JP2502903B2 - Bamboo particle board manufacturing method - Google Patents
Bamboo particle board manufacturing methodInfo
- Publication number
- JP2502903B2 JP2502903B2 JP4357122A JP35712292A JP2502903B2 JP 2502903 B2 JP2502903 B2 JP 2502903B2 JP 4357122 A JP4357122 A JP 4357122A JP 35712292 A JP35712292 A JP 35712292A JP 2502903 B2 JP2502903 B2 JP 2502903B2
- Authority
- JP
- Japan
- Prior art keywords
- bamboo
- particle board
- chips
- chip
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Debarking, Splitting, And Disintegration Of Timber (AREA)
- Dry Formation Of Fiberboard And The Like (AREA)
Description
【発明の詳細な説明】Detailed Description of the Invention
【０００１】[0001]
【産業上の利用分野】本発明は建築用，家具用，梱包用
に好適な竹製パーティクルボードに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bamboo particle board suitable for construction, furniture and packing.
【０００２】[0002]
【従来の技術】パーティクルボードはＪＩＳ Ａ ５９
０８に規定されており、木片の小片（チップ、フレー
ク、ウエハー、ストランドなど）を主原料として、接着
剤をもって成形熱圧したものをいう。2. Description of the Related Art Particleboard is JIS A 59
No. 08, which means that a small piece of wood chips (chips, flakes, wafers, strands, etc.) is used as a main raw material and is molded and hot pressed with an adhesive.
【０００３】ＪＩＳに規定されたとおり、主原料は木片
であって、この木片は例えば製材にともなう廃材や利用
価値の低い小径木や払われた枝が当てられ、木材資源の
有効活用を図っている。一方、木材の消費が樹木の成長
速度を越え、世界的に木材資源が枯渇しつつあることも
事実である。As stipulated in JIS, the main raw material is wood chips. For example, waste wood associated with lumber, small-diameter trees with low utility value, and pruned branches are applied to the wood chips for effective utilization of wood resources. There is. On the other hand, it is also true that the consumption of timber exceeds the growth rate of trees and the timber resources are being depleted worldwide.
【０００４】そこで、成長速度の早い「竹」が注目さ
れ、特開昭４９−９９３７５号や特開昭５６−８９５３
９号が提案されている。特開昭４９−９９３７５号は、
竹を粉砕し、固形液を入れてミキサーし、型枠に流し込
み圧縮し、乾燥するというものである。特開昭５６−８
９５３９号は、竹の原木を破砕して原材料を作り、接着
剤を混合し、型枠に押入して成形圧搾固着し、竹木を製
造するというものである。Therefore, "bamboo", which has a high growth rate, has been attracting attention, and is disclosed in Japanese Patent Laid-Open Nos. 49-99375 and 56-8953.
No. 9 has been proposed. JP-A-49-99375 discloses
Bamboo is ground, mixed with a solid solution, poured into a mold, compressed, and dried. JP-A-56-8
No. 9539 is to manufacture a bamboo tree by crushing a raw bamboo tree to make a raw material, mixing an adhesive, pushing the raw material into a mold, press-molding and fixing it.
【０００５】[0005]
【発明が解決しようとする課題】上記方法に基づいて、
竹を粉砕してパーティクルボードを試験的に製造したと
ころ、間もなくカビが生え、且つ虫が発生することが分
った。これが今日まで、竹を原料としたパーティクルボ
ードが実用化されなかった大きな理由である。そこで本
発明の目的はカビや虫の発生しない竹製パーティクルボ
ードを製造し得る製造方法を提供することにある。Based on the above method,
When bamboo was crushed and a particle board was experimentally produced, it was soon found that molds and insects were generated. This is the main reason why particle boards made from bamboo have not been put to practical use until today. Therefore, an object of the present invention is to provide a manufacturing method capable of manufacturing a bamboo particle board that is free from mold and insects.
【０００６】[0006]
【課題を解決するための手段および作用】上記目的を達
成するべく本発明は、竹を適当な大きさの竹チップにす
る竹チップ製造工程と、この竹チップを加熱してデンプ
ン質を安定化処理する竹チップ加熱工程と、この竹チッ
プにホルムアルデヒド系接着剤，シランカップリング
剤，水を加えてこれらを攪拌混合する混合工程と、この
混合物を熱間プレス機で一定の温度に加熱しつつ圧縮成
形する加熱圧縮成形工程とからなる竹製パーティクルボ
ードを製造する。Means and Actions for Solving the Problems In order to achieve the above object, the present invention provides a bamboo chip manufacturing process for converting bamboo into bamboo chips having an appropriate size, and heating the bamboo chips to stabilize starch quality. Bamboo chip heating process to be treated, formaldehyde adhesive, silane coupling agent, water is added to the bamboo chips and mixed with stirring, and the mixture is heated to a constant temperature with a hot press machine. A bamboo particle board is manufactured, which comprises a heat compression molding step of compression molding.
【０００７】前記竹チップは、３〜５年ものの竹から削
り出した厚さ０．０５〜０．５ｍｍ，幅５〜１５ｍｍ、
長さ３０〜５０ｍｍのチップであることが好ましい。前
記混合物の組成は、竹チップに対してホルムアルデヒド
系接着剤が５〜１３％、シランカップリング剤が０．０
１〜２．０％、そして水が５０〜７０％であるとよい。The bamboo chip has a thickness of 0.05 to 0.5 mm and a width of 5 to 15 mm, which is carved out of bamboo for 3 to 5 years.
It is preferable that the chip has a length of 30 to 50 mm. The composition of the mixture is 5 to 13% formaldehyde adhesive and 0.0% silane coupling agent to bamboo chips.
1-2.0% and water 50-70%.
【０００８】[0008]
【実施例】本発明の実施例を添付図面に基づいて以下に
説明する。図１は本発明の竹製パーティクルボード製造
方法のフロー図であり、３〜５年ものの竹１を、手動か
んなでシェービングすることで厚さ０．０５〜０．５ｍ
ｍ，幅５〜１５ｍｍ、長さ３０〜５０ｍｍの竹チップ２
を造る（竹チップ製造工程）。Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a flow chart of a method for manufacturing a bamboo particle board according to the present invention. A bamboo 1 of 3 to 5 years old is shaving with a manual planer to have a thickness of 0.05 to 0.5 m.
m, width 5 to 15 mm, length 30 to 50 mm bamboo chip 2
To make (bamboo chip manufacturing process).
【０００９】木材用のかんなで竹を削るとすぐに切れな
くなるので、本発明ではかんなにＰＶＤ法でＴｉＮ，Ｔ
ｉＣ，ＳｉＣ等の膜を被せることで、刃の寿命を延ば
し、竹の節をも切削可能にし、竹チップの歩留りを１０
％ほど向上することに成功した。In the present invention, the PVD method is used for TiN, T because the bamboo will not be cut immediately when the bamboo is cut with a planer for wood.
By covering with a film of iC, SiC, etc., the life of the blade is extended, bamboo nodes can be cut, and the yield of bamboo chips is 10%.
It succeeded in improving about%.
【００１０】上記竹チップ２は、熱風加熱乾燥法にて８
０〜１００℃で、１２０分間加熱する（竹チップ加熱工
程）。この竹チップ加熱工程を加えたことが本発明の特
徴であり、本発明者は木材の水分含有率が１５％程度で
あるのに対して竹の水分含有率が５０〜６０％と高く且
つデンプン質を豊富に含んでいることが、かびの発生お
よび虫の発生の原因であることを突き止めた。１２０分
間加熱することでデンプンが変質し、以降デンプンに戻
らない安定した物質に変化する。この間、５０〜６０％
の水分含有率は５〜１０％の水分含有率となる。The above bamboo chips 2 were dried by hot air drying method 8
It heats at 0-100 degreeC for 120 minutes (bamboo chip heating process). It is a feature of the present invention that this bamboo chip heating step is added. The present inventor has found that the water content of wood is about 15%, whereas the water content of bamboo is as high as 50 to 60% and starch is high. We have found that abundant quality is the cause of mold and insect outbreaks. By heating for 120 minutes, the starch deteriorates and changes into a stable substance that does not return to starch thereafter. During this period, 50-60%
The water content rate of is 5 to 10%.
【００１１】次に攪拌機４に、竹チップ２０８ｇ，ホル
ムアルデヒド系接着剤２７ｇ，シランカップリング剤
１．０４ｇ，水１６０ｇの割合で投入し、充分に攪拌す
る（混合工程）。シランカップリング剤は接着剤の接着
強度を強化するものである。この混合物を２４時間熟成
する。ホルムアルデヒド系接着剤はユリア樹脂系（Ｕタ
イプ），ユリア・メラミン共縮合樹脂系（Ｍタイプ），
フェノール樹脂系（Ｆタイプ），ホルムアルデヒド放出
量が０．５ｍｇ／ｌ以下のフェノール樹脂系（Ｆ0タイ
プ）が好適である。なお、混合の順番は任意であり、例
えばシランカップリング剤で処理した竹チップに接着剤
を加える、または接着剤にシランカップリング剤を加え
たものを竹チップに混合するのいずれでもよい。Next, 208 g of bamboo chips, 27 g of formaldehyde-based adhesive, 1.04 g of silane coupling agent, and 160 g of water are put into the stirrer 4 and sufficiently stirred (mixing step). The silane coupling agent enhances the adhesive strength of the adhesive. The mixture is aged for 24 hours. Formaldehyde adhesives are urea resin type (U type), urea / melamine co-condensed resin type (M type),
Phenolic resin (F type), formaldehyde emission amount is 0.5 mg / l or less of phenolic resin (F 0 type) is preferred. The order of mixing is arbitrary, and for example, an adhesive may be added to the bamboo chip treated with the silane coupling agent, or the bamboo chip may be mixed with the adhesive to which the silane coupling agent is added.
【００１２】更に、上記重量組成の内容を説明すると、
竹チップに対して接着剤は５〜１３％、シランカップリ
ング剤は０．０１〜２．０％（好しくは０．５％）、そ
して水は５０〜７０％（好しくは６０％）である。水が
５０％未満では接着剤の滲み込みが不良となり、かつ水
分不足により成形品の熱伝導が悪くなるので成形に時間
が掛かる。一方、水が７０％を越えると接着剤の流出を
招き、所定の物性が得られなくなる。Further, the contents of the above weight composition will be explained.
Adhesive to bamboo chips is 5 to 13%, silane coupling agent is 0.01 to 2.0% (preferably 0.5%), and water is 50 to 70% (preferably 60%). Is. If the water content is less than 50%, the penetration of the adhesive will be poor, and the heat conduction of the molded product will be poor due to lack of water, which will take a long time for molding. On the other hand, if the water content exceeds 70%, the adhesive may flow out, and the desired physical properties may not be obtained.
【００１３】熟成後の混合物を、１１０〜１６０℃（Ｕ
タイプ→Ｍタイプ→Ｆ，Ｆ0タイプの順で高温にす
る。）に保った熱間プレス機５の金型に流し込み、５０
ｋｇｆ／ｃｍ2の圧力で１５〜２０分間加熱圧縮する
（加熱圧縮成形工程）。これで、例えば６ｍｍ×２００
ｍｍ×２００ｍｍの粗地パーティクルボード６を得る。
この粗地パーティクルボード６は目的に応じて含浸紙張
り、単板張り、その他の２次加工を施せばよい。After aging, the mixture is heated to 110 to 160 ° C. (U
Increase the temperature in order of type → M type → F, F 0 type. ), And pour it into the mold of the hot press machine 5,
Heat compression is performed for 15 to 20 minutes at a pressure of kgf / cm 2 (heat compression molding step). With this, for example, 6 mm x 200
A rough particle board 6 of mm × 200 mm is obtained.
The rough particle board 6 may be impregnated with paper, veneer, or other secondary processing depending on the purpose.
【００１４】次に本発明方法で製造した竹製パーティク
ルボード（実施例）と従来方法で製造した竹パーティク
ルボード（比較例１）と従来の木製パーティクルボード
（市販品）（比較例２）とＪＩＳ Ａ ５９０８ ２０
０タイプの規格値（比較例３）の物性値を「表１」に基
づいて説明する。Next, bamboo particle board manufactured by the method of the present invention (Example), bamboo particle board manufactured by the conventional method (Comparative Example 1), conventional wooden particle board (commercial product) (Comparative Example 2) and JIS. A 5908 20
The physical property values of the 0 type standard value (Comparative Example 3) will be described based on "Table 1".
【００１５】[0015]
【表１】 [Table 1]
【００１６】比較例１は従来方法即ち木製パーティクル
ボードと同じ方法で製造した竹パーティクルボードであ
り、当然のことながら竹チップの加熱処理および混合時
の水分調整は実施していない。比較例２は市販されてい
る木製パーティクルボードの一種を記載した。Comparative Example 1 is a bamboo particle board manufactured by the conventional method, that is, the same method as the wooden particle board, and of course, the heat treatment of the bamboo chips and the water content adjustment at the time of mixing are not carried out. Comparative Example 2 described one type of commercially available wooden particle board.
【００１７】表１は各サンプル１０個の平均値を記載し
たが、実施例は、曲げ強さにおいて比較例２に遜色無
く、剥離強さにおいては比較例２より遥かに大きく、吸
水厚さ膨張率は比較例２の１／３と良好である。なお、
吸水厚さ膨張率は試験片を２５℃の水に２４時間浸漬
し、（膨張量）÷（元の厚さ）で算出する。よって、吸
水厚さ膨張率が小さいほど水を吸収しにくく、水に強い
と言える。比較例１はカビの問題があり、機械性質的に
も実施例より下る。比較例３に示す規格値を実施例は全
て満している。従って本発明に係る竹製パーティクルボ
ードは従来の木製パーティクルボードよりよい特性を有
し、充分に木製パーティクルボードに代り得るものであ
る。Table 1 shows the average value of 10 samples, but the working example is comparable to the comparative example 2 in flexural strength and much larger in peel strength than the comparative example 2, and the water absorption thickness expansion. The rate is as good as 1/3 of Comparative Example 2. In addition,
The water absorption thickness expansion coefficient is calculated by immersing the test piece in water at 25 ° C. for 24 hours and calculating (expansion amount) ÷ (original thickness). Therefore, it can be said that the smaller the water absorption thickness expansion coefficient is, the less water is absorbed and the stronger the water is. Comparative Example 1 has the problem of mold, and is lower than the Examples in terms of mechanical properties. All the examples satisfy the standard values shown in Comparative Example 3. Therefore, the bamboo particle board according to the present invention has better characteristics than the conventional wooden particle board and can sufficiently replace the wooden particle board.
【００１８】[0018]
【発明の効果】以上に述べた通り本発明は、竹を破砕し
て樹脂を混入して適当な形状に加圧成形するという従来
の方法とは異なり、竹チップを加熱して含有デンプン質
を安定化処理する工程を付加したので、カビや虫の発生
のない竹製パーティクルボードを得ることができた。INDUSTRIAL APPLICABILITY As described above, the present invention differs from the conventional method in which bamboo is crushed, resin is mixed and pressure-molded into an appropriate shape, and bamboo chips are heated to remove starch content. Since the stabilization process was added, it was possible to obtain a bamboo particle board free from mold and insects.
【００１９】また、加熱工程で失われた水を混合工程で
補充するようにしたことを特徴とし、これにより接着剤
の滲み込みを良好にしてパーティクルボードの機械強度
を高め、さらに加熱プレス成形時の熱伝導を良好に保っ
て生産性を向上させることができる。Further, it is characterized in that water lost in the heating step is replenished in the mixing step, whereby the permeation of the adhesive is improved and the mechanical strength of the particle board is increased, and further during hot press molding. It is possible to maintain good heat conduction and improve productivity.
【図１】本発明の竹製パーティクルボード製造方法のフ
ロー図FIG. 1 is a flow chart of a method for manufacturing a bamboo particle board according to the present invention.
１…竹、２…竹チップ、４…攪拌機、５…熱間プレス
機、６…粗地パーティクルボード。1 ... Bamboo, 2 ... Bamboo chips, 4 ... Stirrer, 5 ... Hot press machine, 6 ... Coarse particle board.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 吉見 直喜 神奈川県藤沢市円行1420 芙蓉工業株式 会社内 (56)参考文献 特開 昭56−89539（ＪＰ，Ａ) 特開 平１−171801（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Naoki Yoshimi 1420 Enyuki, Fujisawa-shi, Kanagawa Inside Fuyo Kogyo Co., Ltd. (56) References JP-A-56-89539 (JP, A) JP-A-1-171801 (JP) , A)
Claims (2)
ップ製造工程と、この竹チップを加熱してデンプン質を
安定化処理する竹チップ加熱工程と、この竹チップに、
竹チップに対してホルムアルデヒド系接着剤を５〜１３
％、シランカップリング剤を０．０１〜２．０％、そし
て水を５０〜７０％加えて攪拌混合する混合工程と、こ
の混合物を熱間プレス機で一定の温度に加熱しつつ圧縮
成形する加熱圧縮成形工程とからなる竹製パーティクル
ボードの製造方法。1. A bamboo chip manufacturing process for converting bamboo into bamboo chips of an appropriate size, a bamboo chip heating process for heating the bamboo chips to stabilize the starch quality, and the bamboo chips .
Formaldehyde adhesive for bamboo chips 5-13
%, 0.01 to 2.0% silane coupling agent,
A method of manufacturing a bamboo particle board comprising a mixing step of adding 50 to 70% of water and stirring and mixing, and a heat compression molding step of compression molding while heating the mixture to a constant temperature with a hot press machine.
削り出した厚さ０．０５〜０．５ｍｍ，幅５〜１５ｍ
ｍ、長さ３０〜５０ｍｍのチップであることを特徴とし
た請求項１記載の竹製パーティクルボードの製造方法。2. The bamboo chips, each of which has a thickness of 0.05 to 0.5 mm and a width of 5 to 15 m, carved out from a bamboo of 3 to 5 years old.
The method for manufacturing a bamboo particle board according to claim 1, wherein the chip is a chip having m and a length of 30 to 50 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4357122A JP2502903B2 (en) | 1992-12-22 | 1992-12-22 | Bamboo particle board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4357122A JP2502903B2 (en) | 1992-12-22 | 1992-12-22 | Bamboo particle board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06293008A JPH06293008A (en) | 1994-10-21 |
| JP2502903B2 true JP2502903B2 (en) | 1996-05-29 |
Family
ID=18452497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4357122A Expired - Lifetime JP2502903B2 (en) | 1992-12-22 | 1992-12-22 | Bamboo particle board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2502903B2 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5689539A (en) * | 1979-12-22 | 1981-07-20 | Tokuzo Koizumi | Construction material made of pressed, bonded and molded material bamboo |
| JP2535194B2 (en) * | 1987-12-26 | 1996-09-18 | 株式会社産業技術研究所 | How to make lightweight wood products |
-
1992
- 1992-12-22 JP JP4357122A patent/JP2502903B2/en not_active Expired - Lifetime
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