JP2508660Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JP2508660Y2 JP2508660Y2 JP11884990U JP11884990U JP2508660Y2 JP 2508660 Y2 JP2508660 Y2 JP 2508660Y2 JP 11884990 U JP11884990 U JP 11884990U JP 11884990 U JP11884990 U JP 11884990U JP 2508660 Y2 JP2508660 Y2 JP 2508660Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- heat dissipation
- board
- wiring
- laminated substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11884990U JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11884990U JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0476048U JPH0476048U (tr) | 1992-07-02 |
JP2508660Y2 true JP2508660Y2 (ja) | 1996-08-28 |
Family
ID=31866817
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11884990U Expired - Lifetime JP2508660Y2 (ja) | 1990-11-15 | 1990-11-15 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2508660Y2 (tr) |
-
1990
- 1990-11-15 JP JP11884990U patent/JP2508660Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0476048U (tr) | 1992-07-02 |
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