JP2513437Y2 - ワイヤボンディング装置 - Google Patents

ワイヤボンディング装置

Info

Publication number
JP2513437Y2
JP2513437Y2 JP1990077847U JP7784790U JP2513437Y2 JP 2513437 Y2 JP2513437 Y2 JP 2513437Y2 JP 1990077847 U JP1990077847 U JP 1990077847U JP 7784790 U JP7784790 U JP 7784790U JP 2513437 Y2 JP2513437 Y2 JP 2513437Y2
Authority
JP
Japan
Prior art keywords
lead frame
wire bonding
vertical movement
heating
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990077847U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0459141U (oth
Inventor
聡蔵 鳥越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990077847U priority Critical patent/JP2513437Y2/ja
Publication of JPH0459141U publication Critical patent/JPH0459141U/ja
Application granted granted Critical
Publication of JP2513437Y2 publication Critical patent/JP2513437Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers

Landscapes

  • Wire Bonding (AREA)
JP1990077847U 1990-07-24 1990-07-24 ワイヤボンディング装置 Expired - Lifetime JP2513437Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990077847U JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Publications (2)

Publication Number Publication Date
JPH0459141U JPH0459141U (oth) 1992-05-21
JP2513437Y2 true JP2513437Y2 (ja) 1996-10-09

Family

ID=31809536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990077847U Expired - Lifetime JP2513437Y2 (ja) 1990-07-24 1990-07-24 ワイヤボンディング装置

Country Status (1)

Country Link
JP (1) JP2513437Y2 (oth)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2817080B2 (ja) * 1992-11-27 1998-10-27 株式会社カイジョー ボンディング装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0237732A (ja) * 1988-07-27 1990-02-07 Toshiba Corp ワイヤボンディング装置

Also Published As

Publication number Publication date
JPH0459141U (oth) 1992-05-21

Similar Documents

Publication Publication Date Title
JP7664989B2 (ja) 実装装置
US6722412B2 (en) Die bonder
JP2513437Y2 (ja) ワイヤボンディング装置
JP2004513507A (ja) ダイ取付での加熱基板のための機械的クランプ装置
JPH0810191Y2 (ja) ワイヤボンディング装置
US4580338A (en) Apparatus for positioning electrical insulators in making a railway rail-and-fastening assembly
KR920005799B1 (ko) 반도체 장치의 제조장치
JPH04196148A (ja) チップ供給装置
JPH0238443Y2 (oth)
JP2817080B2 (ja) ボンディング装置
JPH06163646A (ja) 半導体チップ接着装置及び接着方法
JPS6276635A (ja) 半導体製造装置
JPS5737842A (en) Device for gang bonding
JP2505629B2 (ja) 貼付装置
JPH075633Y2 (ja) ワイヤボンダーにおける基板の位置決め装置
JP3217158B2 (ja) リードフレーム搬送方法及び装置
JP2538800B2 (ja) フレ―ムの搬送切換機構並びにその切換方法
JPS5824443Y2 (ja) リ−ドフレ−ム押え装置
JPH04298055A (ja) ボンディング装置
JPH1192159A (ja) ガラス基板の製造方法及びその装置
JPS61125026A (ja) ペレツトマウンタ−
JPH0344769Y2 (oth)
JPH0635470Y2 (ja) ワイヤボンデイング装置
KR200167855Y1 (ko) 리드온칩 패키지의 프리히팅 장치
JPS5935347Y2 (ja) 接点搬送装置