JP2523605B2 - Electronic component mounting method - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electronic component mounting method for mounting an electronic component at a predetermined position on a substrate.

2. Description of the Related Art In recent years, as factory equipment has been automated and higher productivity is required, electronic component mounting methods are required to have high performance and high functionality.

An example of the conventional electronic component mounting method described above will be described below with reference to the drawings. FIG. 3 is a perspective view of an electronic component mounter having a circulating movement type component supply mechanism, FIG. 4 is a flow chart of the operation of a conventional electronic component mounting method, and FIG. 5 is a conceptual diagram of the circulating movement type component supply mechanism. . In FIG.
Reference numeral 1 is a component holder mounting ring, and 2 is a component holder, and a plurality of component holder mounting rings are mounted on the component holder mounting ring. A plurality of component supply cassettes 3 are placed around the periphery of 1. Four
a and 4b are component insertion heads (hereinafter abbreviated as heads),
Reference numeral 5 is a main operation panel having a keyboard (hereinafter, abbreviated as an operation panel), 6 is a control device (hereinafter, abbreviated as a control device) for controlling the entire process of the electronic component mounting method, and 7 is XY.
It's a table. In FIG. 4, step 1 is a supply step of supplying an electronic component from the component supply cassette to the component holder and moving it to the position of the head, and step 2 is discharging the electronic component from the component holder to the head and mounting the electronic component on the substrate. This is the mounting process. In FIG. 5, 1 is a component holder mounting ring, 2a and 2b are component holders, 3a and 3b are component supply cassettes, 4 is a head, A is an electronic component, which is loaded in the component supply cassette 3a. , B are electronic components, which are loaded in the component supply cassette 3b. Further, FIG. 5 (a) is a state before the electronic component is supplied from the component supply cassette to the component holder, and FIG. 5 (b) is a state in which the electronic component A is supplied from the component supply cassette 3a to the component holder 2a. 5 (c) shows a state in which the electronic component B is supplied from the component supply cassette 3b to the component holder 2b, and FIG. 5 (d) shows a state in which the component holder has moved to the position of the head.

Regarding the electronic component mounting method configured as described above,
The operation will be described below. Focusing on one component holder, after starting, the electronic component is supplied to the component holder in the supply step of FIG. 4 step 1 and moves to the position of the head, and the mounting step of FIG. 4 step 2 is performed. Then, the electronic component is discharged from the component holder to the head and mounted on the substrate. The empty component holder moves to the position of the component supply cassette in order to supply the electronic component again. In the steps 1 and 2 in FIG. 4, the state of the component supply unit is not judged,
Electronic components are unconditionally supplied and discharged.

The above is one example of the conventional electronic component mounting method, but a more specific example will be described using the circulating movement type component supply mechanism. In order to mount the electronic parts on the board in the order of A and B, the heads must be arranged in the order of A and B. This is done by the circulation type component supply mechanism. When the component holders 2a and 2b for receiving the electronic components A and B are defined as shown in FIG. 5 (a), the component holder 2a is located at the position of the component supply cassette 3a as shown in FIG. 5 (b). When it comes, the electronic component A is supplied. Furthermore, the component holder mounting ring 1 rotates, and FIG. 4 (c)
When the component holder 2b reaches the position of the component supply cassette 3b as described above, the electronic component B is supplied. Then, as shown in FIG. 4D, the electronic components A and B are arranged in this order, the electronic components are supplied to the head in the order A and B, and the head is mounted on the substrate.

Problems to be Solved by the Invention However, in the above configuration, the component holder is
If any of them becomes defective, the defective component holder drops the component, or even if the component is retained, the component was not mounted correctly in the mounting process, so the mounting rate decreases, so replace the component holder. Since the machine had to be stopped until, the operating rate fell.

Means for Solving the Problems In order to solve the above problems, the electronic component mounting method of the present invention is configured such that a plurality of component holders are simultaneously moved continuously in a predetermined circulation path in one direction, and a plurality of component holders are provided in the vicinity of the circulation movement path. A step of receiving a component from a component supply unit arranged at a predetermined position and supplying the component to a mounting head arranged at another predetermined position near the circulation path, and a component supplied by a component holder by the mounting head. An electronic component mounting method comprising a mounting step of mounting a component on a printed circuit board, wherein unused components of a plurality of component holders are designated in advance, and components corresponding to unused components are designated based on the designation. When the holder reaches the component supply unit, the component supply unit and the component holder are controlled so that they pass through the component holder without performing the component transfer operation until the next component holder that does not correspond to non-use arrives. You It is characterized by that.

Effect The present invention has the above-described configuration, so that even if an abnormality occurs in one or more of the plurality of component holders, continuous operation can be performed by using another good component holder without stopping the operation of the machine. As a result, the operating rate is improved and it is not necessary to forcibly operate using the defective component holder, so that the mounting rate is improved and the number of man-hours required to correct mounting errors can be reduced.

Embodiment Hereinafter, an electronic component mounting method according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a flow chart of an electronic component mounting method in an embodiment of the present invention, FIG. 2 is a conceptual diagram of a circulating movement type component supply mechanism,
FIG. 3 is a perspective view of an electronic component mounter having a circulating movement type component supply mechanism.

In FIG. 1, step 3 is a first control step, step 6 is a second control step, step 8 is a third control step, step 4 is a registration step, step 5 is a start step, step 7
Is a supply process, and step 9 is a mounting process.

In FIG. 2, 1 is a component holder mounting ring, 2a, 2b,
2c is a component holder, 3a and 3b are component supply cassettes, and 4 is a head. A is an electronic component, which is loaded in the component supply cassette 3a, and B is an electronic component, which is loaded in the component supply cassette 3b. Further, FIG. 2A shows a state before the electronic component is supplied from the component supply cassette to the component holder, and FIG. 2B shows a state where the electronic component A is supplied from the component supply cassette 3a to the component holder 2a. 2 (c) shows a state in which no electronic component has been supplied to the component holder 2b, and FIG. 2 (d) shows a state in which the electronic component B has been supplied from the component supply cassette 3b to the component holder 2c. FIG. 2 (e) is a state in which the electronic component A is ejected from the component holder 2a to the head 4, FIG. 2 (f) is a state in which the electronic component A is not ejected from the component holder 2b to the head 4, and FIG. The electronic component B is discharged from the component holder 2c to the head 4. Since FIG. 3 has been described in the above-mentioned conventional technique, it is omitted here.

The operation of the electronic component mounting method configured as described above will be described below. Focusing on one component holder, how the software operates will be described with reference to FIG. First, it is judged in the first control process whether there is a defective component holder, and if there is, the number of the defective component holder is registered in the next registration process, and the mounting start is instructed in the starting process. After the start, first, in the second control step, it is determined whether or not the component holder at the position of the component supply cassette is normal. Next, in the third control step, it is determined whether the component holder at the position of the head is normal, and if it is determined to be normal, the mounting step is performed. Furthermore, a concrete example will be given based on the conceptual diagram of FIG.

As shown in FIG. 2A, the component holder supplied with the electronic component A is 2a, the component holder supplied with the electronic component B is 2b, and the next component holder is 2c. 2b is defective. Therefore, it is assumed that this is registered on the operation panel 5 in FIG. It is also assumed that the component holder mounting ring is counterclockwise (counterclockwise).

The component holder moves, and when the component holder 2a comes to the position of the component supply cassette 3a as shown in FIG. 2B, the electronic component A is supplied because 2a is normal. When the component holder 2b reaches the position of the component supply cassette 3b as shown in FIG. 2C, the electronic component B is not supplied and the electronic component B is not supplied because the component 2b is registered as defective. Next, as shown in FIG. 3D, the normal component holder 2c is supplied. And the component holder
Since 2a is normal, the electronic component A is ejected to the head 4 when it comes to the position of the head 4 as shown in FIG. 2 (e), but the next component holder 2b is defective as shown in FIG. 2 (f). Since the electronic component is not held, the electronic component is not discharged to the head 4, and the electronic component B is discharged from the next component holder 2c to the head 4 and mounted as shown in FIG. 2 (g). is there.

EFFECTS OF THE INVENTION As described above, the present invention divides a plurality of component holders that are not used, and uses the electronic component mounting method that controls not to use the component holders based on the division. Compared with the conventional electronic component mounting method, continuous operation becomes possible by using other good component holders without stopping the operation of the machine, improving the operating rate, and using bad component holders by force. Since it is not necessary to operate it, the mounting rate has improved and the man-hours required to correct mounting mistakes have become possible.

[Brief description of drawings]

FIG. 1 is a flow chart of an electronic component mounting method according to an embodiment of the present invention, and FIG. 2 is a conceptual diagram of a circulating movement type component mechanism.
(A) is a plan view showing a state before the electronic component is supplied from the component supply cassette to the component holder, (b) is a plan view showing a state where the electronic component is supplied from the component supply cassette to the component holder, (C) is a plan view showing a state in which an electronic component is not supplied because the component holder is defective, and (d) is a plan view showing a state in which an electronic component is supplied from the component supply cassette to the component holder. , (E) is a plan view showing a state where the electronic component is discharged from the component holder to the head, and (f) shows a state where the electronic component is not discharged to the head because the component holder is defective. FIG. 3G is a plan view showing a state in which electronic parts are ejected from the part holder to the head.
FIG. 4 is a perspective view of an electronic component mounter having a circulating movement type component supply mechanism, FIG. 4 is a flow chart of a conventional electronic component mounting method, and FIG. 5 is a conceptual diagram of a conventional circulating movement type component supply mechanism.
(A) is a plan view showing a state before the electronic component is supplied from the component supply cassette to the component holder, (b) is a plan view showing a state where the electronic component is supplied from the component supply cassette to the component holder, (C) is a plan view showing a state in which an electronic component is supplied from the component supply cassette to the component holder, and (d) is a plan view showing a state in which the component holder is moved to the position of the head. 1 ... Parts holder mounting ring, 2a, 2b, 2c ... Parts holder, 3a, 3b ... Parts supply cassette, 4 ... Head.

Claims (1)

(57) [Claims] 1. A plurality of component holders are simultaneously moved continuously in a predetermined circulation path in one direction to receive a component from a component supply unit arranged at a predetermined position in the vicinity of the circulation movement path, and in the vicinity of the circulation path. An electronic component mounting method comprising: a supplying step of supplying the component to a mounting head arranged at another predetermined position; and a mounting step of mounting the component supplied by the component holder by the mounting head on a printed board. , The unused one of a plurality of component holders is designated in advance, and when the component holder corresponding to the unused portion reaches the component supply unit based on this designation, it corresponds to the next unused portion. An electronic component mounting method, characterized in that the component supply unit and the component holder are controlled so that the component holder does not pass through the component holder until the component holder arrives.