JP2505195Y2 - 電力半導体装置 - Google Patents

電力半導体装置

Info

Publication number
JP2505195Y2
JP2505195Y2 JP8351590U JP8351590U JP2505195Y2 JP 2505195 Y2 JP2505195 Y2 JP 2505195Y2 JP 8351590 U JP8351590 U JP 8351590U JP 8351590 U JP8351590 U JP 8351590U JP 2505195 Y2 JP2505195 Y2 JP 2505195Y2
Authority
JP
Japan
Prior art keywords
power semiconductor
heat spreader
semiconductor device
base substrate
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP8351590U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0442730U (un
Inventor
友広 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP8351590U priority Critical patent/JP2505195Y2/ja
Publication of JPH0442730U publication Critical patent/JPH0442730U/ja
Application granted granted Critical
Publication of JP2505195Y2 publication Critical patent/JP2505195Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
JP8351590U 1990-08-06 1990-08-06 電力半導体装置 Expired - Fee Related JP2505195Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8351590U JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8351590U JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Publications (2)

Publication Number Publication Date
JPH0442730U JPH0442730U (un) 1992-04-10
JP2505195Y2 true JP2505195Y2 (ja) 1996-07-24

Family

ID=31631246

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8351590U Expired - Fee Related JP2505195Y2 (ja) 1990-08-06 1990-08-06 電力半導体装置

Country Status (1)

Country Link
JP (1) JP2505195Y2 (un)

Also Published As

Publication number Publication date
JPH0442730U (un) 1992-04-10

Similar Documents

Publication Publication Date Title
JP2840316B2 (ja) 半導体装置およびその製造方法
JP3839178B2 (ja) 半導体装置
JP2007201324A (ja) 電子装置の実装構造および電子部品の実装方法
JP2505195Y2 (ja) 電力半導体装置
JP2829567B2 (ja) チップマウント型ｌｅｄ
JPH05291467A (ja) リードフレームおよび半導体装置
JP3317010B2 (ja) 電子装置
JP3851541B2 (ja) チップ部品およびその製造方法
JPH11163197A (ja) 半導体実装用基板
JPH0222886A (ja) 混成集積回路
JP2765083B2 (ja) 樹脂封止型半導体装置
JP2013012567A (ja) 半導体装置
JPH0333068Y2 (un)
JPH0142344Y2 (un)
JP2778790B2 (ja) 半導体装置の実装構造及び実装方法
JP2501668Y2 (ja) 表面実装用電気部品
JPS58101445A (ja) 樹脂封止半導体装置
JPH0810207Y2 (ja) 樹脂封止形半導体装置
JPS58191460A (ja) 電子部品
JPS62198143A (ja) リ−ドフレ−ム
JPH03237752A (ja) 電子部品パッケージ
JPH10154766A (ja) 半導体パッケージの製造方法及び半導体パッケージ
JP2003046230A5 (un)
JP2516394Y2 (ja) 半導体装置
JPH0366150A (ja) 半導体集積回路装置

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees