718A JP2531010B2 (en) 1989-11-16 1989-11-16 Method of carrying articles and holding tape

Publications (2)

Publication Number Publication Date
JPH03162261A JPH03162261A (en) 1991-07-12
JP2531010B2 true JP2531010B2 (en) 1996-09-04

Family

ID=17863382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1298718A Expired - Lifetime JP2531010B2 (en) 1989-11-16 1989-11-16 Method of carrying articles and holding tape

Country Status (1)

Country Link
JP (1) JP2531010B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3365058B2 (en) * 1994-07-07 2003-01-08 松下電器産業株式会社 Manufacturing method of chip component assembly and mounting method of chip component

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63175058U (en) * 1987-04-30 1988-11-14
JPS6484817A (en) * 1988-08-10 1989-03-30 Murata Manufacturing Co Production of electronic parts series

Also Published As

Publication number Publication date
JPH03162261A (en) 1991-07-12

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