JP2526000Y2 - 加熱圧着体の加熱温度測定用熱電対 - Google Patents
加熱圧着体の加熱温度測定用熱電対Info
- Publication number
- JP2526000Y2 JP2526000Y2 JP1990400496U JP40049690U JP2526000Y2 JP 2526000 Y2 JP2526000 Y2 JP 2526000Y2 JP 1990400496 U JP1990400496 U JP 1990400496U JP 40049690 U JP40049690 U JP 40049690U JP 2526000 Y2 JP2526000 Y2 JP 2526000Y2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- thermocouple
- temperature
- thermocompression bonding
- heating temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 title claims description 12
- 239000002184 metal Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 28
- 239000012212 insulator Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 21
- 239000011889 copper foil Substances 0.000 description 18
- 229910001006 Constantan Inorganic materials 0.000 description 14
- 239000004973 liquid crystal related substance Substances 0.000 description 12
- 239000011888 foil Substances 0.000 description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000009529 body temperature measurement Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990400496U JP2526000Y2 (ja) | 1990-12-13 | 1990-12-13 | 加熱圧着体の加熱温度測定用熱電対 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990400496U JP2526000Y2 (ja) | 1990-12-13 | 1990-12-13 | 加熱圧着体の加熱温度測定用熱電対 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0488066U JPH0488066U (enrdf_load_stackoverflow) | 1992-07-30 |
JP2526000Y2 true JP2526000Y2 (ja) | 1997-02-12 |
Family
ID=31878734
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990400496U Expired - Fee Related JP2526000Y2 (ja) | 1990-12-13 | 1990-12-13 | 加熱圧着体の加熱温度測定用熱電対 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2526000Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-12-13 JP JP1990400496U patent/JP2526000Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH0488066U (enrdf_load_stackoverflow) | 1992-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2526000Y2 (ja) | 加熱圧着体の加熱温度測定用熱電対 | |
JPH10112584A (ja) | 回路基板の接続方法、回路基板の接続構造及びその構造を用いた液晶装置 | |
JPS61147125A (ja) | シ−ト形感温プロ−ブ | |
JP2005321260A (ja) | 温度分布測定シートとそれを用いる温度分布測定方法 | |
JP2877055B2 (ja) | 熱圧着装置 | |
JPH07212036A (ja) | 超音波溶着による回路接続方法 | |
JP2002222829A (ja) | 液晶表示装置の製造方法 | |
JPH03133621A (ja) | 加熱圧着用ヘッド | |
JP2022110649A (ja) | 温度センサ用の超音波接合装置及び超音波接合方法 | |
JP3729813B2 (ja) | アウターリードボンディング装置 | |
JP2508652Y2 (ja) | 液晶表示装置 | |
JP2941345B2 (ja) | プリント配線板の表面温度測定方法 | |
JP2004177503A (ja) | 圧着装置の平衡度検出方法 | |
JP3087160B2 (ja) | 表示装置 | |
JPH02228094A (ja) | 回路基板接続方法 | |
JPH0238497Y2 (enrdf_load_stackoverflow) | ||
JPS622122Y2 (enrdf_load_stackoverflow) | ||
JPH0677279U (ja) | ヒーターチップ | |
JPH0641266Y2 (ja) | 液晶パネル構造 | |
JPH06118431A (ja) | 熱圧着装置 | |
JPH068615Y2 (ja) | 分割型表示盤 | |
JPH0666361B2 (ja) | ボンディング装置及びボンディング方法 | |
JPH0625960Y2 (ja) | ボンディングツール | |
JPH06194678A (ja) | ヒートシールコネクタ | |
JPS6244482Y2 (enrdf_load_stackoverflow) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |