JP2503793B2 - 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材 - Google Patents

打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材

Info

Publication number
JP2503793B2
JP2503793B2 JP3059620A JP5962091A JP2503793B2 JP 2503793 B2 JP2503793 B2 JP 2503793B2 JP 3059620 A JP3059620 A JP 3059620A JP 5962091 A JP5962091 A JP 5962091A JP 2503793 B2 JP2503793 B2 JP 2503793B2
Authority
JP
Japan
Prior art keywords
wear
plate material
effect
alloy plate
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3059620A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04276036A (ja
Inventor
竹四 鈴木
直男 榊原
萬平 桑原
崇夫 深民
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Shindoh Co Ltd
Original Assignee
Mitsubishi Shindoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Shindoh Co Ltd filed Critical Mitsubishi Shindoh Co Ltd
Priority to JP3059620A priority Critical patent/JP2503793B2/ja
Priority to DE1992602080 priority patent/DE69202080T2/de
Priority to EP19920103249 priority patent/EP0501438B1/de
Publication of JPH04276036A publication Critical patent/JPH04276036A/ja
Application granted granted Critical
Publication of JP2503793B2 publication Critical patent/JP2503793B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP3059620A 1991-03-01 1991-03-01 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材 Expired - Lifetime JP2503793B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3059620A JP2503793B2 (ja) 1991-03-01 1991-03-01 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材
DE1992602080 DE69202080T2 (de) 1991-03-01 1992-02-26 Feinbleche aus einer Legierung auf Kupferbasis, welche bei Verarbeitung einen niedrigen Veschleiss des Stanzwerkzeuges verursachen, und ihre Verwendung für elektrische und elektronische Bauteile.
EP19920103249 EP0501438B1 (de) 1991-03-01 1992-02-26 Feinbleche aus einer Legierung auf Kupferbasis, welche bei Verarbeitung einen niedrigen Veschleiss des Stanzwerkzeuges verursachen, und ihre Verwendung für elektrische und elektronische Bauteile

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3059620A JP2503793B2 (ja) 1991-03-01 1991-03-01 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材

Publications (2)

Publication Number Publication Date
JPH04276036A JPH04276036A (ja) 1992-10-01
JP2503793B2 true JP2503793B2 (ja) 1996-06-05

Family

ID=13118472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3059620A Expired - Lifetime JP2503793B2 (ja) 1991-03-01 1991-03-01 打抜金型の摩耗抑制効果を有する電気電子部品用Ｃｕ合金板材

Country Status (3)

Country Link
EP (1) EP0501438B1 (de)
JP (1) JP2503793B2 (de)
DE (1) DE69202080T2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5633094A (en) * 1994-10-28 1997-05-27 Hitachi, Ltd. Valve having facing layers of co-free Ni-base Alloy
JP3739214B2 (ja) 1998-03-26 2006-01-25 株式会社神戸製鋼所 電子部品用銅合金板
JP3520034B2 (ja) 2000-07-25 2004-04-19 古河電気工業株式会社 電子電気機器部品用銅合金材
JP3520046B2 (ja) 2000-12-15 2004-04-19 古河電気工業株式会社 高強度銅合金
US7090732B2 (en) 2000-12-15 2006-08-15 The Furukawa Electric, Co., Ltd. High-mechanical strength copper alloy

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5834536B2 (ja) * 1980-06-06 1983-07-27 日本鉱業株式会社 半導体機器のリ−ド材用の銅合金
US4656003A (en) * 1984-10-20 1987-04-07 Kabushiki Kaisha Kobe Seiko Sho Copper alloy and production of the same
JPH066725B2 (ja) * 1985-12-05 1994-01-26 本田技研工業株式会社 自己潤滑性を有する焼結銅合金の製造方法
JPH01272733A (ja) * 1988-04-25 1989-10-31 Mitsubishi Shindoh Co Ltd 半導体装置用Ｃｕ合金製リードフレーム材
JPH0266130A (ja) * 1988-08-29 1990-03-06 Mitsubishi Shindoh Co Ltd 打抜金型摩耗の少ない端子・コネクタ用Ｃｕ合金
JPH0776397B2 (ja) * 1989-07-25 1995-08-16 三菱伸銅株式会社 Ｃｕ合金製電気機器用コネクタ

Also Published As

Publication number Publication date
JPH04276036A (ja) 1992-10-01
DE69202080D1 (de) 1995-05-24
DE69202080T2 (de) 1995-09-14
EP0501438B1 (de) 1995-04-19
EP0501438A1 (de) 1992-09-02

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