JP2014069368A - Woody board, and woody decorative board - Google Patents

Woody board, and woody decorative board Download PDF

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JP2014069368A
JP2014069368A JP2012215422A JP2012215422A JP2014069368A JP 2014069368 A JP2014069368 A JP 2014069368A JP 2012215422 A JP2012215422 A JP 2012215422A JP 2012215422 A JP2012215422 A JP 2012215422A JP 2014069368 A JP2014069368 A JP 2014069368A
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board
wood
wooden
density
weight
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Koichi Murakami
幸一 村上
Tomoyoshi Murakami
知由 村上
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Okura Industrial Co Ltd
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Okura Industrial Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a woody board on the surface of which an uneven portion is not formed when used even when water is infiltrated into the inside thereof from the cross section and which can keep excellent exterior appearance and to provide a woody decorative board.SOLUTION: A woody board 13 is formed by using a woody material and a thermosetting resin, has a decorative sheet 11 to be stuck to at least one surface thereof, and includes a high density part 131a which is formed from the surface thereof toward the inside to the thickness direction and has 1.0 g/cmor higher density.

Description

本発明は、木質材及び熱硬化性樹脂で形成された木質ボード及びこの表面に化粧シートが貼着された木質化粧板に関する。   The present invention relates to a wooden board formed of a wooden material and a thermosetting resin, and a wooden decorative board having a decorative sheet attached to the surface thereof.

従来、パーティクルボードや中密度繊維板等の木質ボードの表面に、化粧シートが接着剤によって貼着された木質化粧板が知られており、家具・建築部材として広く使用されている。木質ボードは木質チップや木質繊維等の木質材によって形成されることから、吸水性が高い。このため、接着剤に水分の多いものを使用しただけで、木質チップや木質繊維等がこれを吸水して膨張し、木質化粧板表面に木質チップや木質繊維等の形をした凹凸が発生して、外観不良を起こすおそれがある。これを防止するため、例えば特許文献1には、木質ボードの表面に低圧メラミン層を熱プレスにより設けて、接着剤を木質ボードに直接作用させないよう、低圧メラミン層を介して化粧シートが貼着された木質化粧板が開示されている。   Conventionally, a wooden decorative board in which a decorative sheet is attached to the surface of a wooden board such as a particle board or a medium density fiber board with an adhesive is known, and is widely used as a furniture / building member. Since the wooden board is made of a wooden material such as a wooden chip or a wooden fiber, it has high water absorption. For this reason, just by using an adhesive with a lot of moisture, the wood chips and wood fibers absorb water and expand, and the wood decorative board surface has irregularities shaped like wood chips and wood fibers. May cause poor appearance. In order to prevent this, for example, in Patent Document 1, a low-pressure melamine layer is provided on the surface of a wooden board by hot pressing, and a decorative sheet is attached via the low-pressure melamine layer so that the adhesive does not directly act on the wooden board. An improved wood veneer is disclosed.

特開2006−272673号公報JP 2006-272673 A

ところが、特許文献1に開示される木質化粧板を、例えば複数枚準備して床板に用いた場合、界面活性剤が含まれたワックス等の薬剤を使用すると、表面からの吸水は化粧シートによって防止されるものの、薬剤が木質化粧板同士の継ぎ目から入り込み、界面活性剤の影響で、薬剤の水分が木質ボードの断面から内部へ著しく浸み込む。内部に浸み込んだ水分は木質ボードの表面まで到達し、その結果、表面付近にある木質チップや木質繊維等が吸水して凹凸を発生させるおそれがあった。   However, when a plurality of wooden decorative boards disclosed in Patent Document 1 are used for floor boards, for example, when a chemical such as wax containing a surfactant is used, water absorption from the surface is prevented by the decorative sheet. However, the drug enters from the joint between the wooden decorative boards, and the moisture of the drug soaks into the inside from the cross section of the wooden board due to the influence of the surfactant. Moisture that soaked inside reaches the surface of the wooden board, and as a result, there is a possibility that the wooden chips and the wooden fibers near the surface absorb water and generate irregularities.

そこで、本発明は、使用時において断面から内部に水分が浸み込んでも表面には凹凸が発生せず、外観を良好に維持することができる木質ボード及び木質化粧板の提供を目的とする。   Therefore, the present invention has an object to provide a wooden board and a wooden decorative board that can maintain good appearance without causing irregularities on the surface even when moisture penetrates into the inside from a cross section during use.

本発明に係る木質ボードは、木質材及び熱硬化性樹脂で形成され、少なくとも一方の表面に化粧シートが貼着される木質ボードであって、前記表面から厚さ方向の内側に向かって、密度が1.0g/cm以上である高密度部を含む。 The wood board according to the present invention is a wood board formed of a wood material and a thermosetting resin, and a decorative sheet is attached to at least one surface, and the density is increased from the surface toward the inside in the thickness direction. Includes a high-density portion having a density of 1.0 g / cm 3 or more.

このような構成によれば、高密度部の密度が1.0g/cm以上に設定されているため、水分が、断面における高密度部以外の部分から内部に浸み込んでも、表面まで到達するのは抑制されて、表面付近にある木質チップや木質繊維等の吸水を防止することができる。 According to such a configuration, since the density of the high density portion is set to 1.0 g / cm 3 or more, even if moisture penetrates into the inside from a portion other than the high density portion in the cross section, it reaches the surface. This is suppressed and water absorption of wood chips and wood fibers near the surface can be prevented.

また、本発明に係る木質ボードでは、厚さが薄く、水分が表面まで到達しやすい9mm以下のものであっても、水分の表面までの到達を抑制することができる。   Moreover, in the wooden board which concerns on this invention, even if it is 9 mm or less in which thickness is thin and a water | moisture content tends to reach | attain the surface, the arrival to the surface of a water | moisture content can be suppressed.

また、本発明に係る木質ボードでは、高密度部の厚さを0.5mm以上1.2mm以下にすることによって、水分の表面までの到達を十分に抑制しつつ、木質ボードを軽量化することができる。   In addition, in the wood board according to the present invention, by reducing the thickness of the high density portion to 0.5 mm or more and 1.2 mm or less, the weight of the wood board can be reduced while sufficiently suppressing the arrival of moisture. Can do.

さらに、本発明に係る木質ボードでは、前記高密度部の木質材を、目開き1.00mmの篩を通過する木質チップを95wt%以上有し、かつ目開き0.50mmの篩を通過する木質チップを50wt%以上有するように構成することができる。この構成によれば、木質ボードの表面を平滑にして、外観を良好にすることができる。   Furthermore, in the wood board according to the present invention, the wood material having the high-density portion has 95% by weight or more of wood chips that pass through a sieve having an opening of 1.00 mm and passes through a sieve having an opening of 0.50 mm. The chip can be configured to have 50 wt% or more. According to this configuration, the surface of the wooden board can be smoothed to improve the appearance.

また、前記高密度部の熱硬化性樹脂を、前記木質材100重量部に対して10重量部以上25重量部以下添加してもよい。この構成によれば、水分の表面までの到達を十分に抑制しつつ、木質ボードの加工性を良好にすることができる。   Moreover, you may add 10 to 25 weight part of the thermosetting resin of the said high-density part with respect to 100 weight part of said wood materials. According to this configuration, it is possible to improve the workability of the wooden board while sufficiently suppressing the moisture from reaching the surface.

本発明に係る木質ボードによれば、使用時において断面から内部に水分が浸み込んでも表面には凹凸が発生せず、外観を良好に維持することができる。   According to the wood board according to the present invention, even when moisture penetrates into the inside from the cross section during use, the surface is not uneven, and the appearance can be maintained satisfactorily.

また、本発明に係る木質ボードによれば、外観を良好に維持する木質化粧板を提供することができる。   Moreover, according to the wooden board which concerns on this invention, the wooden decorative board which maintains an external appearance favorable can be provided.

本発明の一実施形態に係る木質化粧板の断面図である。It is sectional drawing of the wooden decorative board which concerns on one Embodiment of this invention.

以下、本発明の一実施形態に係る木質化粧板について、図面を参照しながら説明する。図1は、本発明の一実施形態に係る木質化粧板の断面図である。図1に示すように、木質化粧板1は、化粧シート11、15と、接着剤12、14と、接着剤12、14で両面に化粧シート11、15が貼着されたパーティクルボード13によって構成される。   Hereinafter, a wood decorative board according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of a wooden decorative board according to an embodiment of the present invention. As shown in FIG. 1, the wooden decorative board 1 is composed of decorative sheets 11 and 15, adhesives 12 and 14, and particle boards 13 in which the decorative sheets 11 and 15 are attached to both surfaces with adhesives 12 and 14. Is done.

化粧シート11、15としては公知のものが使用され、例えば紙、チタン紙等の薄紙、含浸処理紙、ポリオレフィンシートや塩化ビニルシートのような合成樹脂シート、ウレタンコート紙等のプレコート紙等が挙げられ、木質化粧板1の用途に応じて適宜選択され得る。また、化粧シート11、15の厚さについても、強度等に応じて適時選択され得る。   As the decorative sheets 11 and 15, known ones are used, and examples include thin paper such as paper and titanium paper, impregnated paper, synthetic resin sheets such as polyolefin sheets and vinyl chloride sheets, and precoated paper such as urethane-coated paper. And can be appropriately selected according to the use of the wooden decorative board 1. Further, the thickness of the decorative sheets 11 and 15 can be selected as appropriate according to the strength and the like.

接着剤12、14としては公知のものが使用され、水溶性接着剤又は水性エマルジョン接着剤のような水性接着剤、溶剤タイプの接着剤等いずれであってもよく、化粧シート11、15、パーティクルボード13によって適宜選択され得る。また、塗布量についてもそれらの種類や接着性の観点から適宜選択され得る。   As the adhesives 12 and 14, known ones are used, which may be water-based adhesives such as water-soluble adhesives or aqueous emulsion adhesives, solvent-type adhesives, etc., and decorative sheets 11 and 15, particles The board 13 can be selected as appropriate. Also, the coating amount can be appropriately selected from the viewpoint of the type and adhesion.

パーティクルボード13は、図1に示すように表層131、133、内層132の3層から構成される。そして、表層131、133には、表面から厚さ方向の内側に向かって高密度部131a、133aが含まれており、高密度部131a、133aの密度は、1.0g/cm以上に設定される。これにより、パーティクルボード13の断面において、高密度部131a、133a以外の部分から内側に向かって水分が浸み込んだとしても、その水分は表面まで到達せず、表面付近にある木質チップの吸水を防止することができる。その結果、外観を良好に維持することができる。高密度部131a、133aの厚さは、水分の到達の防止及び重量の観点から、例えば0.5mm以上、1.2mm以下が好ましい。また、パーティクルボード13の厚さは、強度及び重量の観点から、例えば3mm以上、9mm以下が好ましい。 As shown in FIG. 1, the particle board 13 includes three layers of surface layers 131 and 133 and an inner layer 132. The surface layers 131 and 133 include high-density portions 131a and 133a from the surface toward the inside in the thickness direction, and the density of the high-density portions 131a and 133a is set to 1.0 g / cm 3 or more. Is done. Thereby, even if moisture infiltrates inward from the portions other than the high density portions 131a and 133a in the cross section of the particle board 13, the moisture does not reach the surface, and the water absorption of the wood chip near the surface Can be prevented. As a result, it is possible to maintain a good appearance. The thickness of the high density portions 131a and 133a is preferably, for example, 0.5 mm or more and 1.2 mm or less from the viewpoint of preventing moisture from reaching and weight. Further, the thickness of the particle board 13 is preferably, for example, 3 mm or more and 9 mm or less from the viewpoint of strength and weight.

次に、パーティクルボード13を構成する材料について説明する。パーティクルボード13は主に、木質チップが集まった木質材、熱硬化性樹脂、添加剤、水から構成される。   Next, the material which comprises the particle board 13 is demonstrated. The particle board 13 is mainly composed of a wood material in which wood chips are gathered, a thermosetting resin, an additive, and water.

木質材としては、表層131、133に、例えば目開き1.00mmの篩を通過する木質チップを95wt%以上含み、かつ目開き0.50mmの篩を通過する木質チップを50wt%以上含むものが使用される。表層131、133に細かい木質チップを用いることにより、高密度部131a、133aを容易に形成することができ、またパーティクルボード13表面の平滑性を良好にすることができる。内層132には、例えば目開き2.80mmの篩を通過するが、目開き0.50mmの篩を通過しないものを90wt%以上含む木質チップが使用される。   As the wood material, the surface layers 131 and 133 include, for example, 95 wt% or more of wood chips that pass through a sieve having an aperture of 1.00 mm and 50 wt% or more of wood chips that pass through a sieve having an aperture of 0.50 mm. used. By using fine wood chips for the surface layers 131 and 133, the high density portions 131a and 133a can be easily formed, and the smoothness of the surface of the particle board 13 can be improved. For the inner layer 132, for example, a wood chip containing 90 wt% or more of a material that passes through a sieve having an aperture of 2.80 mm but does not pass through a sieve having an aperture of 0.50 mm is used.

木質チップとしては、例えばスギ、ヒノキ、スプルース、ファー、ラジアータパイン等の針葉樹や、シラカバ、アピトン、カメレレ、センゴン、ラウト、アスペン等の広葉樹の植物材料が挙げられる。そして、木質チップの材料としては、例えばこれらの樹種の丸太、間伐材等の生材料、工場や住宅建築現場で発生する端材、部材輸送後に廃棄される廃パレット材、建築解体時に発生する解体廃材等が使用される。   Examples of the wood chips include plant materials of conifers such as cedar, cypress, spruce, fur and radiatapine, and broad-leaved trees such as birch, apito, chamelere, sengon, laut and aspen. And as the material of wood chips, for example, logs of these tree species, raw materials such as thinned wood, scraps generated at factories and residential construction sites, waste pallet materials discarded after transportation of members, demolition generated at the time of building demolition Waste materials are used.

熱硬化性樹脂としては、イソシアネート系、フェノール系、ユリヤ系、メラミン系等のものが挙げられ、好ましくはイソシアネート系樹脂が使用される。イソシアネート系樹脂としては、4,4′−ジフェニルメタンジイソシアネート(MDI)、トリレンジイソシアネート(TDI)、ヘキサメチレンジイソシアネート(HMDI)、キシレンジイソシアネート(XDI)、イソホロンジイソシアネート(IPDI)、ポリメチレンポリフェニルポリイソシアネート(PMDI)、エマルジョンタイプのPMDIが挙げられ、これらを単独あるいは2種以上組み合わせたものが使用される。熱硬化性樹脂は、表層131、133では、木質ボードの加工性及び水分の表面到達性の観点から、木質材100重量部に対して、例えば10重量部以上25重量部以下添加され、好ましくは15重量部以上25重量部以下添加される。内層132では、木質ボードの加工性及び強度の観点から、例えば5重量部以上10重量部以下添加される。   Examples of the thermosetting resin include isocyanate-based, phenol-based, urea-based, and melamine-based resins, and an isocyanate-based resin is preferably used. As isocyanate resins, 4,4'-diphenylmethane diisocyanate (MDI), tolylene diisocyanate (TDI), hexamethylene diisocyanate (HMDI), xylene diisocyanate (XDI), isophorone diisocyanate (IPDI), polymethylene polyphenyl polyisocyanate ( PMDI) and emulsion type PMDI are used, and these are used alone or in combination of two or more. In the surface layers 131 and 133, the thermosetting resin is added in an amount of, for example, 10 parts by weight or more and 25 parts by weight or less with respect to 100 parts by weight of the wood material from the viewpoint of the workability of the wood board and the surface reachability of moisture. 15 parts by weight or more and 25 parts by weight or less are added. In the inner layer 132, for example, 5 parts by weight or more and 10 parts by weight or less are added from the viewpoint of workability and strength of the wooden board.

添加剤としては、例えば耐水剤、粘着付与剤、アルデヒドキャッチャー剤、硬化促進剤、離型剤、撥水剤、乳化剤、乳化安定剤、酸化防止剤、紫外線吸収剤、難燃剤、安定剤、界面活性剤、可塑剤、シランカップリング剤、ポバール、金属触媒、合成ゴムラテックス、アクリル系エマルジョンなどが使用される。   Examples of additives include water-resistant agents, tackifiers, aldehyde catchers, curing accelerators, mold release agents, water repellents, emulsifiers, emulsion stabilizers, antioxidants, ultraviolet absorbers, flame retardants, stabilizers, and interfaces. Activators, plasticizers, silane coupling agents, poval, metal catalysts, synthetic rubber latex, acrylic emulsions and the like are used.

次に、本発明の一実施形態に係る木質化粧板1の製造方法について説明する。まず、上述の木質材に所定の熱硬化性樹脂、添加剤、水を添加してフォーミングし、マットを形成する。これを公知の熱圧プレス装置により熱圧成形して、パーティクルボード13を形成する。   Next, the manufacturing method of the wooden decorative board 1 which concerns on one Embodiment of this invention is demonstrated. First, a predetermined thermosetting resin, an additive, and water are added to the woody material described above to form a mat. This is hot-pressed with a known hot-pressing device to form the particle board 13.

そして、得られたパーティクルボード13の両表面を、公知のサンダーで研磨する。次いで、研磨した両表面に上述の接着剤12,14を公知の方法で塗布して、上述の化粧シート11、15を貼着し、所望の木質化粧板1を得る。   Then, both surfaces of the obtained particle board 13 are polished with a known sander. Next, the above-mentioned adhesives 12 and 14 are applied to both polished surfaces by a known method, and the above-mentioned decorative sheets 11 and 15 are adhered to obtain the desired wooden decorative board 1.

以下に、本発明に係る木質化粧板1を実施例により具体的に説明する。ただし、本発明はこれらの実施例によって限定されるものではない。   Below, the wood decorative board 1 which concerns on this invention is demonstrated concretely by an Example. However, the present invention is not limited to these examples.

[実施例1]
(表層用の木質材)
目開き1.70mmの篩を通過し目開き1.00mmの篩を通過しなかった木質チップを2wt%、目開き1.00mmの篩を通過し目開き0.50mmの篩を通過しなかった木質チップを43wt%、目開き0.50mmの篩を通過した木質チップを55wt%含む木質材100重量部を準備し、これにイソシアネート系樹脂(PMDI)15重量部、耐水剤としてワックスエマルジョンを0.8重量部、さらに、マットの含水率が13%となるように水を添加して、表層用の木質材を調製した。
[Example 1]
(Surface wood)
2% by weight of wood chips that passed through a sieve with an opening of 1.70 mm but did not pass through a sieve with an opening of 1.00 mm, passed through a sieve with an opening of 1.00 mm, and did not pass through a sieve with an opening of 0.50 mm 100 parts by weight of a wood material containing 43% by weight of wood chips and 55% by weight of wood chips that have passed through a sieve having an aperture of 0.50 mm was prepared. .8 parts by weight, and further, water was added so that the moisture content of the mat was 13% to prepare a wood material for the surface layer.

(内層用の木質材)
目開き4.75mmの篩を通過し目開き2.80mmの篩を通過しなかった木質チップを7wt%、目開き2.80mmの篩を通過し目開き0.50mmの篩を通過しなかった木質チップを91wt%、目開き0.50mmの篩を通過した木質チップを2wt%含む木質材100重量部を準備し、これにイソシアネート系接着剤(PMDI)8重量部、耐水剤としてワックスエマルジョンを0.8重量部、さらに、マットの含水率が9%となるように水を添加して、内層用の木質材を調製した。
(Wood material for inner layer)
7% by weight of wood chips that passed through a sieve with an opening of 4.75 mm but did not pass through a sieve with an opening of 2.80 mm, passed through a sieve with an opening of 2.80 mm, and did not pass through a sieve with an opening of 0.50 mm Prepare 100 parts by weight of a wood material containing 91% by weight of wood chips and 2% by weight of wood chips that have passed through a sieve with an aperture of 0.50 mm, 8 parts by weight of an isocyanate adhesive (PMDI), and a wax emulsion as a water resistant agent. Water was added so that the water content of the mat was 0.8% by weight and the mat moisture content was 9% to prepare a wood material for the inner layer.

調製した木質材を表層/内層/表層(重量比1:3:1)とし、フォーミングしてマットとした後、熱圧プレス装置で熱圧成形(熱板温度:200℃、圧力:4N/mm、加圧時間:108sec)して設定密度0.75g/cm、長さ320mm×幅320mm×厚さ9mmのパーティクルボードを作製した The prepared wood material was made into a surface layer / inner layer / surface layer (weight ratio 1: 3: 1), formed into a mat, and then subjected to hot pressing with a hot press machine (hot plate temperature: 200 ° C., pressure: 4 N / mm). 2 and pressurization time: 108 sec), and a particle board having a set density of 0.75 g / cm 3 , length 320 mm × width 320 mm × thickness 9 mm was produced.

作製したパーティクルボードの両表面を研磨して、これらに水性エマルジョン接着剤(コニシ株式会社製、CVC360)をロールコーターで6g/尺2塗布し、ポリオレフィンシート(厚さ160μm)を載せて、常温23℃、圧力1.0N/mm、5分間、圧締し貼着させて、木質化粧板を作製した。 By polishing the both surfaces of the particle board prepared, these water-based emulsion adhesive (Konishi Co., CVC360) 6g / scale 2 was coated with a roll coater, put the polyolefin sheet (thickness 160 .mu.m), room temperature 23 The wood decorative board was produced by pressing and adhering at 5 ° C. and a pressure of 1.0 N / mm 2 for 5 minutes.

[実施例2]
実施例1と同様にして、表層用及び内層用の木質材を調製した。調製した表層用及び内層用の木質材を表層/内層/表層(重量比1:2:1)とし、フォーミングしてマットとした後、熱圧プレス装置で熱圧成形(熱板温度:200℃、圧力:4N/mm、加圧時間:108sec)して設定密度0.80g/cm、長さ320mm×幅320mm×厚さ9mmのパーティクルボードを作製した。これに、実施例1と同様に、両表面にポリオレフィンシートを貼着させて木質化粧板を作製した。
[Example 2]
In the same manner as in Example 1, wood materials for the surface layer and the inner layer were prepared. After preparing the surface layer / inner layer / surface layer (weight ratio 1: 2: 1) and forming the mat for the surface layer and the inner layer woody material, hot pressing with a hot press apparatus (hot plate temperature: 200 ° C.) , Pressure: 4 N / mm 2 , pressurization time: 108 sec), and a particle board with a set density of 0.80 g / cm 3 , length 320 mm × width 320 mm × thickness 9 mm was produced. In the same manner as in Example 1, a polyolefin sheet was adhered to both surfaces to produce a wood decorative board.

[実施例3]
実施例1と同様にして、表層用及び内層用の木質材を調製した。調製した表層用及び内層用の木質材を表層/内層/表層(重量比1.5:7:1.5)とし、フォーミングしてマットとした後、熱圧プレス装置で熱圧成形(熱板温度:200℃、圧力:4N/mm、加圧時間:108sec)して設定密度0.80g/cm、長さ320mm×幅320mm×厚さ9mmのパーティクルボードを作製した。これに、実施例1と同様に、両表面にポリオレフィンシートを貼着させて木質化粧板を作製した。
[Example 3]
In the same manner as in Example 1, wood materials for the surface layer and the inner layer were prepared. The prepared wood material for the surface layer and the inner layer was formed into a surface layer / inner layer / surface layer (weight ratio 1.5: 7: 1.5), formed into a mat, and then subjected to hot press molding (hot plate) with a hot press machine A particle board having a set density of 0.80 g / cm 3 , a length of 320 mm × a width of 320 mm × a thickness of 9 mm was prepared by performing temperature: 200 ° C., pressure: 4 N / mm 2 , and pressurization time: 108 sec. In the same manner as in Example 1, a polyolefin sheet was adhered to both surfaces to produce a wood decorative board.

[比較例1]
実施例1と同様にして、表層用及び内層用の木質材を調製した。調製した表層用及び内層用の木質材を表層/内層/表層(重量比1:3:1)とし、フォーミングしてマットとした後、熱圧プレス装置で熱圧成形(熱板温度:200℃、圧力:4N/mm、加圧時間:108sec)して設定密度0.70g/cm、長さ320mm×幅320mm×厚さ9mmのパーティクルボードを作製した。これに、実施例1と同様に、両表面にポリオレフィンシートを貼着させて木質化粧板を作製した。
[Comparative Example 1]
In the same manner as in Example 1, wood materials for the surface layer and the inner layer were prepared. After preparing the surface layer / inner layer / surface layer (weight ratio 1: 3: 1) and forming the mat for the surface layer and the inner layer, the formed wood material is subjected to hot press molding (hot plate temperature: 200 ° C.). , Pressure: 4 N / mm 2 , pressurization time: 108 sec), and a particle board having a set density of 0.70 g / cm 3 , length 320 mm × width 320 mm × thickness 9 mm was produced. In the same manner as in Example 1, a polyolefin sheet was adhered to both surfaces to produce a wood decorative board.

(断面密度測定)
試験片とするために、作製した木質化粧板を長さ50mm×幅50mmにカットした。これをiMAL社製X線密度測定器(DPX300−LTE)にセットして、パーティクルボードの厚さ方向の断面密度を測定した。そして、得られたデータより、密度が1.0g/cm以上となる高密度部の厚さを測定した。
(Cross section density measurement)
In order to make a test piece, the produced wooden decorative board was cut into a length of 50 mm and a width of 50 mm. This was set in an X-ray density meter (DPX300-LTE) manufactured by iMAL, and the cross-sectional density in the thickness direction of the particle board was measured. And from the obtained data, the thickness of the high-density part with a density of 1.0 g / cm 3 or more was measured.

(耐ワックス性試験)
試験片とするために、作製した木質化粧板を長さ150mm×幅50mmにカットした。ワックスとしては、(株)リンレイ製ハイテクフローリングコートを準備した。これらの試験片及びワックスを23℃50%RH環境条件下に1日以上置いておいた。このワックスをビーカーに入れ、これに試験片を50mmの深さまで漬けて1分間放置した。この試験片を取り出し、付着しているワックスをふき取って、60℃の熱風乾燥機で10分間乾燥させた。その後、この試験片を取り出して、23℃50%RHの環境下で30分放置した。そして、この試験片の外観を観察し、表面の凹凸が目立つものを×、表面の凹凸が目立ちにくいものを△、表面の凹凸が目立たないものを○、として外観評価した。密度測定、耐ワックス性試験の結果を表1にまとめる。
(Wax resistance test)
In order to make a test piece, the produced wooden decorative board was cut into a length of 150 mm and a width of 50 mm. As a wax, a high-tech flooring coat manufactured by Linley Co., Ltd. was prepared. These test pieces and wax were left under 23 ° C. and 50% RH environmental conditions for one day or longer. This wax was put into a beaker, and a test piece was immersed in the beaker to a depth of 50 mm and left for 1 minute. The test piece was taken out, the adhered wax was wiped off, and dried for 10 minutes with a 60 ° C. hot air dryer. Thereafter, this test piece was taken out and left in an environment of 23 ° C. and 50% RH for 30 minutes. Then, the appearance of this test piece was observed, and the appearance was evaluated as x where the surface irregularities were conspicuous, Δ where the surface irregularities were not conspicuous, and ○ where the surface irregularities were not conspicuous. The results of density measurement and wax resistance test are summarized in Table 1.

Figure 2014069368
Figure 2014069368

表1に示すように、パーティクルボード全体の密度は1.0g/cm以下となった。そして、比較例1である高密度部の厚さが0.0mmのときでは表面に凹凸が発生し、凹凸が目立った。これに対して、実施例3である高密度部の厚さが0.2mmのときでは、凹凸がわずかに発生したものの目立ちにくかった。そして、実施例1である高密度部の厚さが0.6mm、実施例2である0.8mmのときでは凹凸が発生しなかった。この結果、密度が1.0g/cm以上の高密度部を含むことにより、表面の凹凸の発生を抑制することができ、その厚さを0.5mm以上にすることにより、十分に抑制することができた。 As shown in Table 1, the density of the entire particle board was 1.0 g / cm 3 or less. And when the thickness of the high-density part which is the comparative example 1 was 0.0 mm, the unevenness | corrugation generate | occur | produced on the surface and the unevenness | corrugation was conspicuous. On the other hand, when the thickness of the high density portion of Example 3 was 0.2 mm, it was difficult to notice the slight unevenness. And when the thickness of the high-density part which is Example 1 was 0.6 mm and 0.8 mm which was Example 2, unevenness did not occur. As a result, by including a high-density portion having a density of 1.0 g / cm 3 or more, it is possible to suppress the occurrence of surface irregularities, and by suppressing the thickness to 0.5 mm or more, it is sufficiently suppressed. I was able to.

以上、本発明の一実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて、種々の変更が可能である。例えば、上記実施形態においては、木質ボードとしてパーティクルボード13を用いたが、中密度繊維板等を用いることができる。   As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible unless it deviates from the meaning. For example, in the above embodiment, the particle board 13 is used as the wood board, but a medium density fiber board or the like can be used.

また、上記実施形態においては、化粧シート11、15がパーティクルボード13の両表面に貼着されているが、木質化粧板1の用途に応じて、片面のみに貼着されていてもよい。   Moreover, in the said embodiment, although the decorative sheets 11 and 15 are affixed on both surfaces of the particle board 13, according to the use of the wooden decorative board 1, you may affix on only one side.

また、上記実施形態においては、表層131、133の一部が高密度部131a、133aとなるように構成しているが、表層131、133と高密度部131a、133aが一致してもよく、また内層132の一部と表層131、133とが高密度部131a、133aとなるように構成してもよい。さらに、上記実施形態においては、パーティクルボード13を表層131、133と内層132の3層に構成したが、単層や2層、4層以上の複数層に構成することもできる。   Moreover, in the said embodiment, although it comprises so that some surface layers 131 and 133 may become the high-density parts 131a and 133a, the surface layers 131 and 133 and the high-density parts 131a and 133a may correspond, Moreover, you may comprise so that a part of inner layer 132 and surface layer 131,133 may become the high-density part 131a, 133a. Furthermore, in the above-described embodiment, the particle board 13 is configured by three layers of the surface layers 131 and 133 and the inner layer 132. However, the particle board 13 may be configured by a single layer, two layers, four layers or more.

1 木質化粧板
11、15 化粧シート
12、14 接着剤
13 パーティクルボード(木質ボード)
131、133 表層
131a、133a 高密度部
132 内層
1 Wood decorative board 11, 15 Decorative sheet 12, 14 Adhesive 13 Particle board (wood board)
131, 133 Surface layers 131a, 133a High density portion 132 Inner layer

Claims (7)

木質材及び熱硬化性樹脂で形成され、少なくとも一方の表面に化粧シートが貼着される木質ボードであって、
前記表面から厚さ方向の内側に向かって、密度が1.0g/cm以上である高密度部を含む、木質ボード。
A wood board formed of a wood material and a thermosetting resin, and having a decorative sheet attached to at least one surface thereof,
A wooden board including a high density portion having a density of 1.0 g / cm 3 or more from the surface toward the inside in the thickness direction.
厚さは9mm以下である、請求項1に記載の木質ボード。   The wooden board according to claim 1, wherein the thickness is 9 mm or less. 前記高密度部の厚さは0.5mm以上1.2mm以下である、請求項1又は2に記載の木質ボード。   The wood board according to claim 1 or 2, wherein a thickness of the high density portion is 0.5 mm or more and 1.2 mm or less. 密度は1.0g/cm以下である、請求項1から3のいずれかに記載の木質ボード。 The wood board according to any one of claims 1 to 3, wherein the density is 1.0 g / cm 3 or less. 前記高密度部の木質材は、目開き1.00mmの篩を通過する木質チップを95wt%以上有し、かつ目開き0.50mmの篩を通過する木質チップを50wt%以上有する、請求項1から4のいずれかに記載の木質ボード。   The wood material of the high-density portion has 95 wt% or more of wood chips that pass through a sieve having an opening of 1.00 mm and 50 wt% or more of wood chips that pass through a sieve having an opening of 0.50 mm. To 4 in the wood board. 前記高密度部の熱硬化性樹脂は、前記木質材100重量部に対して10重量部以上25重量部以下添加される、請求項1から5のいずれかに記載の木質ボード。   6. The wood board according to claim 1, wherein the thermosetting resin of the high density part is added in an amount of 10 parts by weight to 25 parts by weight with respect to 100 parts by weight of the wood material. 化粧シートと、請求項1から6のいずれかに記載の木質ボートと、を備える、木質化粧板。   A wooden decorative board comprising a decorative sheet and the wooden boat according to claim 1.
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