JP2523691Y2 - 基板加熱装置 - Google Patents
基板加熱装置Info
- Publication number
- JP2523691Y2 JP2523691Y2 JP10063590U JP10063590U JP2523691Y2 JP 2523691 Y2 JP2523691 Y2 JP 2523691Y2 JP 10063590 U JP10063590 U JP 10063590U JP 10063590 U JP10063590 U JP 10063590U JP 2523691 Y2 JP2523691 Y2 JP 2523691Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- plate
- hot plate
- support
- elevating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 55
- 238000010438 heat treatment Methods 0.000 title claims description 28
- 230000003028 elevating effect Effects 0.000 claims description 17
- 230000007246 mechanism Effects 0.000 claims description 15
- 230000000694 effects Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10063590U JP2523691Y2 (ja) | 1990-09-25 | 1990-09-25 | 基板加熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10063590U JP2523691Y2 (ja) | 1990-09-25 | 1990-09-25 | 基板加熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0459133U JPH0459133U (enrdf_load_stackoverflow) | 1992-05-21 |
JP2523691Y2 true JP2523691Y2 (ja) | 1997-01-29 |
Family
ID=31843422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10063590U Expired - Lifetime JP2523691Y2 (ja) | 1990-09-25 | 1990-09-25 | 基板加熱装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2523691Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-09-25 JP JP10063590U patent/JP2523691Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0459133U (enrdf_load_stackoverflow) | 1992-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101061651B1 (ko) | 가열 장치 및 가열 방법 | |
JP3963846B2 (ja) | 熱的処理方法および熱的処理装置 | |
KR20160017699A (ko) | 베이크 유닛, 이를 포함하는 기판 처리 장치 및 방법 | |
TW201126643A (en) | Substrate mounting mechanism and substrate processing apparatus using same | |
JP2523691Y2 (ja) | 基板加熱装置 | |
JPH1076211A (ja) | 減圧乾燥装置 | |
US5201653A (en) | Substrate heat-treating apparatus | |
KR101031464B1 (ko) | 기판처리장치 및 기판처리방법 | |
JP2521227Y2 (ja) | 基板加熱装置 | |
TW201543600A (zh) | 熱處理裝置 | |
JP2619563B2 (ja) | 基板熱処理装置 | |
JPH10102259A (ja) | 基板突き上げ機構 | |
JP3451166B2 (ja) | 基板熱処理装置 | |
JP4153686B2 (ja) | 成膜液乾燥装置 | |
KR102587859B1 (ko) | 노즐 유닛과 이를 이용하는 기판 처리 장치 및 기판 처리 방법 | |
KR102119681B1 (ko) | 리프트 핀 어셈블리 및 이를 갖는 베이크 장치 | |
KR102224987B1 (ko) | 가열 처리 장치 | |
KR102076593B1 (ko) | 기판처리장치 | |
JP3609266B2 (ja) | 基板処理装置 | |
JPH0220826Y2 (enrdf_load_stackoverflow) | ||
JP2980433B2 (ja) | カセットチャンバ | |
KR20220036566A (ko) | 기판 처리 장치 | |
JP3349860B2 (ja) | ロボット及び半導体製造装置 | |
JP4015015B2 (ja) | 熱処理装置 | |
JPH04238892A (ja) | 基板加熱装置 |