JP2524955C - - Google Patents
Info
- Publication number
- JP2524955C JP2524955C JP2524955C JP 2524955 C JP2524955 C JP 2524955C JP 2524955 C JP2524955 C JP 2524955C
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- space
- air
- pot
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011347 resin Substances 0.000 claims description 161
- 229920005989 resin Polymers 0.000 claims description 158
- 238000000465 moulding Methods 0.000 claims description 41
- 238000010438 heat treatment Methods 0.000 claims description 29
- 230000000903 blocking Effects 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 239000007789 gas Substances 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 19
- 238000007599 discharging Methods 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 description 21
- 229910004682 ON-OFF Inorganic materials 0.000 description 19
- 238000009423 ventilation Methods 0.000 description 8
- 230000000875 corresponding Effects 0.000 description 7
- 238000003825 pressing Methods 0.000 description 7
- 238000004891 communication Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000005755 formation reaction Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000002195 synergetic Effects 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 230000003213 activating Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000567 combustion gas Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 230000001771 impaired Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000002093 peripheral Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000246 remedial Effects 0.000 description 1
- 230000000630 rising Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Family
ID=
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2524955B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
US5435953A (en) | Method of molding resin for sealing an electronic device | |
JP3423766B2 (ja) | 電子部品の樹脂封止成形方法及び金型装置 | |
US20010003385A1 (en) | Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein | |
JP5468574B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH09117931A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
US20090045548A1 (en) | Press with plate-like frame parts, and method for operating such a plate press | |
JP5511724B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JP3751325B2 (ja) | 電子部品の樹脂封止成形方法 | |
JP2524955C (ko) | ||
JP2007281364A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH0682698B2 (ja) | 半導体素子の自動連続化トランスファ樹脂モールド成形方法 | |
JP3581759B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH0864623A (ja) | 半導体装置の樹脂封止方法、及び該樹脂封止方法に用いられる樹脂封止装置 | |
JP3572140B2 (ja) | 電子部品の樹脂封止成形方法 | |
JPH0737051B2 (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH09252017A (ja) | 電子部品の樹脂封止成形方法 | |
JPH0687470B2 (ja) | 半導体装置の樹脂封止装置 | |
JPH05111932A (ja) | 樹脂成形用プレス | |
GB2280144A (en) | Apparatus for sealing semiconductor devices | |
JP2639858B2 (ja) | 電子部品の樹脂封止成形方法 | |
JP2518661B2 (ja) | 半導体素子の樹脂封止成形方法及び装置 | |
JPH05200769A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JP2015144200A (ja) | モールド金型、樹脂モールド装置及び樹脂モールド方法 | |
JP2694293B2 (ja) | 高圧縮成形樹脂タブレットの成形方法 |