JPH0713996B2 - Semiconductor wafer manufacturing equipment - Google Patents
Semiconductor wafer manufacturing equipmentInfo
- Publication number
- JPH0713996B2 JPH0713996B2 JP28691089A JP28691089A JPH0713996B2 JP H0713996 B2 JPH0713996 B2 JP H0713996B2 JP 28691089 A JP28691089 A JP 28691089A JP 28691089 A JP28691089 A JP 28691089A JP H0713996 B2 JPH0713996 B2 JP H0713996B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- cassette
- wafer cassette
- host computer
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Multi-Process Working Machines And Systems (AREA)
- General Factory Administration (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体ウエハを短工期で製造する製造設備
に関するものである。The present invention relates to a manufacturing facility for manufacturing semiconductor wafers in a short period of time.
第２図は半導体ウエハを複数枚収納した半導体ウエハカ
セットを示す斜視図である。（１）は半導体ウエハ（以
下「ウエハ」と呼ぶ）、（２）は半導体ウエハカセット
（以下「カセット」と呼ぶ）である。FIG. 2 is a perspective view showing a semiconductor wafer cassette containing a plurality of semiconductor wafers. (1) is a semiconductor wafer (hereinafter referred to as "wafer"), and (2) is a semiconductor wafer cassette (hereinafter referred to as "cassette").
第３図は従来の半導体ウエハ製造設備を示すブロック図
である。（３）はウエハ（１）を枚葉で処理する半導体
ウエハ枚葉処理装置、（４）はカセット（２）を複数個
収納する半導体ウエハカセット収納装置、（５）は半導
体ウエハカセット収納装置（４）と半導体ウエハ枚葉処
理装置（３）との間でカセット（２）を搬送する半導体
ウエハカセット搬送装置、（６）は半導体ウエハ枚葉処
理装置（３）と半導体ウエハカセット収納装置（４）と
半導体ウエハカセット搬送装置（５）とを複数台管理す
る上位計算機、（７）はユーザーが種々の製造に必要な
データを上位計算機（６）に入力する端末でる。FIG. 3 is a block diagram showing a conventional semiconductor wafer manufacturing facility. (3) is a semiconductor wafer single wafer processing apparatus for processing the wafer (1) in a single wafer, (4) is a semiconductor wafer cassette housing apparatus for housing a plurality of cassettes (2), and (5) is a semiconductor wafer cassette housing apparatus ( 4) and a semiconductor wafer single wafer processing apparatus (3) for transferring the cassette (2), and (6) a semiconductor wafer single wafer processing apparatus (3) and a semiconductor wafer cassette housing apparatus (4). ) And a semiconductor wafer cassette transfer device (5) are managed by a host computer, and (7) is a terminal through which a user inputs data necessary for various manufacturing to the host computer (6).
ユーザー（図示せず）は製造に必要な種々のデータを端
末（７）を用いて上位計算機（６）に入力する。上位計
算機（６）は半導体ウエハ枚葉処理装置（３）からのロ
ットの投入要求に応じ、上記ユーザーが入力した製造デ
ータを基に半導体ウエハカセット収納装置（４）内に収
納されているカセット（２）を上記の半導体ウエハ枚葉
処理装置（３）で処理するものを選びだし、半導体ウエ
ハカセット搬送装置（５）を用いて半導体ウエハカセッ
ト収納装置（４）から上記ロットを半導体ウエハ枚葉処
理装置（３）へと搬送する。搬送が完了すると、上位計
算機（６）は半導体ウエハ枚葉処理装置（３）に対して
処理を開始させる。A user (not shown) inputs various data necessary for manufacturing into the host computer (6) using the terminal (7). A host computer (6) stores a cassette (4) stored in the semiconductor wafer cassette storage device (4) based on the manufacturing data input by the user in response to a lot input request from the semiconductor wafer single-wafer processing device (3). 2) is selected by the semiconductor wafer single-wafer processing device (3), and the lot is transferred from the semiconductor wafer cassette storage device (4) to the semiconductor wafer single-wafer processing using the semiconductor wafer cassette transfer device (5). Transport to device (3). When the transfer is completed, the host computer (6) causes the semiconductor wafer single-wafer processing apparatus (3) to start processing.
従来の半導体ウエハ製造設備では、製造処理が枚葉であ
るにもかかわらず、カセットに収納されているウエハは
固定であるために、製造処理工期を短縮することができ
ないという問題点があつた。The conventional semiconductor wafer manufacturing facility has a problem that the manufacturing process period cannot be shortened because the wafers stored in the cassette are fixed even though the manufacturing process is single-wafer processing.
この発明は上記の様な問題点を解消するためになされた
もので、目標とする製造処理工期で処理を完了すること
を可能とする半導体ウエハ製造設備を得ることを目的と
する。The present invention has been made to solve the above problems, and an object of the present invention is to obtain a semiconductor wafer manufacturing facility capable of completing processing in a target manufacturing processing period.
この発明に係る半導体ウエハ製造設備は、半導体ウエハ
枚葉処理装置と、半導体ウエハカセット収納装置と、半
導体ウエハカセット搬送装置と、半導体ウエハカセット
分割装置とを、上位計算機のものと制御したものであ
る。In the semiconductor wafer manufacturing equipment according to the present invention, the semiconductor wafer single-wafer processing apparatus, the semiconductor wafer cassette housing apparatus, the semiconductor wafer cassette transfer apparatus, and the semiconductor wafer cassette dividing apparatus are controlled as those of a host computer. .
この発明における半導体ウエハ製造設備は、ウエハの処
理時間に関する実績データを上位計算機に送り、また半
導体ウエハカセット分割機は上位計算機の指示のもと複
数枚のウエハを収納したカセットを他のカセットに分割
する。The semiconductor wafer manufacturing facility according to the present invention sends the actual data regarding the wafer processing time to the host computer, and the semiconductor wafer cassette divider divides a cassette containing a plurality of wafers into other cassettes under the instruction of the host computer. To do.
第１図はこの発明の一実施例における半導体ウエハ製造
設備を示すブロック図である。図中（３）〜（７）は従
来設備と同等のものである。図において、（８）は上位
計算機（６）の指示によりカセット（２）に収納された
ウエハ（１）を他のカセット（２）に分割する半導体ウ
エハカセット分割装置である。半導体ウエハ枚葉処理装
置（３）は実績データとしてウエハの処理時間に関する
データを上位計算機（６）に報告する。上位計算機
（６）は上記のデータを最新のものとして蓄える。半導
体ウエハ枚葉処理装置（３）からのロット投入要求に応
じ、上位計算機（６）はユーザーが端末（７）より入力
した製造データに基づき処理できるロットを半導体ウエ
ハカセット収納装置（４）から捜しだす。次に、上位計
算機（６）はユーザーが端末（７）より入力した製造デ
ータの一部である工期に関するデータと、前述の半導体
ウエハ枚葉処理装置（３）が報告した実績データとを比
較し、ユーザーが指示した工期を守れる様に上記ロット
の分割カセット数を決める。上位計算機（６）は、まず
半導体ウエハカセット収納装置（５）を用いて上記ロッ
ト（以下「親ロット」と呼ぶ）、及び分割に必要な空カ
セットを半導体ウエハカセット分割装置（８）へ搬送す
る。上位計算機（６）は、決定した分割カセット数を基
にした分割作業指示を、半導体ウエハカセット分割装置
（８）に対して送る。この半導体ウエハカセット分割装
置（８）からの上記作業の完了報告を受けて、上位計算
機（６）は半導体ウエハカセット搬送装置（５）に対し
て分割され、新しく形成された複数のロット（以下「子
ロット」と呼ぶ）及び空となつた親ロットを半導体ウエ
ハカセット収納装置（４）へと収納させる。新しく形成
された複数の子ロットの内の一つが、上位計算機（６）
の指示のもと、半導体ウエハカセット収納装置（４）か
ら半導体ウエハカセット搬送装置（５）により払いださ
れ、目的とする半導体ウエハ枚葉処理装置（３）へと搬
送される。半導体ウエハカセット搬送装置（５）から上
記搬送の完了報告の報告を受けて、上位計算機（６）は
半導体ウエハ枚葉処理装置（３）に対して製造処理の開
始を指示する。残りの子ロツトは逐次半導体ウエハ枚葉
処理装置（３）へと払いだされる。FIG. 1 is a block diagram showing a semiconductor wafer manufacturing facility according to an embodiment of the present invention. (3) to (7) in the figure are equivalent to conventional equipment. In the figure, (8) is a semiconductor wafer cassette dividing device for dividing the wafer (1) stored in the cassette (2) into other cassettes (2) according to an instruction from the host computer (6). The semiconductor wafer single-wafer processing apparatus (3) reports the data regarding the processing time of the wafer to the upper-level computer (6) as actual data. The host computer (6) stores the above data as the latest data. In response to a lot loading request from the semiconductor wafer single wafer processing device (3), the host computer (6) searches the semiconductor wafer cassette storage device (4) for a lot that can be processed based on the manufacturing data input by the user from the terminal (7). I will Next, the host computer (6) compares the data related to the construction period, which is a part of the manufacturing data input by the user from the terminal (7), with the actual data reported by the semiconductor wafer single-wafer processing apparatus (3). , The number of divided cassettes of the above lot is decided so that the construction period specified by the user can be kept. The host computer (6) first uses the semiconductor wafer cassette storage device (5) to transfer the lot (hereinafter referred to as “parent lot”) and an empty cassette required for division to the semiconductor wafer cassette dividing device (8). . The host computer (6) sends a division work instruction based on the determined number of division cassettes to the semiconductor wafer cassette division device (8). In response to the completion report of the above work from the semiconductor wafer cassette dividing device (8), the host computer (6) is divided with respect to the semiconductor wafer cassette transfer device (5), and a plurality of newly formed lots (hereinafter referred to as " (Referred to as "child lot") and the empty parent lot are stored in the semiconductor wafer cassette storage device (4). One of the newly formed child lots is the host computer (6)
Under the instruction of, the semiconductor wafer cassette storage device (4) is ejected by the semiconductor wafer cassette transfer device (5) and is transferred to the target semiconductor wafer single-wafer processing device (3). Upon receiving the report of the completion of the transfer from the semiconductor wafer cassette transfer device (5), the host computer (6) instructs the semiconductor wafer single-wafer processing device (3) to start the manufacturing process. The remaining child lots are successively discharged to the semiconductor wafer single-wafer processing apparatus (3).
上記実施例では、上位計算機（６）は分割カセット数を
決定し、親ロットをすべて半導体ウエハカセット分割装
置（８）を用いて分割しているが、分割カセット数の代
りに子ロットのウエハ数を決定し、親ロットの一部のウ
エハから半導体ウエハカセット分割装置（８）を用いて
子ロットを形成し、この子ロットは半導体ウエハカセッ
ト搬送装置（５）により半導体ウエハ枚葉処理装置
（３）へと搬送され、半導体ウエハ枚葉処理装置（３）
により処理され、一方親ロットは残りのウエハを収納し
ているので、一旦半導体ウエハカセット収納装置（４）
に半導体ウエハカセット搬送装置（５）により収納さ
れ、次の分割作業を待つという実施例も考えられる。In the above embodiment, the host computer (6) determines the number of divided cassettes and divides all the parent lots by using the semiconductor wafer cassette dividing device (8). However, instead of the number of divided cassettes, the number of wafers of the child lot is divided. Is determined and a child lot is formed from a part of the wafers of the parent lot using the semiconductor wafer cassette dividing device (8), and this child lot is processed by the semiconductor wafer single wafer processing device (3) by the semiconductor wafer cassette transfer device (5). ), And the semiconductor wafer single wafer processing apparatus (3)
However, since the parent lot stores the remaining wafers, the semiconductor wafer cassette storage device (4) once is processed.
It is also possible to consider an embodiment in which the semiconductor wafer cassette transfer device (5) stores the wafer and waits for the next division work.
以上の様に、この発明によれば半導体ウエハ枚葉処理装
置から報告されるウエハの実績処理時間と、端末から入
力される工期に関するデータとを比較し、上位計算機が
半導体ウエハカセット分割機を用いて半導体ウエハカセ
ット中のウエハを複数個の半導体ウエハカセットに分割
することを可能としたことにより、半導体ウエハの製造
処理の工期を短縮することを可能にするという効果があ
る。As described above, according to the present invention, the actual wafer processing time reported from the semiconductor wafer single-wafer processing apparatus is compared with the data regarding the construction period input from the terminal, and the host computer uses the semiconductor wafer cassette divider. Since it is possible to divide the wafer in the semiconductor wafer cassette into a plurality of semiconductor wafer cassettes, it is possible to shorten the manufacturing period of the semiconductor wafer manufacturing process.
第１図はこの発明における半導体ウエハ製造設備を示す
ブロック図、第２図は半導体ウエハ及び半導体ウエハカ
セットを示す斜視図、第３図は従来の半導体ウエハ製造
設備を示すブロック図である。 図において、（１）は半導体ウエハ、（２）は半導体ウ
エハカセット、（３）は半導体ウエハカセット枚葉処理
装置、（４）は半導体ウエハカセット収納装置、（５）
は半導体ウエハカセット搬送装置、（６）は上位計算
機、（７）は端末、（８）は半導体ウエハカセット分割
装置である。 尚、図中同一符号は同一又は相当部分を示す。FIG. 1 is a block diagram showing a semiconductor wafer manufacturing facility according to the present invention, FIG. 2 is a perspective view showing a semiconductor wafer and a semiconductor wafer cassette, and FIG. 3 is a block diagram showing a conventional semiconductor wafer manufacturing facility. In the figure, (1) is a semiconductor wafer, (2) is a semiconductor wafer cassette, (3) is a semiconductor wafer cassette single-wafer processing apparatus, (4) is a semiconductor wafer cassette storage apparatus, and (5).
Is a semiconductor wafer cassette transfer device, (6) is a host computer, (7) is a terminal, and (8) is a semiconductor wafer cassette dividing device. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
ハカセット、この半導体ウエハカセットを複数個収納す
る半導体ウエハカセット収納装置、前記半導体ウエハカ
セットから半導体ウエハを１枚ずつ処理する半導体ウエ
ハ枚葉処理装置、前記半導体ウエハカセットを搬送する
半導体ウエハカセット搬送装置、前記半導体ウエハカセ
ット収納装置と半導体ウエハ枚葉処理装置と半導体ウエ
ハカセット搬送装置との複数台を制御する上位計算機、
及びこの上位計算機の端末からなる半導体ウエハ製造設
備において、 前記半導体ウエハカセット内に収納された複数の半導体
ウエハを他の半導体ウエハカセットに分けて収納しかつ
前記上位計算機に制御される半導体ウエハカセット分割
装置を備えたことを特徴とする半導体ウエハ製造設備。1. A semiconductor wafer cassette for accommodating a plurality of semiconductor wafers, a semiconductor wafer cassette accommodating device for accommodating a plurality of semiconductor wafer cassettes, and a semiconductor wafer single-wafer processing device for processing one semiconductor wafer at a time from the semiconductor wafer cassette. A semiconductor wafer cassette transfer device for transferring the semiconductor wafer cassette, a host computer for controlling a plurality of the semiconductor wafer cassette storage device, the semiconductor wafer single-wafer processing device, and the semiconductor wafer cassette transfer device,
And a semiconductor wafer manufacturing facility comprising terminals of this host computer, in which a plurality of semiconductor wafers housed in the semiconductor wafer cassette are separately stored in another semiconductor wafer cassette, and the semiconductor wafer cassette is controlled by the host computer. A semiconductor wafer manufacturing facility comprising a device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28691089A JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28691089A JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03148107A JPH03148107A (en) | 1991-06-24 |
| JPH0713996B2 true JPH0713996B2 (en) | 1995-02-15 |
Family
ID=17710575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28691089A Expired - Fee Related JPH0713996B2 (en) | 1989-11-02 | 1989-11-02 | Semiconductor wafer manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0713996B2 (en) |
-
1989
- 1989-11-02 JP JP28691089A patent/JPH0713996B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03148107A (en) | 1991-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5449310B2 (en) | System and method for scheduling wafer movement within a wafer processing tool | |
| US6303398B1 (en) | Method and system of managing wafers in a semiconductor device production facility | |
| US6078933A (en) | Method and apparatus for parallel processing for archiving and retrieval of data | |
| US20050216115A1 (en) | Transport management system and method thereorf | |
| JP4603131B2 (en) | Process recipe resetting apparatus and process recipe resetting method for semiconductor manufacturing system | |
| US20020147960A1 (en) | Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control | |
| TWI222662B (en) | Semiconductor wafer manufacturing execution system with special engineer requirement database | |
| JPH0713996B2 (en) | Semiconductor wafer manufacturing equipment | |
| JPH05338728A (en) | Wafer carrying method and device thereof | |
| US6909934B1 (en) | Efficient method of dynamic formulation of chamber selections for multiple chamber tools | |
| CN114551296A (en) | Partition management method and device, computer equipment and storage medium | |
| US11621185B2 (en) | Semiconductor manufacturing apparatus and method for transferring wafer | |
| JP2901786B2 (en) | Schedule creation device | |
| US20030187533A1 (en) | Process managing apparatus for managing production process including production fluctuation process | |
| JPH0750333A (en) | Sequential control device of process facility | |
| Garvey et al. | Robotics and host computer interface for NV-10 high current implanters | |
| JP3762070B2 (en) | Semiconductor wafer manufacturing apparatus and semiconductor wafer manufacturing method | |
| JP2743908B2 (en) | Semiconductor device manufacturing equipment | |
| JP2000082730A (en) | Substrate treating apparatus | |
| JPH0594931A (en) | Processing system of semiconductor manufacturing equipment | |
| JPH01257333A (en) | Method of controlling diffusion module system | |
| JPH0785469B2 (en) | Wafer transfer device in ion implantation system | |
| JPS592321A (en) | Control system for charged particle beam exposure device | |
| JPH0774068A (en) | Product treating device and method for determining product treatment | |
| JPH09190961A (en) | Control method for semiconductor aligner |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313111 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| LAPS | Cancellation because of no payment of annual fees |