JP2517002Y2 - 半導体素子収納用パッケージ - Google Patents
半導体素子収納用パッケージInfo
- Publication number
- JP2517002Y2 JP2517002Y2 JP1989051155U JP5115589U JP2517002Y2 JP 2517002 Y2 JP2517002 Y2 JP 2517002Y2 JP 1989051155 U JP1989051155 U JP 1989051155U JP 5115589 U JP5115589 U JP 5115589U JP 2517002 Y2 JP2517002 Y2 JP 2517002Y2
- Authority
- JP
- Japan
- Prior art keywords
- package
- positioning
- lead
- plan
- positioning member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 14
- 239000000758 substrate Substances 0.000 claims description 25
- 230000002093 peripheral effect Effects 0.000 claims description 6
- 238000001465 metallisation Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989051155U JP2517002Y2 (ja) | 1989-04-28 | 1989-04-28 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989051155U JP2517002Y2 (ja) | 1989-04-28 | 1989-04-28 | 半導体素子収納用パッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02142538U JPH02142538U (enrdf_load_stackoverflow) | 1990-12-04 |
JP2517002Y2 true JP2517002Y2 (ja) | 1996-11-13 |
Family
ID=31570338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989051155U Expired - Lifetime JP2517002Y2 (ja) | 1989-04-28 | 1989-04-28 | 半導体素子収納用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2517002Y2 (enrdf_load_stackoverflow) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5794952U (enrdf_load_stackoverflow) * | 1980-12-01 | 1982-06-11 | ||
JPS6151849A (ja) * | 1984-08-21 | 1986-03-14 | Toshiba Corp | フラツトパツケ−ジ形集積回路素子 |
JP2506989Y2 (ja) * | 1988-06-03 | 1996-08-14 | 新光電気工業株式会社 | 高周波素子用パッケ―ジ |
-
1989
- 1989-04-28 JP JP1989051155U patent/JP2517002Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02142538U (enrdf_load_stackoverflow) | 1990-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |