KR19980075370A - Integrated operating system of chip mounting equipment on PCB - Google Patents

Abstract

The present invention provides a comprehensive operating system of a chip mounting facility on a PCB substrate.

The integrated operating system of the chip mounting equipment on the PCB substrate includes a loader 10, a printer 20, a dispenser 30, a high speed mounting apparatus 40, a dissimilar component mounting apparatus 50, In a chip mounting system on a PCB substrate including a reflow furnace 60 and an unloader 60, a component coder, a product name, a size of a standard component, a part thickness, a form of supply, a part library, Storage means of parts information data composed of CHIP unit price field, model name, organization name, release name, number of parts, mounting number, high speed program name, variant program name, bonding program name, IC chip specification, PCB S / N, sample number To set up and control each of the above facilities of a PCB substrate 1 of any kind, and mounting equipment on the PCB substrate 1 of a variety of chips and components, including means for storing model information data comprising a bond requirement field. It is characterized by having a computer (80).

As a result, it is easy to set up each facility when producing a variety of models, and to easily manage inventory of each chip and parts, and also to change easily in case of a model change or a change of parts. Even if there is no fear of occurrence, it can be easily changed, and there is no fear of malfunction.

Description

Integrated operating system of chip mounting equipment on PCB

The present invention relates to a comprehensive operating system of a chip mounting facility on a PCB substrate, and more particularly to the setup of facilities for mounting various chips and components on a PCB substrate of any one model among a plurality of models. The present invention relates to a comprehensive operating system of a chip mounting facility on a PCB substrate that can facilitate management of individual chips and components.

In general, some chips and components are fixed and mounted by soldering, etc. through the mounting holes of the PCB 1 by inserting the lead pins of the chips and components through a self-insertion process, or some other chips and components are mounted in a mounting process. This is fixed and mounted by soldering or the like on the upper surface of the PCB substrate 1 without penetrating the PCB substrate 1.

The mounting process, as shown in Figure 1, PCB substrate loading step (S1), lead printing or bond dispensing step (S2), high-speed mounting step (S3), release chip mounting step (S4), inspection step ( S5), the melt fixing step (S6), the soldering step (S7) and the unloading step (S8). In the PCB substrate loading step (S1), a predetermined model for mounting a plurality of chips and components by the loader 10 is chip mounting in which one PCB substrate 1 is loaded from a magazine in which a plurality of PCB substrates 1 are loaded. In the lead printing or bond dispensing step (S2), molten lead is placed in the pin installation portion of the mounting chip on the PCB 1 by the printer 20 according to a predetermined control program. Bonds are applied to the main body of the mounting chip of the PCB 1 by means of the dispenser 30. When lead is printed, the soldering step S7 may be omitted later.

Subsequently, in the high speed mounting step S3, the same type chips are extracted from the plurality of reels, which are classified into the same chips according to a predetermined program and separately stacked by the high speed mounting apparatus 40, and the PCB substrate 1 is removed. A plurality of sets of identical chips are sequentially arranged and attached to each predetermined position on the image. Therefore, at this stage, mainly rotary part feeding means are used.

On the other hand, the predetermined chip mounting step (S4) by the Airson dissimilar component mounting apparatus 50, each of the predetermined parts on the PCB substrate 1 from the plurality of reels in which the dissimilar components are loaded according to a predetermined control program. It is placed and attached to the position of. Therefore, in this case, each component or chip is disposed at a predetermined position on the PCB substrate 1 by mainly X, Y, and Z motions.

In this way, when the same type and different types of chips and components to be mounted are arranged, it is checked whether a predetermined standard product is disposed at a predetermined position on the predetermined PCB substrate 1 in the inspection step S5. In S6), the PCB and the component on which the chips are placed and attached are raised to a predetermined temperature in the REFLOW FURNACE 60 to melt and fix lead, and to harden the bond to harden the bonds and the components. Are fixedly mounted on the PCB substrate (1). Then, the PCB substrate 1 on which the chips and components are fixed is removed from the chip mounting facility by the unloader 60 and automatically stored in the magazine.

However, the steps of the mounting process and the necessary equipments of this configuration are controlled by a predetermined program according to the type of each equipment and the model of the PCB substrate 1 for mass production, but still many models If the production model becomes excessive due to the production of different types of components, it is not only complicated to set up the management of each step or installing the program of each equipment due to the change of the model or the change of parts, but also easy to cause misoperation. The management of inventory, receipt and retrieval, and reel management are also problematic.

Accordingly, the present invention has been invented to solve the above problems, and comprehensively set up the facilities for mounting various chips and components on a PCB substrate of any one of a plurality of models, and manage each chip and components. Its purpose is to provide a comprehensive operating system of chip mounting equipment on a PCB substrate that can be facilitated.

1 is a block diagram of each step of the chip mounting facility on a conventional PCB substrate;

Figure 2 is a perspective view schematically showing the configuration of a comprehensive operating system of the chip mounting facility on a PCB substrate according to an embodiment of the present invention,

3 is a schematic plan view of a substrate for explaining a process for automatically attaching various components on a PCB substrate.

Explanation of symbols on the main parts of the drawings

1: substrate 10: loader

20: printer 30: dispenser

40: high speed mounting device 50: release chip mounting device

60: REFLOW FURNACE

70: Unloader 80: Computer

I: insertion point M: mounting origin

In order to achieve this object, a comprehensive operating system of a chip mounting facility on a PCB board according to the present invention includes a loader for automatically inserting a PCB board into a chip mounting facility, and a chip for mounting a PCB board by the loader. A printer for placing molten lead in a pin installation portion of the pin, a dispenser for applying a bond to attach the chip to a main body of a mounting chip of the PCB, and a plurality of reels each classified and loaded into the same chips A high-speed mounting apparatus for sequentially placing and attaching a plurality of sets of identical chips to respective predetermined positions on the PCB substrate, and each of the different components on the PCB substrate one by one from a plurality of reels loaded with different components. Heterogeneous component mounting device for placing and attaching at the position of, and raising the PCB board to which the chips and components are placed and attached to a predetermined temperature The reflow furnace to fix the bonds, harden the bonds and fix the chips and parts on the PCB board, and the unloader which removes the PCB boards to which the chips and parts are fixed from the chip mounting facility and automatically stores them in the magazine. In a chip mounting system on a PCB substrate comprising a component coder, product name, specification, component size, component thickness, supply type, component library, CHIP unit price storage means for storing the component accuracy data, The model name, engine name, release name, number of parts, mounting points, high speed program name, variant program name, bonding program name, IC CHIP standard, PCB S / N, sample number, and bond requirements are stored. And a computer for setting up and controlling each type of PCB substrate of any type and of the mounting fixtures of the various chips and components on the PCB substrate. And that is characterized.

The release of the plurality of reels in which the chips and components are loaded from the storage means for storing the component information data of the computer and the storage means for the model information data, the model name, the board name, the sample number, the list name, the mounting number, the number of parts, It is divided into fields such as IC standard, equipment name, program name for each equipment, parts change details, reel number, parts coder, product name, standard, location, and raw water field, and outputs for each equipment, each part, and each reel. It can be configured to enable the management of each reel can be easily performed.

In addition, the computer includes a lot information storage means composed of a lot number and a lot size field for each model in the step of receiving each chip and parts and producing each lot, thereby facilitating the management of the inventory of parts and the like. It is preferable that the LAN is configured to load the program to be executed according to the model by the computer 80, and the release can immediately respond to the change by including a circuit change or a part specification change field. In the case of performing chip mounting facilities after completion of the insertion, the coordinate fields of the chips and parts whose coordinates on the PCB substrate 1 of the chips and components according to the facilities are converted from the insertion point to the mounting origin are modeled. What is included in the information data coincides with the advancing direction of the PCB substrate 1 so that the coordinate system can be set.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a schematic perspective view of the configuration of a comprehensive operating system of a chip mounting facility on a PCB substrate according to an embodiment of the present invention.

In Figure 2, the integrated operating system of the chip mounting process on the PCB substrate according to the present invention, the loader 10, the printer 20, the dispenser 30, the high-speed mounting device 40, dissimilar parts mounting device 50 , Reflow furnace 60, unloader 60, and computer 80.

The loader 10 is configured to automatically input the PCB board 1 of a predetermined model from the magazine to the chip mounting facility, and the printer 20 is loaded according to a predetermined program according to each model by an internal micom. It is configured to apply molten lead to the pins of the mounting chips and components on the PCB substrate 1 introduced by (10). The dispenser 30 is configured to apply bonds to body parts other than the pins for mounting chips and components on the PCB substrate 1. In some cases, both molten lead and bond may be applied, and only one may be applied if necessary, and when the bond is dispensed, it may be cured by the reflow furnace 60 and then separately soldered.

The high-speed mounting apparatus 40 is a device for arranging and fixing the same plurality of chips and components (mainly chips), and a plurality of chips from each reel of a plurality of reels loaded in a reel cassette by one type of required amount. Each predetermined load on the PCB substrate 1 by unloading the chip at predetermined positions of the PCB substrate 1 determined by the XY movement under the opposite rotary transfer apparatus while being loaded by the rotary transfer apparatus and rotating to the opposite side. And to sequentially place and attach a plurality of sets of identical chips at the position of. This is also controlled by an internal microcomputer and a predetermined program.

The dissimilar component mounting device 50 is a device for disposing dissimilar chips and components, and arranges dissimilar chips or components, thereby distributing the dissimilar components in a predetermined order by X, Y, and Z movement means rather than a rotary transfer apparatus. It is configured to arrange and attach heterogeneous components one by one at a predetermined position on the PCB substrate 1 one by one from a plurality of stacked reels.

The reflow furnace 60 is composed of a plurality of furnaces by gradually heating and gradually cooling the PCB substrate 1 passing through to about 180 to 200 ℃ hardened by the bond applied by the dispenser 30, each part placed To fix them. In addition, in the case of printing lead, it is configured to fix the chips and components on the PCB substrate 1 by melting and fixing the lead under each of the chips and components. Afterwards, the soldering step is performed again.

The unloader 60 is configured to automatically remove the PCB substrate 1 on which the chips and components are fixed from the chip mounting facility and to be automatically stored in the magazine.

The computer 80 is a predetermined model for each facility for loading and unloading a PCB substrate 1 of any type, which is to be produced among a plurality of models, and for mounting various chips and components on the PCB substrate 1. And control each facility by loading and executing a program corresponding to the facility.

Therefore, the computer 80 includes a part coder, a part name, a standard, a part size, a part thickness, a supply form, a part library, and a CHIP unit price field, model name, engine name, release name, and part number. The model information data consisting of mounting points, high-speed program name, variant program name, bonding program name, IC chip specification, PCB S / N, sample number, and bond requirement fields are stored.

The substrate name is represented by MAIN, H_A (HEAD AMP), PIF (IF), ..., and the release name is BOM NO. The number of parts and the number of mounting points can be obtained automatically from the release without registration. The program of high speed, mold release, and bonding is basically composed of model name and organization name (eg F24JMA ---), and IC CHIP specification is information recorded in μ-COM IC column at the first chapter when release output, PCB S / N is the NO. Sample No. is CHIP M / T Self-assigned NO. (E.g., C / M-SP-0001).

In addition, the release for a plurality of reels in which the chips and parts are loaded from the component information data and the model information data or separately inputted is a model name, a board name, a sample number, a list name, a mounting number, a part number, and an IC. Field and reel number, part coder, part coder, part name, specification, location, raw water field such as standard, equipment name, program name of each facility, parts change history, etc. are separated and can be output by each facility, each part, and each reel. The configuration of the reel can be conveniently performed. Furthermore, the latest information can be inquired by including the circuit change or component specification change field in the release.

In addition, the computer 80 includes lot information data consisting of a lot number and a lot size field for each model in the step of receiving each chip and parts and producing each lot, thereby enabling inventory management of each chip and parts.

In addition, in the case of inserting first, the coordinates of the chips and parts are inserted by the inserts so that the clinched chips and parts are fixed by soldering on the back surface of the PCB substrate 1, so that the coordinate origin of the chips and parts (I) In order to use it as it is in the mounting process for fixing the upper surface, there is a inconvenience to load by changing the direction of the PCB substrate (1). Therefore, the PCB substrate 1 is loaded as it is unloaded in the insert, and as shown in FIG. 3, the coordinate origin I at the time of insertion is set as the coordinate origin M at the mounting, and the coordinate origin at the time of mounting ( M) The coordinates of the chips and components to be mounted as a reference must be converted.

For this purpose, when chip mounting facilities are performed after completion of the insertion, the coordinate fields of the chips and components whose coordinates on the PCB substrate 1 of the chips and components according to the respective facilities are converted from the insertion point to the mounting origin are Included in model information data.

In the above-described comprehensive operating system of the chip mounting process on the PCB, the above-described parts information data, model information data, and programs to be executed in each facility are input and stored, and each chip and component receive step and each lot When lot information data consisting of the lot number and the lot size field for each model is input in the production stage, the reel is output from the computer 80 to obtain the necessary parts reel for the high speed mounting device 40 and the heterogeneous component mounting device 50. Set and send a program to each facility according to each model.

In this way, when the PCB substrate 1 of a predetermined model is loaded by the loader 10, each step for the mounting process in connection with FIG. 1 is automatically performed according to the present invention.

Specifically, the screen configuration for operating the comprehensive operating system of the chip mounting process on the PCB substrate of the present invention described above may be various.

According to the configuration and operation of the integrated operating system of the chip mounting process on the PCB substrate according to the embodiment of the present invention described above, it is easy to set up each equipment in the production of multiple models, inventory of each chip and parts Not only is it easy to manage, but it can also be easily changed even in the case of a model change or a change of parts, and there is an effect that there is no fear of malfunction.

Although the present invention has been described in detail with reference to the accompanying drawings, the present invention is not limited thereto, and modifications and improvements are possible within the scope of ordinary knowledge of those skilled in the art.

Claims (6)

A printer for placing molten lead in the pin 10 of the loader 10 for automatically inserting the PCB substrate 1 into the chip mounting facility and the mounting chip on the PCB substrate 1 introduced by the loader 10. 20, a dispenser 30 for applying a bond to attach the chip to the main body of the mounting chip of the PCB substrate 1, and a plurality of reels, each classified into the same chips, and taken out A high-speed mounting apparatus 40 for sequentially placing and attaching a plurality of sets of identical chips to each predetermined position on the PCB substrate 1, and disparate components from one or more reels in which heterogeneous components are loaded. 1) The heterogeneous component mounting apparatus 50 for arranging and attaching each part to a predetermined position on the phase, and the PCB substrate 1 on which the chips and parts are placed and attached are raised to a predetermined temperature to melt and fix lead and bond them. Hardening the chips and components Reflow furnace 60 for fixedly mounting on (1), and an unloader (60) for removing the PCB board (1) on which chips and components are fixed from the chip mounting facility and automatically storing it in the magazine; In a chip mounting system on a PCB substrate, Part code, part name, specification, part size, part thickness, type of supply, part library, CHIP unit price storage unit, model name, engine name, release name, part number, mounting score, high speed PCB board 1 of any kind and various kinds of chips, including program information, variant program name, bonding program name, IC CHIP standard, PCB S / N, sample number, and storage means for model information data consisting of bond requirements fields And a computer (80) for setting up and controlling the respective installations of the mounting facilities on the PCB substrate (1) of the components. 2. The method according to claim 1, wherein the releases for the plurality of reels in which the chips and the components are loaded from the storage means for storing the component information data of the computer 80 and the storage means for the model information data are model name, substrate name, sample number, Field name, mounting number, parts number, IC standard, equipment name, program name for each equipment, parts change history, etc. are divided into fields, reel number, parts coder, product name, specification, location, number of raw fields, and each equipment, Comprehensive operating system of chip mounting equipment on a PCB substrate, characterized in that the output is possible for each component, each reel. 2. The PCB substrate according to claim 1, wherein the computer 80 includes lot information storage means consisting of a lot number and a lot size field for each model in a step of receiving each chip and parts and producing each lot. Comprehensive operating system for chip mounting equipment. 2. The integrated operating system of a chip mounting facility on a PCB substrate according to claim 1, wherein the computer (80) is loaded with a program to be executed according to a model in each facility. 3. The integrated operating system of claim 2, wherein the release includes a circuit change or component specification change field. The method according to claim 1, wherein when the chip mounting facilities are performed after the insertion is completed, the coordinates of the chips and components according to the respective equipments on the PCB substrate 1 are converted from the insertion point to the mounting origin. Comprehensive operating system of the chip mounting equipment on the PCB, characterized in that the coordinate field of the chips and components are included in the model information data.