JPH03162261A - Conveying of article and its retaining tape - Google Patents

Abstract

PURPOSE:To permit a number of articles pressure sensitively adhered on a retaining tape to be conveyed with a predetermined pitch between the articles maintained even under high temperatures by a method wherein the retaining tape is made of a pressure sensitive tape pretreated with heat and the articles are pressure sensitively adhered to the retaining tape for conveying. CONSTITUTION:A retaining tape 2 is adhered on a conveying plate 1 and, on the retaining tape 2, a number of works 3 are adhered at a predetermined pitch (a). A heating device 4 consisting of a furnace is provided in the conveying passage of the work 3 and the works undergo a resin curing process, whereby, by means of the heating device 4, the work 3 is heated and the resin formed on the exterior surface thereof is dried. After the drying process, the works 3 are transferred to a chucking device 5, whereby they are individually chucked and removed from the retaining tape 2. This retaining tape 2 is made of a two-sided pressure sensitive adhesive tape preheated with heat. This eliminates the possibility of causing changes in the pitch between the works 3, when the retaining tape 2 with the works 3 pressure sensitively adhered thereto is subjected to heating process.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a device, etc. that conveys a holding tape holding a large number of articles at a predetermined pitch through a heating process and peels off the articles from the holding tape. The present invention relates to a method for conveying supplies and a holding tape used for carrying out the method.

2. Description of the Related Art In the manufacturing process of electronic components, there is a process of transporting a large number of workpieces that are adhesively held at a predetermined pitch by a holding tape.

FIGS. 4(a) and 4(b) show a conventional example of such a transport method, in which a large number of workpieces 3 are held at a predetermined pitch a using a holding tape 2 stuck on a transport plate 1 such as a pallet. The workpiece 3 is held by adhesive and held by the workpiece 3, and the workpiece 3 is transported by transporting the transport plate 1 and the holding table 2. Here, as the holding tape 2, a low-cost adhesive tape whose base material is polyester or paper is generally used.

By the way, some electronic component manufacturing processes include a resin curing process such as heating and drying the exterior resin formed on the outer surface of the workpiece 3. If the workpiece 3 is conveyed through the resin curing process using the holding tape 2 made of the above-mentioned material, the holding tape 2 will undergo a large thermal contraction during the resin curing process, and the workpiece 3 after the heating process... During this time, positional deviations α, β, etc. (see Fig. 4(b)) occur due to thermal contraction,
Bi-7 chiseling (a-α, a-β, . . . ) occurs. If such a pitch shift occurs, there is a drawback that in a subsequent process, for example, when the work 3 is chucked by a chucking device, the work 3 is not in a desired position, resulting in chunking errors or damage to the work 3. Another drawback is that the operating rate decreases.

As a method to eliminate this drawback, the holding tape 2 is made of a material with extremely low heat shrinkage rate, such as a polyimide material.
However, since the holding tape 2 made of such a material is expensive, it has a new drawback of increasing the cost of electronic components. The present invention has been made in view of the current situation, and provides a method for conveying articles that can be conveyed while maintaining the pitch between a large number of articles adhered to a holding tape even under high temperature conditions, and a holding device used to carry out the method. The purpose is to provide tapes.

i,! 2'.-1 The present invention conveys a holding tape holding a large number of articles at a predetermined pitch through a heating process, and supplies the holding tape to a device or the like that peels off the articles from the holding tape. A method for conveying an article, characterized in that the holding tape is made of an adhesive tape that has been heat-treated in advance at a temperature equal to or higher than the heating temperature in the heating step, and then the article is conveyed while being adhesively held. There is.

The present invention also provides a holding tape that is used for adhesively holding a large number of articles at a predetermined pitch and conveying the articles to a peeling device or the like via a heating process, in which the holding tape is used in the heating process. It is characterized by being made of an adhesive tape that has been heat-treated in advance at a temperature equal to or higher than the heating temperature.

If a holding tape is made from an adhesive tape that has been heat-treated in advance as described above, heat shrinkage will occur in the holding tape at the time of manufacture, so the holding tape may be heated in a heating furnace or the like during the subsequent transportation process. However, the holding tape does not shrink significantly from its original state. Therefore, when a large number of articles are adhesively held at a predetermined pitch using such a holding tape and conveyed through a heating process, pitch fluctuations among the articles can be reduced as much as possible.

An embodiment of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a drawing showing an example in which the method of conveying an article using a holding tape according to the present invention is applied to the manufacturing process of electronic parts. A holding tape 2 is affixed to a conveyor plate (for example, a pallet) 1 that is conveyed toward the subsequent process on the right side of the figure.
A large number of works 3 are adhered onto the holding tape 2 with a predetermined pitch a. A heating device 4 consisting of a heating furnace or the like is provided in the transport area of the workpiece 3 . The heating device 4 heats the workpiece 3 and performs a resin curing process for drying the exterior resin formed on the outer surface of the workpiece 3, for example.

The works 3 that have undergone the drying process (heating process) are then conveyed to the position of the chucking device 5, where they are chaffed one by one and removed from the holding tape 2.

The stripped workpiece 3 is inserted into an automatic machine that automatically performs a mounting process on a board, for example.

The holding tape 2 is produced by heat-treating a double-sided adhesive tape in advance. Therefore, for the reason stated in the above-mentioned operation section, even if the holding tape 2 that adhesively holds the workpieces 3 is subjected to a heating process, no pitch deviation occurs between the workpieces 3. In Figure 2, the vertical axis shows the shrinkage rate [%], and the horizontal axis shows the heat treatment temperature ('
The shrinkage rate of the holding tape 2 and the heat treatment conditions when the holding tape 2 heat-treated at a predetermined heating temperature and heat treatment time using C) is used in a resin curing conveyance process at a heating temperature of 150 ° C. and a treatment time of 1 hour. It is a graph showing the relationship. However, as the sample holding tape 2, an adhesive tape made of polyester and heat-treated under predetermined heating conditions was used.

As is clear from FIG. 2, it can be seen that when heat treated at a temperature of 125° C. or higher, the shrinkage rate of the holding tape 2 becomes 1% or less. Therefore, if the holding tape 2 is made of an adhesive tape that has been heat-treated at a heating temperature of 120° C. or higher, it is possible to reduce as much as possible the misalignment that occurs between the workpieces 3 during the conveyance process under high-temperature conditions.

The material of the adhesive tape is not limited to one based on polyester, and various heat treatment conditions can be used depending on the material of the base material, the thickness of the base tape, the heating conditions during the conveyance process, etc. By setting this, various holding tapes with excellent dimensional stability under high temperature conditions can be realized. In particular, by simply heat-treating an adhesive tape made of an inexpensive base material such as polyester, it is possible to obtain the same dimensional stability as a holding tape made of a polyimide base material.
This can significantly save material costs and is extremely effective in reducing the cost of electronic components.

In addition, when polyimide is used as the base material, the shrinkage rate can be dramatically reduced, so it is suitable for transportation processes that require high precision (±0.2% or less) positioning between workpieces. It is especially effective when used.

Figure 3 shows a modification of the present invention, in which a workpiece 3 is attached using a holding tape 2 made of heat-treated single-sided adhesive tape.
It takes the form of transporting... That is, in this modification, the conveyance plate 1 is not used, and only the holding tape 2 to which the workpieces 3 .

According to this modification, there is an advantage that the configuration of the conveyance means can be simplified. In the above embodiment, a case was described in which the present invention is applied to a dynamic transport process in the manufacturing process of electronic parts, but the object to be transported is not limited to the above-mentioned workpieces, and heat treatment is performed during the transport process. It can be widely applied to the transportation process of necessary goods in general.

4. According to the method for transporting articles recited in claim 1, it is possible to reduce as much as possible the pitch deviation between articles that have undergone the heating process. Therefore,
The positioning accuracy between the articles can be improved, chaffing operations of the articles in the post-process can be performed quickly and reliably, and quality problems such as damage to the articles will not occur.
It also has the advantage of increasing the utilization rate and significantly reducing the cost of goods. According to the holding tape according to the second aspect, it is possible to realize an inexpensive holding tape with excellent dimensional stability under high temperatures.

[Brief explanation of the drawing]

Fig. 1 is a diagram showing a method of transporting articles using the transport body according to the present invention, and Fig. 2 shows the shrinkage rate [%] on the vertical axis and the heat treatment temperature [°C] on the horizontal axis, and shows the predetermined heating temperature. , a graph showing the relationship between the shrinkage rate of the holding tape and the heat treatment conditions when the holding tape is used in a resin curing conveyance process at a heating temperature of 150°C and a processing time of 1 hour. Figure 3 is from this book. It is a drawing showing a modification of the invention. FIG. 4 is a diagram showing a conventional conveyance method. l...Transportation plate, 2...Holding tape, 3...
Workpiece, 4... heating device, 5... chaffing device.

Claims (2)

[Claims] (1) A method for conveying an article, in which a holding tape adhesively holding a large number of articles at a predetermined pitch is conveyed through a heating process, and the article is supplied to a device or the like for peeling off the articles from the holding tape, the holding tape being heated by the heating process. A method for transporting an article, characterized in that the article is prepared using an adhesive tape that has been heat-treated in advance at a temperature equal to or higher than the heating temperature in the process, and then the article is conveyed while being adhesively held. (2) In a holding tape that is used for adhesively holding a large number of articles at a predetermined pitch and conveying the articles to a device or the like that peels them off via a heating process, A holding tape characterized in that it is made of an adhesive tape that has been heat-treated in advance at a temperature equal to or higher than that.