JP2528646Y2 - 電気部品用ウエハー - Google Patents

電気部品用ウエハー

Info

Publication number
JP2528646Y2
JP2528646Y2 JP10590990U JP10590990U JP2528646Y2 JP 2528646 Y2 JP2528646 Y2 JP 2528646Y2 JP 10590990 U JP10590990 U JP 10590990U JP 10590990 U JP10590990 U JP 10590990U JP 2528646 Y2 JP2528646 Y2 JP 2528646Y2
Authority
JP
Japan
Prior art keywords
wafer
punch
resin
connecting piece
punching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP10590990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0463512U (enrdf_load_stackoverflow
Inventor
悟 高橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP10590990U priority Critical patent/JP2528646Y2/ja
Publication of JPH0463512U publication Critical patent/JPH0463512U/ja
Application granted granted Critical
Publication of JP2528646Y2 publication Critical patent/JP2528646Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Manufacture Of Switches (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP10590990U 1990-10-11 1990-10-11 電気部品用ウエハー Expired - Fee Related JP2528646Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10590990U JP2528646Y2 (ja) 1990-10-11 1990-10-11 電気部品用ウエハー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10590990U JP2528646Y2 (ja) 1990-10-11 1990-10-11 電気部品用ウエハー

Publications (2)

Publication Number Publication Date
JPH0463512U JPH0463512U (enrdf_load_stackoverflow) 1992-05-29
JP2528646Y2 true JP2528646Y2 (ja) 1997-03-12

Family

ID=31851789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10590990U Expired - Fee Related JP2528646Y2 (ja) 1990-10-11 1990-10-11 電気部品用ウエハー

Country Status (1)

Country Link
JP (1) JP2528646Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH0463512U (enrdf_load_stackoverflow) 1992-05-29

Similar Documents

Publication Publication Date Title
US5139969A (en) Method of making resin molded semiconductor device
US5359761A (en) Method of making a header or housing for electrical connection to a hybrid circuit including an in-cavity trim of a terminal frame
JP4390857B2 (ja) 挿入絶縁体モールドバッテリ接点および製造方法
JPS62209844A (ja) 封入式テ−プ自動接着化集積回路モジユ−ルのための表面装着自在包装装置
JP2528646Y2 (ja) 電気部品用ウエハー
JPH07320969A (ja) コイル装置の製造方法
JPH0526741Y2 (enrdf_load_stackoverflow)
JPH07335815A (ja) リードフレーム及びこれを用いた半導体装置
JP3860659B2 (ja) キャリアテープ
JP2514858Y2 (ja) 樹脂バリ除去装置
JPH04371329A (ja) スプロケットの製造方法
JPH0735403Y2 (ja) リードフレーム
JPH04333245A (ja) プラスチック集積回路パッケージを製造するための金型
JPH0582981B2 (enrdf_load_stackoverflow)
JP2970066B2 (ja) リードフレームの製造方法
JP2606449Y2 (ja) 平形接続端子
JP3277488B2 (ja) 押釦スイッチ
JP3766206B2 (ja) フィルム基板の固定方法
JPH02280360A (ja) 半導体パッケージ
JPH1027875A (ja) リードフレーム及びその成形装置
JP3045090U (ja) 電気装置
JPH0311697A (ja) 電気機器の製造方法
JPS63147353A (ja) 半導体装置用リ−ドフレ−ム
JPH01272069A (ja) Icソケットの製造方法
JPH042489A (ja) 樹脂成形品の金属突片切断方法

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees