JPS6177399A - Automatic mounting machine for chip part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic chip component mounting machine that sequentially mounts various types of chip components onto a single substrate.

Conventional Technology Various types of automatic mounting machines have been proposed in the past, and all of them are capable of sequentially supplying several types of chip components and sequentially mounting chip components onto a single board. It is configured.

Problems to be Solved by the Invention However, with existing automatic mounting machines, for example, when there are defective or missing chip components, they are skipped and other chip components are mounted, and then the board is used as a base for completing the mounting. Similar to the case of ``plates,'' chips are discharged from the mounting process and then recovered after the fact for repair, which not only complicates the chip component mounting process but also extremely low component mounting efficiency. be.

Means for Solving the Problems In the automatic chip component mounting machine according to the present invention, a plurality of electronic component mounting heads are installed at regular intervals on the circumferential surface of the rotor with their nozzle tips facing downward. A plurality of chip tape tape feeders are arranged radially in parallel in a predetermined area below the movement trajectory of each mounting head toward the center of rotation of the rotor, and an XY table on which the substrate is mounted is arranged approximately on the opposite side thereof. The chip components picked up by the mounting head from each chip tape are sequentially mounted onto the board as the rotor rotates, and along the way, the chip components are selected as appropriate if any defective or missing electronic components are detected. The rotor is configured to be driven and controlled so that the chip component is sucked by another mounting head and the chip component is mounted.

Function: This automatic chip component placement machine is equipped with multiple placement heads on the circumferential surface of the rotor, and multiple tape feeders are arranged within a predetermined area around the rotor, so that several placement heads are always feeding the components. Since the mounting operation is possible, the mounting head can be selected to appropriately mount the chip components onto the board by controlling the drive of the rotor. By not allowing the generated mounting head to perform the mounting operation of chip components, it is possible to mount all the chip components onto one board in series.

Embodiments will now be described with reference to the accompanying drawings.

This automatic mounting machine can be roughly divided into 12 types for mounting multiple pieces.
, to..., and a plurality of tape feeders 30, 30 arranged in a predetermined area around the rotor 20.
. . . and an XY table 40 on which a board pre-glued is mounted at the mounting position of the chip component.

In the illustrated embodiment, the rotor 20 is equipped with 60 mounting heads 10, 10, and tape feeders 30, 30, . . . for individually feeding 20 types of chip components are arranged. Each mounting head 10, 10... is attached to the circumferential surface of the rotor 20 at predetermined intervals with the nozzle tip side facing downward, and on its axis, tubes 11, 11... that apply vacuum pressure are attached. By connecting and operating a vacuum valve 12, a chip component can be sucked at the tip of the nozzle. The rotor 20 is attached to a circular upper frame 21, and its rotating shaft is connected via a gear housed in a gear box 22 to a drive motor 23 that can be operated to gradually change speed as required. The tape feeders 30, 30... are used to hold and feed different kinds of chip component tapes, standard type and irregular type. and each mounting head 10.1
The chip component take-out positions are arranged below the movement locus of 0....

The XY table 40 is placed on the R side substantially opposite to the placement area of the tape feeders 30, 30..., and each mounting head 10, 10... attaches the chip component to the board on the center line of the XY table 40. It is now possible to do so.

In addition to these mechanical parts, a missing item detection device 50 is installed around the rotor 20. Standard type chip component direction changing device 60
．． Direction changing device for irregularly shaped chip components 70. The re-outage detection device 80 detects the
They are each arranged on the front side of the component mounting center line of the table 40. Among these, the missing item detection device is installed on the mounting head,
This is to inspect the suction posture, such as the presence or absence of chip components being suctioned on each of the io..., and whether the electrodes are being suctioned upward or downward, and can be constructed by arranging phototubes or the like. The direction changing device 60.70 specifies the mounting direction of a standard type or irregularly shaped chip component depending on the type, and changes the direction of the chip component sucked by the nozzle tip of the mounting head 10.10... It is possible to change the position. The re-missing item detection device 80 detects whether a chip component has fallen off from the mounting head 10, 10, etc. when passing through the direction changing device 60, 70, and is similar to the missing item detecting device 50 described above. It is composed of In addition to these, XY table 4
Behind the component mounting center line of 0 is a release pin device 90 for removing chip components from the mounting heads to, 10... Orientation restoring device 100 when there is a shortage of irregularly shaped chip parts. Missing chip component ejecting devices 110 are sequentially arranged.

In this automatic chip component mounting machine, each mounting head 10.
10... successively picks up chip components from a plurality of chip feeders 30, 30... and moves with the rotation of the rotor 20, detects missing parts, changes direction, and if normal, the normal operation is performed. Using the sequence access method, each mounting head 10.10.
...operates to attach the chip components to the board. On the other hand, if a missing chip component is detected by the missing chip component detection device 50 during the process, the mounting head that has picked up the chip component is moved to the component mounting position of the XY table 40 so as not to mount the chip component on the board. The rotation of the rotor 20 is controlled so that the mounting head located behind the mounting head picks up the same type of chip component and performs the remounting operation without lowering it.

For example, when a missing item is detected in the mounting head with index number 4, the mounting head with index number N11, which picks up the same type of chip component, causes the chip component to be sucked up from the tape feeder with number N, and the rotor 20 is rotated quickly. This allows the chip components to be mounted. Also, 60
If a missing item is detected in the book mounting head at index number 58, the rotor 20 has almost finished rotating, so the relationship between the type of the chip component and the mounting head that has already completed the mounting work. The chip component is sucked by the mounting head having the index number determined from the index number, and the chip component is mounted by rotating the rotor 20 in a clockwise direction. This drive control is performed by controlling the drive motor 23 of the rotor 20 with a rotary encoder, and each mounting head 10, 10... is capable of mounting chip components using a random access method in addition to a sequence access method. It is now possible to do this. Further, the drive motor 23 can be rotated by slowing up and slowing down when changing speed, so that the effect of inertia due to the speed change will not be exerted on the mounting of the chip component by the mounting head. When the mounting head that has absorbed the missing chip component moves forward in the rotational direction by the rotor 20,
In the case of odd-shaped chip parts, the tip of the chip part is returned to the direction in which it was picked up from the tape feeder 30, 30, etc. by the direction restoring device lOO, and the next ejection device 110 removes the missing parts, whether standard or irregular. The chip component is also detached from the nozzle tip of the mounting head. This discharge device 1
At 10, the suction release bin device 120 can be operated to remove missing chip components from the mounting head.

In this chip component mounting machine, the mounting radius is 10,10.
・・Descent movement during suction and installation of chip parts.

Direction changing device 60, 70 and missing chip ejecting device 11
It is preferable to perform the downward movement with respect to 0 using a hammer solenoid. Each mechanical part has a drive motor 30 as a drive source (the connection relation is shown by a dashed line in FIGS. 4 to 6), and rotation shafts 131, 132, 13 connected to this drive motor 30.
Driving force is transmitted via 3. Cam discs 134, 135, 136, 137 are mounted on the rotating shafts 131, 132, 133 in correspondence with the respective mechanical parts, and cam followers 138, 139 are attached to these cam discs.
, 140, 141 through the operating rod 142.143.14
4 are connected, and hammer solenoids 145, 146, 147 are added to the lower end of each operating rod. In these hammer solenoids, when an operation command is electrically transmitted, each bottle is projected, and its pin engages with a piece or a lever, thereby causing each mechanical part to perform a predetermined operation. When a chip component is picked up, the pin of the hammer solenoid 145 engages with the piece 14B, and the solenoid 145 descends along the cam groove of the cam disc 134, so that the entire mounting head 10 is moved to the rotor 20.
descend downwards from With this downward movement, the mounting rad lO absorbs the chip component at the tip of the nozzle, and then moves upward along the cam groove of the cam 134 to return to its original position, and the pin of the cam solenoid 145 By retreating, it will stop at a predetermined position. The operating mechanism using this hammer solenoid is a cam@
135. It can also be applied to the downward movement performed via the cam follower 139, and the cam l1137. Cam follower 1
It can also be applied to the downward movement performed via 41. When a chip component is mounted, it can be moved downward by removing the latching lever 149 using the hammer solenoid 147. Further, by using this hammer solenoid, the tape feeder 3o can be configured to perform an intermittent tape feeding operation. The hammer solenoid 150 is mounted on the upper end of an operating rod 151, and can be moved up and down by linking the operating rod 151 to a cam g1152 mounted on the axis of the rotating shaft 132 via a cam follower 153. The hammer solenoid 150 has 1 piece.
54 are arranged so that they can be engaged with each other, and this piece is connected to the chip feed drum 2.
The cam lever 202 is disposed so as to come into contact with the cam lever 202 coaxially mounted on the cam lever 202 of the 01. When the piece 154 moves up and down, the feed drum 201 can be rotated one pitch at a time via the cam lever 202. Further, in this hammer solenoid 150, the vacuum valve 12 that supplies vacuum pressure to the mounting head io can also be configured to be switched by the push plate 155. When a hammer solenoid is used in this manner, the structure is simpler than that of an operating mechanism that is a combination of a solenoid valve and an air cylinder, and the response speed is faster and problems such as air leakage do not occur.

In this chip component mounting machine, each mounting head is 1O11O...
・Sliding play near the rotor installation) 13° 13...
Slide the air passage 14 provided on the plate surface.
By aligning the holes 14 with the communication holes 15 with the vacuum valves 12, vacuum pressure can be supplied or cut off to the mounting heads 10°lO. Each sliding plate 13, 13... can be slid by pressing it with a pole 16 installed on the fuselage side, and after the suppression is released, it is moved back by a tension spring 17 through a long hole 18. Supported by 19.

Further, as described above, it is preferable to equip the feed drums 32 of the tape feeders 30, 30, .

This tape feeder 30.30... is a chip tape T
cover tape 1. reel 34. If the upper part of the chip tape T, including the construction reel 35 and tape running guide 36, is configured to be detachable using the knob 37, the chip tape can be easily replaced and replaced individually. In addition, the winding mechanism for the cover tape t1 extends the cam lever 31 to engage the roll 38, and the cover tape winding reel 34 is placed in contact with the roll surface. The reel 34 can be configured to rotate as the reel 38 rotates. In this mechanism, the support arm 39 of the cover tape take-up reel 34 is connected to the elongated hole 301.3.
A tension spring 303 is bolted to the travel guide 36 via the arm 39 and the knob 37.
3. When the take-up reel 34 is rotated by the roll 38, it can be deflected downward and moved upward when the cam lever 31 returns to its original position.
This prevents the reaction force caused by the rocking from being applied to the cover tape. In addition, in order to ensure that the chip components E accommodated in the four parts of the chip tape T are adsorbed by the mounting head IO, the tape feeder 30 has a chip tape that penetrates the base tape from below or is provided on the base tape. A push-up pin 304 is provided to push up the chip component E through the through hole.

As the bottle 304, the tip end side can be formed into a truncated pyramid shape, or the tip end of the shaft can be formed with two or three protruding teeth 305, 305...
It is preferable to reduce the contact area with the chip component E so that the chip component E can be stably supported. In addition, all of the tape feeders 30, 30, . The main body of the cart 306 is formed of a box 307 that can accommodate waste tape after chip components are taken out, and each tape feeder 30.
A receptacle 308 is provided to receive the waste tape t2 discharged from the tapes 30, . . . Since this trolley 306 can collect all the waste tape, it is possible to keep the undercarriage of one work place in order. In addition, this cart 306 has one caster 309 and a horizontal shaft 3 with a waste collection pock 307 on the front side.
10, and linkers 311 and 312 connecting the waste collection box 307 and one caster 309 are installed near the rotor 20, and each linker 3
11 and 312 are pivotally supported by a shaft 313, and an operation bar 314 can be connected thereto. In this trolley 306, when the operator pushes down the operation bar 314, the linkers 311 and 312 are extended, and accordingly, the trolley 306 can be tilted and rotated toward the front side using the horizontal shaft 310 as a fulcrum. In that state, tape feeder 30.30...
・If you change the tip of the chip tape, you can easily and quickly change the tip of the tip tape.

The chip component missing item detection device 50 can be composed of a phototube as described above, and one of them is arranged below and aligned with the nozzle axis of the mounting head 1O to detect whether or not a chip component is attracted. In order to detect the attitude, it is preferable to arrange a plurality of them perpendicularly to the nozzle tip. Each phototube 51, 52, 53 and light receiving tube 54 arranged in the orthogonal direction
, 55.

56 are arranged with a difference in level from each other, so that it is possible to detect the presence or absence of a chip component as well as the suction caused by the standing posture of the chip component.

As the direction changing device 60, 70 and the direction restoring device 100, it is preferable to incorporate a chuck mechanism having four opposing clamping claws 401 that clamp and release chip components from at least four sides. Each pinching claw 401 has a central axis 40
2, and the lower end side is connected to the socket 4 of the inner tube 403.
04 by being placed on a plate 405J- that is integrated with the central axis 402. In addition, the winter melon 401 is fitted into four parts 406 formed by notching the axial line at the tip side of the central shaft 402, and a protruding part 408 is pivoted on the lower side of the flange part 407 formed to protrude from the axial line of the central shaft 402. engaged. In addition to being pivotally engaged with the collar portion 407, a lever portion 409 that is molded and protrudes outward from the body of the pawl 401 is engaged with the upper edge of the socket of the inner tube 403. Furthermore, the winter melon 401 has an arc-shaped notch 4 on the outer edge near the lower end.
10, and a coil spring ring 41 is placed in the notch 410.
1 is fitted so as to bind each to the central shaft 402. Inner tube 4 that supports these claws 401
03 is fitted and supported by an outer tube 412, and is pressed upward by a compression spring 413 disposed therebetween. In addition, the outer tube 412 is a compression spring 41
4, and the spring 414 is disposed between the collar 415 attached to the lower end of the center shaft 402, so that the center shaft 402 is always deflected downward. In this chuck mechanism, when the plate portion 416 attached integrally with the collar 415 is pushed upward by, for example, a drive cam or the like.

The center shaft 402 has been raised and the flange 40 of the center shaft 402 has been
Since the state of engagement with 7 is released, the spring ring 4
It becomes possible to expand by pulling 11. The chip component sucked into the nozzle tip of the mounting head 10 is received by the expansion operation, and when the chip component is located inside each clamping claw 401, the plate portion 406 is lowered to allow the center shaft 40 to
2 is lowered by the compression spring 414, the flange 407 engages with the protrusion 408 of the claw 401, and the lever part 409 engages with the 4-edge of the socket 404, so that the chip component can be clamped. Become.

When the winter melon 401 clamps the chip component, the stepping motor connected to the lower part is activated and the whole body is rotated at an appropriate angle, thereby making it possible to orient the chip component. In this chuck mechanism, the winter melon 401 opens and closes at the same time by the action of the spring ring 411, so that not only the direction change but also the centering of the chip parts can be performed, and the structure can be mechanically extremely simple. In addition, in the standard chip component direction changing device 60, four winter melons 401 are connected to the central axis 40.
However, in the direction changing device 70 for irregularly shaped chip parts, since the irregularly shaped chip parts are heavy, a pair of left and right parts are provided at the rear lO to assist the suction of the nozzle tip, and the other It is preferable to provide a pair of the chuck mechanism on the chuck mechanism side, and to change the direction by clamping the chip component.

The device 70 for changing the direction of odd-shaped chip components can be assembled by dividing a mounting head having, for example, 60 pieces into three equal parts and arranging 10 pieces each in the order of the index determined along the rotating direction of the rotor 20. In addition, when a chip component is clamped with a mounting head equipped with this chuck mechanism, the mounting head for the missing chip component is only used to return the gripping direction of the chip component to the state at the time of suction before moving the mounting head of the missing chip component to the ejection device 110. A direction change device 100 is arranged.

Each mechanism configured in this way makes it possible to efficiently and accurately perform automatic mounting of chip components using a random access method in addition to the above-described sequence access method, and is extremely useful for carrying out accurate mounting.

Effects of the Invention As described above, according to the automatic chip component mounting machine according to the present invention, even if a chip component held by the mounting head is missing or falls off, it can be quickly dealt with. Chip components can be mounted extremely efficiently and with extremely high accuracy.

[Brief explanation of the drawing]

Fig. 1 is a plan view showing an automatic chip component mounting machine according to the present invention, Fig. 2 is a front view thereof, Fig. 3 is a schematic plan view showing the layout of the mounting machine, and Fig. 4 is a mounting head and tape. FIG. 5 is an explanatory diagram showing the operating mechanism of the feeder, FIG. 5 is an explanatory diagram showing the operating mechanism of the mounting head and direction changing device, FIG. 6 is an explanatory diagram showing the operating mechanism of the mounting head when chip components are mounted, and FIG. 8th plan view showing the vacuum pressure feeding mechanism of the mounting head;
The figure is a side view of the tape feeder, FIG.
Figure 0 is a perspective view showing the shape of the tip of the L-type bin, Figure 11 is a side view of the tape feeder installed on a cart, Figure 12 is a plan view of the same, and Figure 13 is a missing chip component detection device. 14 is a partially cutaway side view of the direction changing device,
FIG. 15 is a side view showing the clamping claw to be incorporated into the direction changing device;
Fig. 16 is a plan view showing the shape of the tip of the central shaft to be incorporated into the device, Fig. 17 is a perspective view of a spring ring to be incorporated into the device, and Fig. 18 is a partially cutaway side view showing the direction change device for standard chip components. FIG. 19 is a front view showing a direction changing device for irregularly shaped chip components.・ 10.10...: Mounting head, 20: Rotor, 30
．． 30...: tape feeder, 40=XY table. Fig. 18 Fig. 19 □ 1: Hi, -" 401 Pano ゝ-",' 402 ・ ・/411: "μ L-m--←-----T I- □

Claims (1)

[Claims] A plurality of mounting heads for electronic components are installed at regular intervals on the circumferential surface of the rotor with nozzle tips facing downward, and a tape feeder for chip tape is placed within a predetermined area below the movement trajectory of each of these mounting heads as the rotor rotates. A plurality of XY devices are arranged radially in parallel toward the center of motion, and the board is mounted on the almost opposite side.
A table is arranged, and the chip components picked up by the mounting head from each chip tape are sequentially mounted on the board as the rotor rotates, and along the way, mounting defects such as defective or missing electronic components are detected. An automatic chip component mounting machine characterized in that a rotor can be driven and controlled so that chip components of the same type are sucked from a tape feeder and another mounting head that is appropriately selected is used to mount the chip components.