JP2505003Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JP2505003Y2 JP2505003Y2 JP4710589U JP4710589U JP2505003Y2 JP 2505003 Y2 JP2505003 Y2 JP 2505003Y2 JP 4710589 U JP4710589 U JP 4710589U JP 4710589 U JP4710589 U JP 4710589U JP 2505003 Y2 JP2505003 Y2 JP 2505003Y2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- polycrystalline silicon
- wiring
- bonding pad
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4710589U JP2505003Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4710589U JP2505003Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02138429U JPH02138429U (US07709020-20100504-C00041.png) | 1990-11-19 |
JP2505003Y2 true JP2505003Y2 (ja) | 1996-07-24 |
Family
ID=31562749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4710589U Expired - Lifetime JP2505003Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2505003Y2 (US07709020-20100504-C00041.png) |
-
1989
- 1989-04-20 JP JP4710589U patent/JP2505003Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH02138429U (US07709020-20100504-C00041.png) | 1990-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6346981B2 (US07709020-20100504-C00041.png) | ||
US6420208B1 (en) | Method of forming an alternative ground contact for a semiconductor die | |
US5117280A (en) | Plastic package semiconductor device with thermal stress resistant structure | |
JPH05226339A (ja) | 樹脂封止半導体装置 | |
JPH07201855A (ja) | 半導体装置 | |
JPS6156608B2 (US07709020-20100504-C00041.png) | ||
JP2505003Y2 (ja) | 半導体装置 | |
JPH03104247A (ja) | ウエハ・スケール半導体装置 | |
JP2838933B2 (ja) | 樹脂封止型半導体集積回路 | |
US5463245A (en) | Semiconductor integrated circuit device having sealing means | |
JPS61187262A (ja) | 半導体素子 | |
JP2570457B2 (ja) | 半導体装置 | |
JPH0462176B2 (US07709020-20100504-C00041.png) | ||
JPS6035525A (ja) | 半導体装置 | |
JPH0621061A (ja) | 半導体装置 | |
JP2737952B2 (ja) | 半導体装置 | |
JPH0691126B2 (ja) | 半導体装置 | |
JPS62219541A (ja) | 半導体装置 | |
JPS62245655A (ja) | 半導体装置 | |
JPH0642340Y2 (ja) | 半導体装置 | |
JP2781688B2 (ja) | 半導体装置 | |
JP3098333B2 (ja) | 半導体装置 | |
JPS6348181B2 (US07709020-20100504-C00041.png) | ||
JP2869978B2 (ja) | 半導体装置 | |
JPH0446451B2 (US07709020-20100504-C00041.png) |