JP2013123904A - Particle board - Google Patents
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- JP2013123904A JP2013123904A JP2011275750A JP2011275750A JP2013123904A JP 2013123904 A JP2013123904 A JP 2013123904A JP 2011275750 A JP2011275750 A JP 2011275750A JP 2011275750 A JP2011275750 A JP 2011275750A JP 2013123904 A JP2013123904 A JP 2013123904A
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- 239000002245 particle Substances 0.000 title claims abstract description 72
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims abstract description 60
- 235000017491 Bambusa tulda Nutrition 0.000 claims abstract description 60
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims abstract description 60
- 241001330002 Bambuseae Species 0.000 claims abstract description 58
- 239000011425 bamboo Substances 0.000 claims abstract description 58
- 239000000853 adhesive Substances 0.000 claims abstract description 30
- 230000001070 adhesive effect Effects 0.000 claims abstract description 30
- 239000012948 isocyanate Substances 0.000 claims abstract description 24
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 24
- 239000002344 surface layer Substances 0.000 claims description 28
- 239000002356 single layer Substances 0.000 claims description 14
- 239000005056 polyisocyanate Substances 0.000 claims description 9
- 229920001228 polyisocyanate Polymers 0.000 claims description 9
- -1 polymethylene Polymers 0.000 claims description 9
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 27
- 230000007423 decrease Effects 0.000 abstract description 5
- 230000008961 swelling Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 28
- 239000002023 wood Substances 0.000 description 19
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 18
- 238000005452 bending Methods 0.000 description 17
- 239000002699 waste material Substances 0.000 description 16
- 229920000538 Poly[(phenyl isocyanate)-co-formaldehyde] Polymers 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 241000218645 Cedrus Species 0.000 description 5
- 238000007731 hot pressing Methods 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 229920001807 Urea-formaldehyde Polymers 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 241000209128 Bambusa Species 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- 244000302661 Phyllostachys pubescens Species 0.000 description 2
- 235000003570 Phyllostachys pubescens Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- JZLWSRCQCPAUDP-UHFFFAOYSA-N 1,3,5-triazine-2,4,6-triamine;urea Chemical compound NC(N)=O.NC1=NC(N)=NC(N)=N1 JZLWSRCQCPAUDP-UHFFFAOYSA-N 0.000 description 1
- 235000001674 Agaricus brunnescens Nutrition 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005606 hygroscopic expansion Effects 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- Dry Formation Of Fiberboard And The Like (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本発明はパーティクルボードに関し、さらに詳しくいえば、竹チップを利用したパーティクルボードに関する。 The present invention relates to a particle board, and more particularly to a particle board using bamboo chips.
パーティクルボードは、例えば、特許文献１に、木質チップにフェノール樹脂、メラミン樹脂、尿素樹脂、尿素メラミン共縮合樹脂、イソシアネート系樹脂等の接着剤を添加してフォーミングし、このフォーミングマットを熱圧成形して製造することが開示されている。 The particle board is formed, for example, by adding an adhesive such as phenol resin, melamine resin, urea resin, urea melamine co-condensation resin, isocyanate resin, etc. to the wood chip in Patent Document 1, and this forming mat is formed by hot pressing. Manufacturing is disclosed.
パーティクルボードには、吸水性が低いこと、吸水による厚み方向の膨張率（以下、厚さ膨張率という）が小さいこと、かつ吸湿による面方向の膨張率（以下、線膨張率という）が小さいこと（寸法安定性が良いこと）、更には、水分を吸収しても強度がほとんど低下しないこと、が要求されている。
しかしながら、それら全ての物性が良好であるパーティボードを製造することは困難であった。特に、厚さ膨張率を改善すると線膨張率の性能が低下するという傾向があることから、厚さ膨張率と線膨張率の両方の物性を、特定の基準値（厚さ膨張率：６．０％未満、線膨張率：０．３％未満）を満たすようにすることは今までなされていなかった。
The particle board has a low water absorption, a small expansion coefficient in the thickness direction due to water absorption (hereinafter referred to as a thickness expansion coefficient), and a small expansion coefficient in the surface direction due to moisture absorption (hereinafter referred to as a linear expansion coefficient). Further, it is required that the dimensional stability is good and that the strength hardly decreases even when moisture is absorbed.
However, it has been difficult to produce a party board having all of these physical properties. In particular, when the thickness expansion coefficient is improved, the performance of the linear expansion coefficient tends to be lowered. Therefore, the physical properties of both the thickness expansion coefficient and the linear expansion coefficient are determined based on a specific reference value (thickness expansion coefficient: 6. (0%, linear expansion coefficient: less than 0.3%) has not been achieved so far.
本発明は上記問題点に鑑みてなされたもので、吸水性が低く、吸水による厚さ膨張率が小さく、かつ吸湿による線膨張率が小さく（寸法安定性が良く）、水分を吸収しても曲げ強さの低下が少ないパーティクルボードを提供することを目的とする。 The present invention has been made in view of the above problems, and has a low water absorption, a small thickness expansion coefficient due to water absorption, a small linear expansion coefficient due to moisture absorption (good dimensional stability), and absorbs moisture. An object of the present invention is to provide a particle board with little decrease in bending strength.
本発明者らは、チップの樹種、チップの形状、接着剤の種類という観点から検討することによって、吸水性が低く、吸水による厚さ膨張率が小さく、かつ吸湿による線膨張率が小さく（寸法安定性が良く）、水分を吸収しても強度低下が少ないパーティクルボードを得ることができるという知見を得て本発明を完成するに至ったものである。 The present inventors have studied from the viewpoints of chip tree type, chip shape, and adhesive type, so that the water absorption is low, the thickness expansion coefficient due to water absorption is small, and the linear expansion coefficient due to moisture absorption is small (dimensions). The present invention has been completed with the knowledge that a particle board having good stability) and having a reduced strength even when moisture is absorbed can be obtained.
すなわち、本発明は、
（１）主たるチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップに、イソシアネート系接着剤を添加し熱圧成形したことを特徴とするパーティクルボードであり、
（２）イソシアネート系接着剤が、ポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）であることを特徴とする（１）に記載のパーティクルボードであり、
（３）製造されたボードが単層であることを特徴とする（１）または（２）に記載のパーティクルボードであり、
（４）製造されたボードが多層であり、少なくとも表層が、主たるチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップに、イソシアネート系接着剤を添加し熱圧成形したことを特徴とするパーティクルボードであり、
（５）イソシアネート系接着剤が、ポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）であることを特徴とする（４）に記載のパーティクルボードであり、
（６）上記（１）〜（５）のいずれかに記載のパーティクルボードを用いたことを特徴とする構造用部材を要旨とする。
That is, the present invention
(1) The main chip shape is 0.05-0.3 mm in thickness, 1-5 mm in width, and 10-50 mm in length. A particle board,
(2) The particle board according to (1), wherein the isocyanate-based adhesive is polymethylene polyphenyl polyisocyanate (PMDI),
(3) The particle board according to (1) or (2), wherein the manufactured board is a single layer,
(4) Isocyanate-based adhesion to bamboo chips with a multi-layered board and at least the surface layer of which the main chip shape is 0.05 to 0.3 mm in thickness, 1 to 5 mm in width, and 10 to 50 mm in length It is a particle board characterized by adding an agent and hot pressing.
(5) The particle board according to (4), wherein the isocyanate-based adhesive is polymethylene polyphenyl polyisocyanate (PMDI),
(6) A gist of a structural member using the particle board according to any one of (1) to (5) above.
請求項１に記載の発明によれば、本発明のパーティクルボードは、厚さが薄く且つ繊維方向の長さが比較的長い竹チップを使用することで、竹チップ間の空隙が少なく、非常に緻密で（密度も高く）、水分がボード内部に浸透しにくくなるとともに厚さ方向及び面方向の膨張が抑制される。しかも、竹チップの親水基がイソシアネート系接着剤のイソシアネート基と反応して疎水化されているので水分を吸着しにくい。このため、吸水率が低く、吸水による厚さ膨張率が低く、かつ吸湿による線膨張率が低く（寸法安定性が良く）、強度低下も小さいという効果を奏する。
また、請求項２に記載された発明によれば、イソシアネート系接着剤の中でもＰＭＤＩを接着剤として使用しているので吸水性を低く抑えることができ、しかも、製造コストを低減できる。
さらに、請求項３に記載された発明によれば、簡易な設備・工程でパーティクルボードが製造できる。
また、請求項４に記載された発明によれば、表層にチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップを使用し、内層を粗とする多層構成にすることで、全体の密度を低くしても曲げ強さを大きくすることができると共に、表面二次加工（例えば、研磨処理など）により表面を容易に平滑にすることができる。
そして、本発明のパーティクルボードは、廃木材チップからなるパーティクルボードと比較して、強度残存率（（「湿潤時曲げ強さ」÷「常態時曲げ強さ」）×１００）が高く、更に、厚さ膨張率が６．０％未満且つ線膨張率が０．３％未満と、厚さ方向及び面方向の両方の寸法安定性に優れていることから、ボードを大型に成形した構造部材としても用いることができるという効果を奏する。
According to the invention described in claim 1, the particle board of the present invention uses bamboo chips that are thin and relatively long in the fiber direction, so that there are few voids between bamboo chips, It is dense (high density), and moisture hardly penetrates into the board, and expansion in the thickness direction and the surface direction is suppressed. In addition, the hydrophilic group of the bamboo chip reacts with the isocyanate group of the isocyanate-based adhesive to be hydrophobized, so that it is difficult to adsorb moisture. For this reason, the water absorption rate is low, the thickness expansion rate due to water absorption is low, the linear expansion rate due to moisture absorption is low (good dimensional stability), and the strength reduction is small.
Further, according to the invention described in claim 2, since PMDI is used as an adhesive among the isocyanate adhesives, the water absorption can be kept low, and the manufacturing cost can be reduced.
Furthermore, according to the invention described in claim 3, the particle board can be manufactured with a simple equipment and process.
According to the invention described in claim 4, bamboo chips having a chip shape of 0.05 to 0.3 mm in thickness, 1 to 5 mm in width, and 10 to 50 mm in length are used on the surface layer, and the inner layer is By using a rough multilayer structure, the bending strength can be increased even if the overall density is lowered, and the surface can be easily smoothed by secondary surface processing (for example, polishing). it can.
And, the particle board of the present invention has a high residual strength rate ((“bending strength when wet” ÷ “bending strength when normal”) × 100) compared to the particle board made of waste wood chips, As a structural member in which the board is molded in a large size because the thickness expansion coefficient is less than 6.0% and the linear expansion coefficient is less than 0.3%, and the dimensional stability in both the thickness direction and the surface direction is excellent. The effect that can also be used is produced.
以下、本発明のパーティクルボードについて詳細に説明する。 Hereinafter, the particle board of the present invention will be described in detail.
（竹の種類）
本発明において、竹チップの原料となる「竹の種類」としては、イネ科タケ亜科に属するタケ類やササ類の中から選択することができ、例えば、モウソウチク、マダケ、ハチク、メダケ等が例示できる。本発明においては、その中でも安価で入手が容易なマダケやモウソウチクを使用することが好ましい。
(Bamboo type)
In the present invention, the “bamboo type” used as the raw material of the bamboo chip can be selected from bamboos and bamboos belonging to the family Gramineaceae, for example, Mosouchiku, Madake, Hachiku, Medake, etc. It can be illustrated. In the present invention, it is preferable to use mushrooms or moso bamboo that are inexpensive and easily available.
（竹チップの形状）
本発明に係るパーティクルボードにおいては、主たるチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップを用いることを特徴とする。
上記形状の竹チップの製造方法としては、先ず、山林などから伐採した竹の枝を払い得られた幹の部分を５０ｃｍ〜２ｍに切断し、切断した竹をチップ製造装置に投入する。そして、チップ製造装置において、刃渡り１０〜５０ｍｍの切削刃を円筒形の竹に当てた状態で、竹を軸方向に移動させながら竹を円周方向に回転させて、かつらむきのようにして竹の表面を削る。こうすることで、上記形状の短冊状の竹チップを得ることができる。
(Bamboo chip shape)
In the particle board according to the present invention, bamboo chips having a main chip shape of 0.05 to 0.3 mm in thickness, 1 to 5 mm in width, and 10 to 50 mm in length are used.
As a method for manufacturing bamboo chips having the above-described shape, first, a trunk portion from which a bamboo branch cut from a mountain forest or the like is removed is cut into 50 cm to 2 m, and the cut bamboo is put into a chip manufacturing apparatus. Then, in the chip manufacturing apparatus, with the cutting blade having a blade span of 10 to 50 mm applied to the cylindrical bamboo, the bamboo is rotated in the circumferential direction while moving the bamboo in the axial direction, and the bamboo is peeled off like a wig. Sharpen the surface. By carrying out like this, the strip-shaped bamboo chip of the said shape can be obtained.
竹チップの厚さが０．３ｍｍより大きいと、熱圧成形してパーティクルボードにしたときに竹チップ同士の間に空隙が生じやすくなるため吸水率が大きくなり、厚さ方向の寸法安定性が得られないことから好ましくない。一方、竹チップの厚さが０．０５ｍｍより小さいと、チップ化する際に粉々になってしまい、幅１〜５ｍｍ且つ長さ１０〜５０ｍｍの形状に削ることが困難であることから好ましくない。
また、竹チップの幅が５ｍｍより大きいと、竹の表面を削ったことにより湾曲した形状となってしまう。チップが湾曲していると、パーティクルボードにしたときに竹チップ同士の間に空隙が生じやすくなって吸水率が大きくなり、厚さ方向の寸法安定性が得られないことから好ましくない。一方、上記のかつらむきのようにしてチップ化する際、竹チップの幅を１ｍｍより小さくすることは困難である。
更に、チップの長さが１０ｍｍより小さいと、吸湿による線膨張率が大きくなり、寸法安定性が得られず、チップの長さが５０ｍｍより長いと、既存のパーティクルボード製造装置を用いてパーティクルボードを製造する際に、流路の詰り等が生じるおそれがあり好ましくない。
尚、本発明における「主たるチップ」とは、パーティクルボードにおいて上記形状のチップが全体の５０重量％を超える量を占めていることを意味する。このうち、本発明においては、上記形状のチップが全体の６０％以上を占めていることが好ましく、より好ましくは８０％以上、更には９０％以上であることが好ましい。
If the thickness of the bamboo chip is larger than 0.3 mm, a void is likely to be formed between the bamboo chips when hot-pressed into a particle board, resulting in an increase in water absorption, and dimensional stability in the thickness direction. It is not preferable because it cannot be obtained. On the other hand, if the thickness of the bamboo chip is smaller than 0.05 mm, it becomes undesirably broken up into chips and difficult to cut into a shape having a width of 1 to 5 mm and a length of 10 to 50 mm.
Moreover, when the width | variety of a bamboo chip | tip is larger than 5 mm, it will become a curved shape because the surface of the bamboo was shaved. If the chip is curved, voids are easily generated between the bamboo chips when the particle board is formed, and the water absorption rate is increased, and the dimensional stability in the thickness direction cannot be obtained. On the other hand, it is difficult to make the width of the bamboo chip smaller than 1 mm when chipping like the above-described wig.
Furthermore, if the chip length is less than 10 mm, the coefficient of linear expansion due to moisture absorption increases, and dimensional stability cannot be obtained. If the chip length is longer than 50 mm, the particle board using an existing particle board manufacturing apparatus is used. In manufacturing, there is a possibility that clogging of the flow path may occur, which is not preferable.
The “main chip” in the present invention means that the chip having the above shape occupies more than 50% by weight of the particle board. Among these, in the present invention, it is preferable that the chip having the above shape occupies 60% or more of the whole, more preferably 80% or more, and further preferably 90% or more.
また、本発明においては、上記形状の竹チップに、ＪＩＳ Ｚ ８８０１−１（２００６）に規定する目開き１．０ｍｍの金属製網篩を通過し目開き０．３５ｍｍの金属製網篩を通過しない細かい竹チップが５〜２０重量％含まれていることが好ましい。このように、細かい竹チップが全体の５〜２０重量％含まれていることで、主たる竹チップの間にできる空隙を、細かい竹チップで埋めることができ、更に緻密なパーティクルボードを得ることができる。そして、これにより、水分がボード内部に浸透しにくくなるとともに厚さ方向及び面方向の膨張が抑制されたパーティクルボードとすることができる。 In the present invention, the bamboo chip having the above shape passes through a metal mesh screen having a mesh size of 1.0 mm as defined in JIS Z8801-1 (2006), and then passes through a metal mesh screen having a mesh size of 0.35 mm. It is preferable that 5-20% by weight of fine bamboo chips not included is contained. Thus, the fine bamboo chip is contained in 5 to 20% by weight of the whole, so that the gap formed between the main bamboo chips can be filled with the fine bamboo chips, and a finer particle board can be obtained. it can. And it can be set as the particle board by which the water | moisture content became difficult to osmose | permeate the board inside and the expansion | swelling of the thickness direction and the surface direction was suppressed by this.
本発明で竹チップに添加するイソシアネート系接着剤としては、４，４′−ジフェニルメタンジイソシアネート（ＭＤＩ）、トリレンジイソシアネート（ＴＤＩ）、ヘキサメチレンジイソシアネート（ＨＭＤＩ）、キシレンジイソシアネート（ＸＤＩ）、イソホロンジイソシアネート（ＩＰＤＩ）、ポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）、エマルジョンタイプのＰＭＤＩが例示でき、これらを単独あるいは２種以上組み合わせたものが使用できる。その中でも、竹チップとの接着性やパーティクルボードとした後の吸水性及び吸湿性を低くする観点から、ポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）もしくはエマルジョンタイプのＰＭＤＩまたはそれらを組合せたものを接着剤として使用することがさらに好ましい。 The isocyanate adhesive added to bamboo chips in the present invention includes 4,4'-diphenylmethane diisocyanate (MDI), tolylene diisocyanate (TDI), hexamethylene diisocyanate (HMDI), xylene diisocyanate (XDI), isophorone diisocyanate (IPDI). ), Polymethylene polyphenyl polyisocyanate (PMDI), and emulsion type PMDI can be exemplified, and these can be used alone or in combination of two or more. Among them, from the viewpoint of reducing the adhesiveness with bamboo chips and the water absorption and moisture absorption after making the particle board, an adhesive is polymethylene polyphenyl polyisocyanate (PMDI) or emulsion type PMDI or a combination thereof. It is more preferable to use as.
本発明のパーティクルボードの製造方法について説明する。まず、竹チップ１００重量部にイソシアネート系接着剤を８重量部〜１８重量部添加し、混合機で均一に撹拌して竹チップの表面を接着剤で被覆する。次に、この接着剤が被覆された竹チップをマット状にフォーミングし、これを熱圧プレスしてパーティクルボードを得る。イソシアネート系接着剤が被覆された竹チップを熱圧成形するときの条件は、木質チップを熱圧成形してパーティクルボードを製造するときの条件に準じて行うことができ、例えば、加熱温度：１８０〜２２０℃、圧力：１〜１０Ｎ／ｍｍ２、加圧時間：５〜３０ｓｅｃ／ｍｍとすることができる。また、熱圧プレスには多段式または連続式プレス装置のいずれの方式も採用することができる。 The manufacturing method of the particle board of this invention is demonstrated. First, 8 to 18 parts by weight of an isocyanate-based adhesive is added to 100 parts by weight of bamboo chips, and the surface of the bamboo chips is coated with the adhesive by stirring uniformly with a mixer. Next, the bamboo chip coated with the adhesive is formed into a mat shape, and this is hot-pressed to obtain a particle board. The conditions for hot-pressing bamboo chips coated with an isocyanate-based adhesive can be performed in accordance with the conditions for producing a particle board by hot-pressing wood chips. For example, heating temperature: 180 ˜220 ° C., pressure: 1-10 N / mm 2 , pressurization time: 5-30 sec / mm. Moreover, any system of a multistage type or a continuous type press apparatus can be adopted for the hot press.
パーティクルボードの密度は０．７３〜０．９５ｇ／ｃｍ３とすることが適している。パーティクルボードの密度が０．７３ｇ／ｃｍ３以上であることで、十分な耐水性や強度を発現する。また、密度が０．９５ｇ／ｃｍ３以下であることで、釘を打ち付け易い点で取り扱い易く好ましい。 The density of the particle board is suitably 0.73 to 0.95 g / cm 3 . When the density of the particle board is 0.73 g / cm 3 or more, sufficient water resistance and strength are exhibited. Further, it is preferable that the density is 0.95 g / cm 3 or less because it is easy to handle in terms of easy nailing.
上記は単層のパーティクルボードについての説明であるが、本発明のパーティクルボードは、単層に限定するものではなく、多層であっても良い。多層のパーティクルボードの場合、パーティクルボードの少なくとも表層が、主たるチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップとすることで、本発明の効果を奏するものである。多層構成としては、表層／内層／表層の三層構成にすることが好ましく、表層には、主たるチップの形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍである竹チップとし、内層には、竹チップ又は汎用に用いられている木質チップ（例えば、廃木材をチップ化したもの）を利用できる。このように、多層構成にし、表面層に上記の竹チップを使用することで、曲げ強さを大きくすることができると共に、厚さ膨張率を６．０％未満且つ線膨張率を０．３％未満とすることができる。
尚、三層構造の場合、表層：内層：表層の比は、１〜２．５：５：１〜２．５であることが好ましい。
The above is a description of a single-layer particle board, but the particle board of the present invention is not limited to a single layer, and may be a multilayer. In the case of a multilayer particle board, at least the surface layer of the particle board is a bamboo chip whose main chip shape is 0.05 to 0.3 mm in thickness, 1 to 5 mm in width, and 10 to 50 mm in length. The effect of this is achieved. As the multilayer structure, a three-layer structure of surface layer / inner layer / surface layer is preferable, and the surface layer has a main chip shape of thickness 0.05 to 0.3 mm, width 1 to 5 mm, and length 10 to 50 mm. As a certain bamboo chip, a bamboo chip or a general-purpose wood chip (for example, waste wood converted into chips) can be used for the inner layer. Thus, by using a multi-layer structure and using the above bamboo chip as the surface layer, the bending strength can be increased, the thickness expansion coefficient is less than 6.0%, and the linear expansion coefficient is 0.3. %.
In the case of a three-layer structure, the ratio of surface layer: inner layer: surface layer is preferably 1 to 2.5: 5: 1 to 2.5.
以下に、本発明のパーティクルボードを実施例により具体的に説明するが、本発明はこれらの実施例により限定されるものではない。なお、製造されたパーティクルボードの物性は以下の方法により測定した。 The particle board of the present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. In addition, the physical property of the manufactured particle board was measured with the following method.
（１）密度：
ＪＩＳ Ａ ５９０８（２００３）の６．３により測定し、算出した。
(1) Density:
Measured and calculated according to 6.3 of JIS A 5908 (2003).
（２）常態曲げ強さ（Ａ）：
ＪＩＳ Ａ ５９０８（２００３）の６．５により測定し、算出した。
(2) Normal bending strength (A):
It was measured and calculated according to 6.5 of JIS A 5908 (2003).
（３）湿潤時曲げ強さ（Ｂ）：
ＪＩＳ Ａ ５９０８（２００３）の６．６ｂ）により測定し、算出した。
(3) Bending strength when wet (B):
Measured and calculated according to JIS A 5908 (2003), 6.6b).
（４）残存率（％）：
残存率（％）＝（湿潤時曲げ強さ（Ｂ）÷常態曲げ強さ（Ａ））×１００
(4) Residual rate (%):
Residual rate (%) = (wet bending strength (B) / normal bending strength (A)) × 100
（５）吸水率（％）：
２０℃６５％ＲＨ下で７日間養生した、長さ５ｃｍ×幅５ｃｍ×厚さ９ｍｍの試料の重量を測定し、その試料を２０℃の水に２４時間浸漬した後に重量を再び測定し、重量の変化量から吸水率を算出した。
(5) Water absorption rate (%):
The weight of a sample having a length of 5 cm, a width of 5 cm and a thickness of 9 mm, which was cured at 20 ° C. and 65% RH for 7 days, was measured, and the sample was immersed in water at 20 ° C. for 24 hours. The water absorption was calculated from the amount of change.
（６）吸水厚さ膨張率：
ＪＩＳ Ａ ５９０８（２００３）の６．７により測定し、算出した。
(6) Water absorption thickness expansion coefficient:
Measured and calculated according to 6.7 of JIS A 5908 (2003).
（７）剥離強度：
ＪＩＳ Ａ ５９０８（２００３）の６．８により測定し、算出した。
(7) Peel strength:
Measured and calculated according to 6.8 of JIS A 5908 (2003).
（８）吸湿率及び吸湿線膨張率
２０℃６５％RH下で７日間養生した、長さ３０ｃｍ×幅５ｃｍ×厚さ９ｍｍの試料の重量及び長さを測定し、その試料を４０℃、９０％ＲＨの恒温恒湿室に１週間放置した後に重量及び長さを再び測定し、重量の変化量から吸湿率を、長さの変化量から吸湿線膨張率を算出した。
(8) Moisture absorption rate and moisture absorption linear expansion rate The weight and length of a sample 30 cm long × 5 cm wide × 9 mm thick, which was cured for 7 days at 20 ° C. and 65% RH, were measured. After being left in a constant temperature and humidity room of% RH for one week, the weight and length were measured again, and the moisture absorption rate was calculated from the change in weight, and the moisture absorption linear expansion coefficient was calculated from the change in length.
［実施例１］
竹チップの原料としてモウソウチクを使用し、チップ製造装置で作製した、主たる形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍの竹チップ（全乾総重量３ｋｇ、１００重量部）を混合機に投入した。次いで、その混合機にイソシアネート系接着剤としてポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）、（日本ポリウレタン工業（株）製、商品名：ＭＲ１００）１０重量部を添加し、竹チップと混合、撹拌して竹チップの表面を接着剤で覆った。このものをフォーミングしてマットとした後、熱圧プレス装置で熱圧成形（熱板温度：２００℃、加圧力：４Ｎ／ｍｍ２、加圧時間：９０ｓｅｃ）して設定密度０．７５ｇ／ｃｍ３、長さ３２ｃｍ×幅３２ｃｍ×厚さ９ｍｍの単層のパーティクルボードを製造した。
[Example 1]
Bamboo chips with a main shape of 0.05 to 0.3 mm, a width of 1 to 5 mm, and a length of 10 to 50 mm, produced with a chip manufacturing apparatus, using Moso bamboo as a raw material for bamboo chips (total dry weight 3 kg, 100 parts by weight) was charged into the mixer. Next, 10 parts by weight of polymethylene polyphenyl polyisocyanate (PMDI) (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: MR100) is added as an isocyanate-based adhesive to the mixer, mixed with bamboo chips, and stirred. The surface of the bamboo chip was covered with an adhesive. After forming this into a mat, it is hot pressed with a hot press machine (hot plate temperature: 200 ° C., pressing force: 4 N / mm 2 , pressing time: 90 sec), and a set density of 0.75 g / cm. 3. A single-layer particle board having a length of 32 cm, a width of 32 cm, and a thickness of 9 mm was produced.
［比較例１］
イソシアネート系接着剤を尿素樹脂に変更したことを除き、それ以外は実施例１と同様にして単層のパーティクルボードを製造した。
[Comparative Example 1]
A single-layer particle board was produced in the same manner as in Example 1 except that the isocyanate adhesive was changed to urea resin.
［比較例２］
使用する竹チップを、主たるチップの粒度が目開き１．０ｍｍの篩を通過し目開き０．３５ｍｍの篩を通過しなかったものに変更したことを除き、それ以外は実施例１と同様にして単層のパーティクルボードを製造した。
[Comparative Example 2]
Except that the bamboo chip used was changed to one whose main chip particle size passed through a sieve with an aperture of 1.0 mm and did not pass through a sieve with an aperture of 0.35 mm, the others were the same as in Example 1. A single-layer particle board was manufactured.
［比較例３］
竹チップを、主たるチップの粒度が目開き１．０ｍｍの篩を通過し目開き０．３５ｍｍの篩を通過しなかった廃木材チップ（建築解体現場等から発生する廃木材をチップ化したもの）に変更したことを除き、それ以外は実施例１と同様にして単層のパーティクルボードを製造した。
[Comparative Example 3]
Waste wood chips with bamboo chips that passed through a sieve with a primary chip particle size of 1.0 mm and did not pass through a sieve with an opening of 0.35 mm (chips made of waste wood generated from building demolition sites, etc.) A single-layer particle board was produced in the same manner as in Example 1 except that the above was changed.
［実施例２］
（表層用のチップ）
実施例１で使用した竹チップ１００重量部を準備し、これに実施例１で使用したイソシアネート系接着剤（ＰＭＤＩ）１０重量部を添加して表層用の竹チップを調製した。
（内層用のチップ）
主たるチップの粒度が目開き２．８ｍｍの篩を通過し目開き１ｍｍの篩を通過しなかった廃木材チップ１００重量部を準備し、これに実施例１で使用したイソシアネート系接着剤（ＰＭＤＩ）８重量部を添加して内層用の廃木材チップを調製した。
上記表層用の竹チップ及び内層用の廃木材チップを表層／内層／表層（重量比１：３：１）とし、実施例１と同じ製造条件で設定密度０．８０ｇ／ｃｍ３、長さ３２ｃｍ×幅３２ｃｍ×厚さ９ｍｍの三層のパーティクルボードを製造した。
[Example 2]
(Chip for surface layer)
100 parts by weight of bamboo chips used in Example 1 were prepared, and 10 parts by weight of the isocyanate adhesive (PMDI) used in Example 1 was added thereto to prepare bamboo chips for the surface layer.
(Chip for inner layer)
The isocyanate chip adhesive (PMDI) used in Example 1 was prepared by preparing 100 parts by weight of waste wood chips whose main particle size passed through a sieve with an opening of 2.8 mm and did not pass through a sieve with an opening of 1 mm. 8 parts by weight was added to prepare waste wood chips for the inner layer.
The above-mentioned bamboo chip for the surface layer and the waste wood chip for the inner layer are surface layer / inner layer / surface layer (weight ratio 1: 3: 1), and the set density is 0.80 g / cm 3 and length is 32 cm under the same manufacturing conditions as in Example 1. A three-layer particle board having a width of 32 cm and a thickness of 9 mm was produced.
［実施例３］ 表層用イソシアネート系接着剤（ＰＭＤＩ）の添加量を１８重量部に変更したことを除き、それ以外は実施例２と同様にして三層のパーティクルボードを製造した。 Example 3 A three-layer particle board was produced in the same manner as in Example 2 except that the addition amount of the isocyanate adhesive for surface layer (PMDI) was changed to 18 parts by weight.
［比較例４］
（表層用のチップ）
チップの原料としてスギを使用し、チップ製造装置で作製した、主たる形状が厚さ０．０５〜０．３ｍｍ、幅１〜５ｍｍ、長さ１０〜５０ｍｍのスギチップ（全乾総重量３ｋｇ、１００重量部）を混合機に投入した。次いで、その混合機にイソシアネート系接着剤としてポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）、（日本ポリウレタン工業（株）製、商品名：ＭＲ１００）１０重量部を添加し、表層用スギチップを調製した。
（内層用のチップ）
実施例２と同様にして内層用廃木材チップを調製した。
上記表層用のスギチップ及び内層用の廃木材チップを表層／内層／表層（重量比１：３：１）とし、実施例２と同じ製造条件で長さ３２ｃｍ×幅３２ｃｍ×厚さ９ｍｍの三層のパーティクルボードを製造した。
[Comparative Example 4]
(Chip for surface layer)
A cedar chip having a main shape of 0.05 to 0.3 mm, a width of 1 to 5 mm, and a length of 10 to 50 mm, which is produced by a chip manufacturing apparatus, using cedar as a raw material for chips (total dry weight 3 kg, 100 weight) Part) was charged into the mixer. Next, 10 parts by weight of polymethylene polyphenyl polyisocyanate (PMDI) (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: MR100) as an isocyanate-based adhesive was added to the mixer to prepare a cedar chip for the surface layer.
(Chip for inner layer)
Waste wood chips for inner layers were prepared in the same manner as in Example 2.
The above-mentioned cedar chips for the surface layer and the waste wood chips for the inner layer are made into surface layer / inner layer / surface layer (weight ratio 1: 3: 1), and three layers of length 32 cm × width 32 cm × thickness 9 mm under the same production conditions as in Example 2. Manufactured particle board.
［比較例５］
（表層用のチップ）
主たるチップの粒度が目開き１．０ｍｍの篩を通過し目開き０．３５ｍｍの篩を通過しなかった廃木材チップ（全乾総重量３ｋｇ、１００重量部）を混合機に投入した。次いで、その混合機にイソシアネート系接着剤としてポリメチレンポリフェニルポリイソシアネート（ＰＭＤＩ）、（日本ポリウレタン工業（株）製、商品名：ＭＲ１００）１０重量部を添加し、表層用廃木材チップを調製した。
（内層用のチップ）
実施例２と同様にして内層用廃木材チップを調製した。
上記表層用の廃木材チップ及び内層用の廃木材チップを表層／内層／表層（重量比１：３：１）とし、実施例２と同じ製造条件で長さ３２ｃｍ×幅３２ｃｍ×厚さ９ｍｍの三層のパーティクルボードを製造した。
[Comparative Example 5]
(Chip for surface layer)
Waste wood chips (total dry weight 3 kg, 100 parts by weight) that passed through a sieve having a main chip particle size of 1.0 mm and did not pass through a sieve having an opening of 0.35 mm were charged into the mixer. Next, 10 parts by weight of polymethylene polyphenyl polyisocyanate (PMDI) (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name: MR100) as an isocyanate adhesive was added to the mixer to prepare a waste wood chip for the surface layer. .
(Chip for inner layer)
Waste wood chips for inner layers were prepared in the same manner as in Example 2.
The waste wood chips for the surface layer and the waste wood chips for the inner layer are made into surface layer / inner layer / surface layer (weight ratio 1: 3: 1), and the length is 32 cm × width 32 cm × thickness 9 mm under the same production conditions as in Example 2. A three-layer particle board was manufactured.
［比較例６］
表層用イソシアネート系接着剤（ＰＭＤＩ）の添加量を１８重量部に変更したことを除き、比較例４と同様にして三層のパーティクルボードを製造した。
[Comparative Example 6]
A three-layer particle board was produced in the same manner as in Comparative Example 4 except that the amount of the surface layer isocyanate adhesive (PMDI) was changed to 18 parts by weight.
実施例１〜３、比較例１〜６で製造したパーティクルボードについて各々の物性を表１に示す。 Table 1 shows the physical properties of the particle boards manufactured in Examples 1 to 3 and Comparative Examples 1 to 6.
表１から明らかなように、形状をコントロールした竹チップにイソシアネート系接着剤を添加して製造した単層パーティクルボード（実施例１）は、竹チップに尿素樹脂接着剤を用いて製造した単層パーティクルボード（比較例１）に比べ、常態曲げ強さ及び湿潤曲げ強さが大きく、吸水率は低く、吸水厚さ膨張率も小さく、かつ吸湿線膨張率も小さい（寸法安定性が良い）ことがわかる。また、実施例１の単層パーティクルボードは、主たるチップの粒度が目開き１．０ｍｍの篩を通過し目開き０．３５ｍｍの篩を通過しなかった竹チップを用いて製造した単層パーティクルボード（比較例２）に比べて、吸湿線膨張が小さい（寸法安定性が良い）ことがわかる。さらに、実施例１の単層パーティクルボードは、廃木材チップにイソシアネート系接着剤を添加して製造したほぼ同じ密度の単層パーティクルボード（比較例３）に比べても、吸水率、吸水厚さ膨張率、吸湿線膨張率（寸法安定性）のいずれも格段に優れていることが分かる。 As is apparent from Table 1, a single-layer particle board (Example 1) manufactured by adding an isocyanate-based adhesive to a bamboo chip with a controlled shape is a single-layer manufactured using a urea resin adhesive on the bamboo chip. Compared to particle board (Comparative Example 1), normal bending strength and wet bending strength are large, water absorption is low, water absorption thickness expansion coefficient is small, and moisture absorption linear expansion coefficient is also small (dimensional stability is good). I understand. In addition, the single-layer particle board of Example 1 is a single-layer particle board manufactured using bamboo chips in which the particle size of the main chip passes through a sieve having an opening of 1.0 mm and does not pass through a sieve having an opening of 0.35 mm. It can be seen that the hygroscopic linear expansion is small (the dimensional stability is good) as compared to (Comparative Example 2). Furthermore, the single-layer particle board of Example 1 has a water absorption rate and a water absorption thickness as compared with a single-layer particle board (Comparative Example 3) having substantially the same density produced by adding an isocyanate adhesive to waste wood chips. It can be seen that both the expansion coefficient and the hygroscopic expansion coefficient (dimensional stability) are remarkably excellent.
また、実施例２及び実施例３の三層パーティクルボードは、表層にほぼ同じ形状のスギチップを使用して製造した三層パーティクルボード（比較例４）に比べ、常態曲げ強さ及び湿潤曲げ強さが大きく、吸水率は低く、吸水厚さ膨張率も小さい（寸法安定性が良い）ことがわかる。さらに、実施例２及び実施例３の三層パーティクルボードは、廃木材チップを使用して製造したほぼ同じ密度の三層パーティクルボード（比較例５、比較例６）に比べても、常態曲げ強さ及び湿潤曲げ強さが大きく、残存率（（湿潤時曲げ強さ／常態曲げ強さ）×１００）についても６０％を超える値を示しており、耐水性が良い（特に、吸湿線膨張率が小さく（寸法安定性が良く）、しかも、水分を吸収しても強度の低下が少ない）ことがわかる。 Moreover, the three-layer particle board of Example 2 and Example 3 is normal bending strength and wet bending strength compared with the three-layer particle board (Comparative Example 4) manufactured using a cedar chip having substantially the same shape as the surface layer. Is large, the water absorption is low, and the water absorption thickness expansion coefficient is small (good dimensional stability). Furthermore, the three-layer particle board of Example 2 and Example 3 has normal bending strength compared to the three-layer particle board (Comparative Example 5 and Comparative Example 6) having almost the same density manufactured using waste wood chips. And the wet bending strength is large, and the residual ratio ((wet bending strength / normal bending strength) × 100) is also more than 60%, and the water resistance is good (particularly, the hygroscopic linear expansion coefficient). (Small dimensional stability is good), and the decrease in strength is small even when moisture is absorbed).
本発明に係るパーティクルボードは、建築用材料、住設部材、家具等の用途に好適に利用できる。また、本発明に係るパーティクルボードは、吸水性が低く、厚さ膨張率が低くかつ線膨張率が低く（寸法安定性が良く）、水分や湿気を吸収しても強度の低下が少ないので、屋根下地や床用下地及び壁面等に用いられる構造用部材、床材、収納庫（クローゼット）用部材として好適に使用できる。 The particle board which concerns on this invention can be utilized suitably for uses, such as a building material, a dwelling member, and furniture. In addition, the particle board according to the present invention has a low water absorption, a low thickness expansion coefficient and a low linear expansion coefficient (good dimensional stability), and since there is little decrease in strength even when moisture and moisture are absorbed, It can be suitably used as a structural member, flooring, or storage (closet) member used for a roof base, a floor base, a wall surface, or the like.
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