JP2506606Y2 - ワイヤ―ボンディングリ―ドパタ―ン - Google Patents

ワイヤ―ボンディングリ―ドパタ―ン

Info

Publication number
JP2506606Y2
JP2506606Y2 JP1990079932U JP7993290U JP2506606Y2 JP 2506606 Y2 JP2506606 Y2 JP 2506606Y2 JP 1990079932 U JP1990079932 U JP 1990079932U JP 7993290 U JP7993290 U JP 7993290U JP 2506606 Y2 JP2506606 Y2 JP 2506606Y2
Authority
JP
Japan
Prior art keywords
lead
wire bonding
bonding lead
pattern
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990079932U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0438043U (enrdf_load_stackoverflow
Inventor
俊明 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1990079932U priority Critical patent/JP2506606Y2/ja
Publication of JPH0438043U publication Critical patent/JPH0438043U/ja
Application granted granted Critical
Publication of JP2506606Y2 publication Critical patent/JP2506606Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
JP1990079932U 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン Expired - Fee Related JP2506606Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990079932U JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Publications (2)

Publication Number Publication Date
JPH0438043U JPH0438043U (enrdf_load_stackoverflow) 1992-03-31
JP2506606Y2 true JP2506606Y2 (ja) 1996-08-14

Family

ID=31624542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990079932U Expired - Fee Related JP2506606Y2 (ja) 1990-07-25 1990-07-25 ワイヤ―ボンディングリ―ドパタ―ン

Country Status (1)

Country Link
JP (1) JP2506606Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63140627U (enrdf_load_stackoverflow) * 1987-03-07 1988-09-16
JP2840948B2 (ja) * 1988-08-23 1998-12-24 富士ゼロックス株式会社 半導体装置

Also Published As

Publication number Publication date
JPH0438043U (enrdf_load_stackoverflow) 1992-03-31

Similar Documents

Publication Publication Date Title
US5742009A (en) Printed circuit board layout to minimize the clock delay caused by mismatch in length of metal lines and enhance the thermal performance of microeletronics packages via condution through the package leads
JP2506606Y2 (ja) ワイヤ―ボンディングリ―ドパタ―ン
JP2685037B2 (ja) セラミックケース
JPH05183055A (ja) 半導体装置
WO1993017455A3 (en) Integrated-circuit package configuration for packaging an integrated-circuit die and method of packaging an integrated-circuit die
JPH04199552A (ja) Ｉｃパッケージ
JPH01191433A (ja) 集積回路素子
JPH1022321A (ja) Ｉｃの実装構造
JPH04170057A (ja) Ｉｃパッケージ
KR970013290A (ko) 적층형 볼 그리드 어레이 패키지
JPS62191161A (ja) 感熱記録ヘツド
JPH0774307A (ja) 半導体装置
JPH05190674A (ja) 半導体集積回路装置
KR970007081Y1 (ko) 반도체 기억장치
JPH01200971A (ja) サーマルヘッド
JPH025561A (ja) 半導体装置
JPS6225518B2 (enrdf_load_stackoverflow)
JPH01316948A (ja) 半導体集積回路
JPS6292456A (ja) 集積回路装置
JPH0927513A (ja) 半導体集積回路
JPH03241887A (ja) 実装回路装置
JPS62229951A (ja) 半導体集積回路装置
JPS62121070A (ja) サ−マルヘツド
JPH01165247U (enrdf_load_stackoverflow)
JPH0645338U (ja) 半導体装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees