JP2514430Y2 - ハイブリッドic - Google Patents
ハイブリッドicInfo
- Publication number
- JP2514430Y2 JP2514430Y2 JP1988020926U JP2092688U JP2514430Y2 JP 2514430 Y2 JP2514430 Y2 JP 2514430Y2 JP 1988020926 U JP1988020926 U JP 1988020926U JP 2092688 U JP2092688 U JP 2092688U JP 2514430 Y2 JP2514430 Y2 JP 2514430Y2
- Authority
- JP
- Japan
- Prior art keywords
- hybrid
- insulating sheet
- terminals
- base ribbon
- ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020926U JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドic |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988020926U JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドic |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01125573U JPH01125573U (US08177716-20120515-C00003.png) | 1989-08-28 |
JP2514430Y2 true JP2514430Y2 (ja) | 1996-10-16 |
Family
ID=31237706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988020926U Expired - Lifetime JP2514430Y2 (ja) | 1988-02-19 | 1988-02-19 | ハイブリッドic |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2514430Y2 (US08177716-20120515-C00003.png) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01120856A (ja) * | 1987-11-04 | 1989-05-12 | Sony Corp | リードフレーム |
-
1988
- 1988-02-19 JP JP1988020926U patent/JP2514430Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01125573U (US08177716-20120515-C00003.png) | 1989-08-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20010017410A1 (en) | Mounting multiple semiconductor dies in a package | |
JPH064595Y2 (ja) | ハイブリッドic | |
JPH03169062A (ja) | 半導体装置 | |
JPH10284873A (ja) | 半導体集積回路装置およびicカードならびにその製造に用いるリードフレーム | |
JP2514430Y2 (ja) | ハイブリッドic | |
JP2587722Y2 (ja) | 半導体装置 | |
JP3248117B2 (ja) | 半導体装置 | |
JPS61177763A (ja) | 半導体装置 | |
JPS6122362U (ja) | 混成集積回路 | |
JPH0199245A (ja) | Icパッケージ | |
JPS6236299Y2 (US08177716-20120515-C00003.png) | ||
JP2562773Y2 (ja) | 半導体集積回路素子 | |
JPS6032769Y2 (ja) | 半導体素子 | |
JP2629461B2 (ja) | 樹脂封止形半導体装置 | |
JPS646041U (US08177716-20120515-C00003.png) | ||
JPH0451488Y2 (US08177716-20120515-C00003.png) | ||
US20040217449A1 (en) | Electronic component packaging | |
JPH0513624A (ja) | 半導体装置 | |
JPS5993148U (ja) | 樹脂封止型モジユ−ル | |
JPS63187330U (US08177716-20120515-C00003.png) | ||
JPH0637234A (ja) | 半導体装置 | |
JPS6122380U (ja) | 混成集積回路基板 | |
JPS58166041U (ja) | 半導体装置 | |
JPS59171372U (ja) | 薄型回路基板 | |
JPH0670243U (ja) | 回路基板装置 |