JPS63232494A - Method of mounting electronic parts - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting method for mounting electronic components at predetermined positions on a board.

Conventional Technology In recent years, as factory equipment has become more automated and higher productivity is required, electronic component mounting methods are required to have high performance and functionality.

An example of the conventional electronic component mounting method described above will be described below with reference to the drawings. FIG. 3 is a perspective view of an electronic component mounting machine having a circulating component supply mechanism, FIG. 4 is a flowchart of the operation of a conventional electronic component mounting method, and FIG. 6 is a conceptual diagram of the circulating component supply mechanism. . In Figure 3, 1
2 is a component holder attachment ring, and 2 is a component holder, a plurality of which are attached to one component holder attachment ring. 3 is a parts supply cassette in which a plurality of parts are placed around the circumference of 1 44.
ab is a component insertion head (hereinafter abbreviated as head);
6 is a main operation panel with a keyboard (hereinafter referred to as the operation panel); 6 is a control device that controls the entire process of the electronic component mounting method (hereinafter referred to as control device); 7 is x-Y
It's a table.

In Fig. 4, step 1 is a supply process in which electronic components are supplied from a component supply cassette to a component holder and moved to the head position, and step 2 is a supply process in which electronic components are discharged from the component holder to the head and electronic components are mounted on a board. This is the mounting process.

In FIG. 6, 1 is a component holder mounting ring, 2at,
2b is a component holder, sa and sb are component supply cassettes, 4
is the head. AI/i electronic components are loaded in the component supply cellar) 3a, and B is an electronic component loaded in the component supply cassette 3b. Also, FIG. 6(a) shows the state before electronic components are supplied from the component supply cassette to the component holder, and FIG. 6 (to) shows the state after electronic components A are supplied from the component supply cassette 3& to the component holder 2a. , Figure 6(C)
6(d) shows a state in which the electronic component B is supplied from the component supply unit 3b to the component holder 2b, and FIG. 6(d) shows a state in which the component holder has moved to the head position.

The operation of the electronic component mounting method configured as above will be described below. Focusing on one component holder, after startup, electronic components are supplied to the component holder in the supply process of step 1 in Figure 4 and moved to the head position, and then the electronic component is moved to the position of the head in the mounting process of step 2 in Figure 4. Electronic components are ejected from the component holder to the head and mounted on the board. The empty component holder is moved to the component supply cassette in order to be supplied with electronic components again. In the process of step 1.2 in Figure 4, the status of the parts supply section is not determined.
Electronic parts are supplied and discharged unconditionally.

The above is an example of a conventional electronic component mounting method, and a more specific example will be explained using a circulating component supply mechanism. In order to mount electronic components on the board in the order of A and B, they must be lined up in the order of A and B at the head position. A circulating parts supply mechanism does this. Electronic component A as shown in FIG. 6(a).

If component holders 2a and 2b to receive electronic component B have been determined, electronic component A is supplied when component holder 2a comes to the component supply cassette 3& as shown in FIG. 6(b). Further, the component holder attachment ring 1 rotates, and when the component holder 2b comes to the position of the component supply cassette 3b as shown in FIG. 4(c), the electronic component B is supplied.

Then, as shown in FIG. 4(d), the electronic components A and B are lined up in that order, the electronic components A and B are supplied to the head in that order, and the head is mounted on the board.

Problems to be Solved by the Invention However, with the above configuration, if even one component holder becomes defective, the defective component holder may drop the component, or the mounting process may fail even if the component is held. Since the parts were not mounted correctly, the mounting rate decreased, and therefore the operating rate also decreased because the machine had to be stopped until the component holder was replaced.

Means for Solving the Problems In order to solve the above-mentioned problems, the electronic component mounting method of the present invention receives components from a component supply section by a circulating component transfer section having a plurality of component holders, and transfers the components to a new position. A method comprising a supplying step of supplying the components to the component transfer unit, and a mounting step of receiving and mounting the components supplied by the component transfer unit at a predetermined position, the method comprising:
This electronic component mounting method classifies unused component holders among a plurality of component holders, and controls the component holders from being used based on this classification.

Effects of the present invention Due to the above-described configuration, even if an abnormality occurs in one or more of the plurality of component holders, the operation of the machine can be continued by using another good component holder without stopping the operation of the machine. This makes it possible to operate the machine, improve the operating rate, and eliminate the need for forced operation with defective component holders, which improves the mounting rate and reduces the number of man-hours required to correct mounting errors. became.

EXAMPLE Hereinafter, an electronic component mounting method according to an example of the present invention will be described with reference to the drawings.

FIG. 1 is a flowchart of an electronic component mounting method according to an embodiment of the present invention, and FIG. 2 is a conceptual diagram of a circulating component supply mechanism.
FIG. 3 is a perspective view of an electronic component mounting machine having a circulating component supply mechanism.

In FIG. 1, step 3 is the first control process, step 6 is the second control process, step 8 is the third control process, step 4 is the registration process, step 6 is the starting process, step 7 is the supply process, and step 9 is the This is the mounting process.

In Fig. 2, 1 is a component holder mounting ring, 2a, 2
b and 2c are component holders, sa and sb are component supply cassettes, and 4 is a head. A is an electronic component, which is loaded in the parts supply system Cera 3a, and B is an electronic component, which is loaded in the parts supply system Cera 3a.
'Caseno) 3b is loaded. Further, Fig. 2(a) shows the state before electronic components are supplied from the component supply cassette to the component holder, and Fig. 2(b) shows the state before electronic components are supplied from the component supply cassette to the component holder 2a. Condition, Figure 2 (C
) is a state in which electronic components are not supplied to component holder 2bVc, FIG. 2(d) is a state in which electronic component B is supplied from component supply force cera) 3b to component holder A2c, and FIG. 2(e) is in a state in which electronic component B is supplied to component holder A2c. FIG. 2(f) shows a state in which the electronic component A has been ejected from the component holder 2a to the head 4, and FIG. 2(q) shows a state in which the electronic component has not been ejected from the component holder 2b to the head 4. A state in which the electronic component B is ejected to the head 4 is shown. Since FIG. 3 was described in the above-mentioned prior art, it will be omitted here.

The operation of the electronic component mounting method configured as described above will be described below. Focusing on one component holder, how the software operates will be explained with reference to FIG. First, in the first control step, it is determined whether there is a defective component holder, and if there is, the number of the defective component holder is registered in the next registration step, and the start of mounting is instructed in the startup step. After starting, the second
In the control process, it is determined whether the component holder located at the position of the component supply cassette is normal or not, and if it is determined to be normal, the supply process is performed. Next, in the third control process, it is determined whether the component holder located at the head position is normal or not, and if it is determined to be normal, the mounting process is performed. Furthermore, a specific example will be given based on the conceptual diagram in FIG.

As shown in FIG. 2(a), a component holder k 2'' supplied with electronic component A, a component holder supplied with electronic component B=i
2b and the next component holder f2a, and since 2b was defective, it is assumed that this is registered on the operation panel 6 of FIG. In addition, the component holder mounting ring is rotated counterclockwise (counterclockwise).
Suppose it was.

The component holder moves, and when the component holder 2a reaches the position of the component supply cassette 3a as shown in FIG.
Since a is normal, electronic component A is supplied. Moving further, when the component holder 2b reaches the position 3b in Figure 2 (as shown in →), the electronic component B is not supplied because 2b is registered as defective, and the electronic component B is not supplied. As shown in Fig. 2 (b), it is then supplied to the normal component holder 2c. and,
Since the component holder 2a is normal, when it reaches the position of the head 4 as shown in FIG. 2(e), it discharges the electronic component Ai to the head 4, but as shown in FIG. 2(f), the next component holder 2b is defective and does not hold any electronic components, so it does not eject the electronic components to the head 4 and moves to the next component holder 2 as shown in Figure 2 (φ).
Electronic component B is discharged from C to head 4 and mounted.

Effects of the Invention As described above, the present invention uses an electronic component mounting method in which a plurality of component holders are divided into those that are not used, and based on this division, the corresponding component holders are controlled not to be used. , compared to traditional electronic component mounting methods,
By using other good parts holders without stopping machine operation, it is possible to continue operation, improving the operating rate, and eliminating the need to force the machine to operate with defective parts holders. The mounting rate has also improved, and the number of man-hours required to correct mounting errors has also been reduced.

[Brief explanation of drawings]

Figure 1 is a flowchart of an electronic component mounting method according to an embodiment of the present invention, and Figure 2 is a conceptual diagram of a circulating component mechanism.
) is a plan view showing the state M before electronic components are supplied from the component supply cassette to the component holder, (b) is a plan view showing the state in which electronic components are supplied from the component supply cassette to the component holder, ( C) is a plan view showing a state in which electronic components are not supplied because the component holder is defective; (d) is a plan view showing a state in which electronic components are supplied from the component supply cassette to the component holder; (e) is a plan view showing a state where electronic components are ejected from the component holder to the head; (the phantom is a plan view showing a state where electronic components are not ejected to the head because the component holder is defective , (q) is a plan view showing electronic components being ejected from the component holder to the head, FIG. 3 is a perspective view of an electronic component mounting machine having a circulating component supply mechanism, and FIG. 4 is a conventional electronic component mounting machine. Flowchart of the electronic component mounting method, Figure 6 is a conceptual diagram of a conventional circulating component supply mechanism, (→ is a plan view showing the state before electronic components are supplied from the component supply cassette to the component holder, ( (b) is a plan view showing the state f: 5. in which electronic components are supplied from the component supply cassette to the component holder; (C) is a plan view showing the state in which all electronic components are supplied from the component supply cassette to the component holder; (B) is a plan view showing a state in which the component holder has been moved to the head position. 1...Component holder attachment ring, 2a, 2b, 2
c... Parts holder, 3a, 3b...
Parts supply cassette, 4...Head. Name of agent: Patent attorney Toshio Nakao and 1 other person 2nd
Figure 4

Claims (7)

[Claims] (1) A supply process in which a circulating component transfer unit having a plurality of component holders receives components from a component supply unit and supplies them to a predetermined position, and a supply process in which components supplied by the component transfer unit are received at a predetermined position and mounted. This method consists of a mounting process in which parts holders are separated from those that are not used, and
An electronic component mounting method that controls the use of the corresponding component holder based on this classification. (2) The electronic component mounting method according to claim 1, wherein unused component holders are registered among a plurality of component holders, and based on this registration, the corresponding component holders are controlled not to be used. (3) The electronic component mounting method according to claim 1, wherein unused component holders are set in advance among the plurality of component holders. (4) The electronic component mounting method according to claim 1, wherein symbols are attached in advance to the plurality of component holders. (5) The electronic component mounting method according to claim 1, wherein the plurality of component holders are sequentially numbered in advance. (6) The electronic component mounting method according to claim 6, wherein the electronic component mounting method is numbered sequentially in the circulation direction of the component transfer section. (7) A supply process in which components are received from a component supply unit by a circulating component transfer unit having multiple component holders and supplied to a predetermined position, and components supplied by the component transfer unit are received and mounted at a predetermined position. An electronic component mounting method comprising a mounting step in which a plurality of component holders are classified to be used, and a corresponding component holder is controlled to be used based on the classification.