JP2514911Y2 - 半導体素子収納用パッケージ - Google Patents
半導体素子収納用パッケージInfo
- Publication number
- JP2514911Y2 JP2514911Y2 JP1990128569U JP12856990U JP2514911Y2 JP 2514911 Y2 JP2514911 Y2 JP 2514911Y2 JP 1990128569 U JP1990128569 U JP 1990128569U JP 12856990 U JP12856990 U JP 12856990U JP 2514911 Y2 JP2514911 Y2 JP 2514911Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- package
- insulating substrate
- frame
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 63
- 239000000758 substrate Substances 0.000 claims description 27
- 238000005219 brazing Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 23
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 14
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052863 mullite Inorganic materials 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000008646 thermal stress Effects 0.000 description 12
- 239000000843 powder Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229910052750 molybdenum Inorganic materials 0.000 description 3
- 239000011733 molybdenum Substances 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- 235000012255 calcium oxide Nutrition 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128569U JP2514911Y2 (ja) | 1990-11-29 | 1990-11-29 | 半導体素子収納用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990128569U JP2514911Y2 (ja) | 1990-11-29 | 1990-11-29 | 半導体素子収納用パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0485733U JPH0485733U (enrdf_load_stackoverflow) | 1992-07-24 |
| JP2514911Y2 true JP2514911Y2 (ja) | 1996-10-23 |
Family
ID=31876024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990128569U Expired - Lifetime JP2514911Y2 (ja) | 1990-11-29 | 1990-11-29 | 半導体素子収納用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2514911Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-11-29 JP JP1990128569U patent/JP2514911Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0485733U (enrdf_load_stackoverflow) | 1992-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2000340687A (ja) | 半導体素子収納用パッケージ | |
| JP2514911Y2 (ja) | 半導体素子収納用パッケージ | |
| JP3046148B2 (ja) | 電子部品収納用パッケージ | |
| JP3176251B2 (ja) | 半導体素子収納用パッケージ | |
| JPH05160284A (ja) | 半導体素子収納用パッケージ | |
| JP2783735B2 (ja) | 半導体素子収納用パッケージ | |
| JP2746813B2 (ja) | 半導体素子収納用パッケージ | |
| JP2710893B2 (ja) | リード付き電子部品 | |
| JP3426741B2 (ja) | 半導体素子収納用パッケージ | |
| JP3176267B2 (ja) | 半導体素子収納用パッケージ | |
| JP2515672Y2 (ja) | 半導体素子収納用パッケージ | |
| JP2813072B2 (ja) | 半導体素子収納用パッケージ | |
| JP2784094B2 (ja) | 半導体素子収納用パッケージ | |
| JP2813073B2 (ja) | 半導体素子収納用パッケージ | |
| JP2792636B2 (ja) | 半導体素子収納用パッケージ | |
| JPH09162337A (ja) | 半導体素子収納用パッケージ | |
| JP2728593B2 (ja) | 半導体素子収納用パッケージ | |
| JP2784129B2 (ja) | 半導体素子収納用パッケージ | |
| JP2670208B2 (ja) | 半導体素子収納用パッケージ | |
| JPH05144965A (ja) | 電子部品収納用パツケージ | |
| JP2948991B2 (ja) | 半導体素子収納用パッケージ | |
| JPH05166958A (ja) | 半導体素子収納用パッケージ | |
| JP2813074B2 (ja) | 半導体素子収納用パッケージ | |
| JPH08115990A (ja) | 半導体素子収納用パッケージ | |
| JPH08204047A (ja) | 電子部品収納用パッケージ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |