JPH0717892B2 - Method of manufacturing parquet board - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a parquet pattern decorative board.

(Background of the Invention) The applicant of the present application has already developed the following method of manufacturing a parquet pattern decorative board. That is, moist, plate-like, prismatic, etc. wood having a water content above the fiber saturation point is immersed in hot water at about 90 ° C., then taken out and the surface excluding the wood mouth, that is, the top and bottom surfaces and the non-wood mouth vertical After cutting the side surface with a planer, a saw, etc., and then drying the wood by leaving it in the air to slightly lower the water content of the cutting surface from the fiber saturation point, and after cutting the wood to a predetermined length, The second step of forming a collective block by bringing and pressing the wood pieces together through a moisture-curing urethane adhesive, and thinly cutting the collective block in the direction in which the cross section of the wood pieces is obtained. That is, the method for producing a parquet pattern decorative board has a third step of obtaining a parquet pattern decorative veneer and a fourth step of adhering the parquet pattern decorative veneer to a substrate via an adhesive.

By the way, in the first step, if the water content of the surface of the wood is lowered slightly below the fiber saturation point and then the wood is bonded using a moisture-curing urethane adhesive, no drying is performed and the surface is very high. The adhesive strength can be made extremely high as compared with the case of adhering timbers having a water content of wet. However, if the water content of the surface of the wood is too much lower than the fiber saturation point, there is a problem that the adhesive strength is lower than that in the above state. Then, when actually carrying out the method for manufacturing the parquet pattern decorative board, it is difficult to keep the water content of the surface of the wood slightly lower than the fiber saturation point, and if the time for leaving to dry in the air becomes a little longer,
There is a problem that the water content on the surface of wood is considerably lower than the fiber saturation point, and as a result, the adhesive strength is lowered. Therefore, in order to solve this problem, it is conceivable to add a small amount of water to the moisture-curable urethane adhesive, but in that case, there was a problem that the pot life was extremely shortened and the workability was poor.

(Object of the Invention) The present invention is intended to solve the problems as described above, and improves the pot life of a moisture-curable urethane-based adhesive to improve workability while improving the surface of wood. The purpose of the present invention is to make it possible to firmly bond even if the water content of the above is considerably lower than the fiber saturation point.

(Examples) The present invention will be described below based on Examples.

First step Wet a rectangular prismatic wood with a water content above the fiber saturation point, soak it in hot water at about 90 ° C, and then take it out and remove the surface except the wood mouth, that is, the top and bottom surfaces and the vertical side surface that is not wood mouth. The wood is cut with a saw or the like, and then the wood is left to dry in the atmosphere to bring the water content of the cut surface below the fiber saturation point.

Second step: After cutting the wood pieces into a predetermined length, the wood pieces are brought together and pressed together with an adhesive as described below to form a collective block. The unnecessary wood part generated in this process is discarded.

Adhesive Example 1 100 parts by weight of a moisture-curable urethane resin adhesive, and 50 parts by weight of water-absorbed water-absorbing polymer compound powder (trade name "Aqualic" [Nippon Shokubai Kagaku Kogyo Co., Ltd.] Manufactured, and having an average particle size of 100 mesh before water absorption)) and well stirred with 2 parts by weight (in a state of absorbing water) Adhesive Example 2 100 parts by weight of moisture curable urethane resin adhesive , Powdered granules of super absorbent polymer that absorbed 100 times weight of water (trade name "Sunwet" [manufactured by Sanyo Kasei Co., Ltd., average particle size before absorption is 80 mesh]) 2 What was added well by weight (in a state where water was absorbed) and well stirred. If the viscosity of the super absorbent polymer powder is too fine, the pot life will be shortened, and conversely, it will be too coarse. Content of powder and granules in moisture-curable urethane resin adhesive Since uniform adhesion density becomes rough is not obtained, the particle size of the granular material, prior to be allowed to absorb water swelling 50-300
A mesh is preferred.

Third step: This collective block is thinly cut in the direction in which the timber cross section is obtained to obtain a parquet pattern decorative veneer.

Fourth Step This veneered decorative veneer is attached to a substrate with an adhesive such as a urea melamine resin adhesive.

(Comparative Experiment) Two sets of two oak materials (90 × 42 × 300 mm water content 20 to 25%) were prepared, and each of the sets had an adhesive example 1, an adhesive example 2 and a comparative example adhesive (moisture curing). Type urethane resin adhesive 100 parts by weight to which 2 parts by weight of water is added) 7 g is applied, and 5 kg / cm ²
After cold-pressing for about 3 hours, the following results were obtained.

(Effects of the Invention) The present invention has the following effects due to the configuration as described above.

Since the pot life of the adhesive is long, the wood bonding process is easy to perform, and even if the water content on the surface of the wood is significantly lower than the fiber saturation point, the water absorbed by the super absorbent polymer will not be absorbed. Since it can be firmly bonded by using it, a high-quality parquet pattern decorative board can be efficiently obtained.

Claims (1)

[Claims] 1. A damp wood having a rectangular cross section having a water content above the fiber saturation point is immersed in hot water, taken out, and the upper and lower surfaces and the vertical side surfaces not cut through are cut by a planer, a saw or the like, and then the wood is cut. The first step of keeping the water content of the cutting surface below the fiber saturation point by leaving it to dry in the air, and the step of bringing the woods together and pressing them with an adhesive between them to form a collective block. Two steps, a third step to obtain a parquet pattern decorative veneer by thinly cutting the aggregate block in the direction in which the timber cross section is obtained, and the parquet pattern decorative veneer is attached to a substrate with an adhesive. And a moisture-curable urethane adhesive as the adhesive in the second step, to which 0.2 to 15% by weight of water-swelled powder particles of the superabsorbent polymer compound is added. To make a parquet decorative board using adhesive .