JP2524896Y2 - 円形化合物半導体基板 - Google Patents
円形化合物半導体基板Info
- Publication number
- JP2524896Y2 JP2524896Y2 JP1987022251U JP2225187U JP2524896Y2 JP 2524896 Y2 JP2524896 Y2 JP 2524896Y2 JP 1987022251 U JP1987022251 U JP 1987022251U JP 2225187 U JP2225187 U JP 2225187U JP 2524896 Y2 JP2524896 Y2 JP 2524896Y2
- Authority
- JP
- Japan
- Prior art keywords
- compound semiconductor
- semiconductor substrate
- substrate
- cleavage
- circular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 32
- 239000004065 semiconductor Substances 0.000 title claims description 17
- 150000001875 compounds Chemical class 0.000 title claims description 14
- 238000003776 cleavage reaction Methods 0.000 claims description 24
- 230000007017 scission Effects 0.000 claims description 24
- 239000013078 crystal Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987022251U JP2524896Y2 (ja) | 1987-02-17 | 1987-02-17 | 円形化合物半導体基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987022251U JP2524896Y2 (ja) | 1987-02-17 | 1987-02-17 | 円形化合物半導体基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63131135U JPS63131135U (enrdf_load_stackoverflow) | 1988-08-26 |
| JP2524896Y2 true JP2524896Y2 (ja) | 1997-02-05 |
Family
ID=30819459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987022251U Expired - Lifetime JP2524896Y2 (ja) | 1987-02-17 | 1987-02-17 | 円形化合物半導体基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2524896Y2 (enrdf_load_stackoverflow) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60102786A (ja) * | 1983-11-09 | 1985-06-06 | Toshiba Corp | 棒状単結晶体製造方法 |
| JPH0638536B2 (ja) * | 1985-02-08 | 1994-05-18 | 株式会社東芝 | 半導体レ−ザ−の製造方法 |
-
1987
- 1987-02-17 JP JP1987022251U patent/JP2524896Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63131135U (enrdf_load_stackoverflow) | 1988-08-26 |
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