JP2501678Y2 - 回路基板装置 - Google Patents
回路基板装置Info
- Publication number
- JP2501678Y2 JP2501678Y2 JP1989089409U JP8940989U JP2501678Y2 JP 2501678 Y2 JP2501678 Y2 JP 2501678Y2 JP 1989089409 U JP1989089409 U JP 1989089409U JP 8940989 U JP8940989 U JP 8940989U JP 2501678 Y2 JP2501678 Y2 JP 2501678Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- chip
- circuit component
- lead wire
- land portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 9
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000005476 soldering Methods 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007872 degassing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089409U JP2501678Y2 (ja) | 1989-07-29 | 1989-07-29 | 回路基板装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989089409U JP2501678Y2 (ja) | 1989-07-29 | 1989-07-29 | 回路基板装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0328775U JPH0328775U (enrdf_load_stackoverflow) | 1991-03-22 |
| JP2501678Y2 true JP2501678Y2 (ja) | 1996-06-19 |
Family
ID=31638988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989089409U Expired - Lifetime JP2501678Y2 (ja) | 1989-07-29 | 1989-07-29 | 回路基板装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501678Y2 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH075362U (ja) * | 1993-06-26 | 1995-01-27 | ダイワ精工株式会社 | バックラッシュ防止用制動装置付き両軸受型リール |
| JP5363789B2 (ja) * | 2008-11-18 | 2013-12-11 | スタンレー電気株式会社 | 光半導体装置 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6049667U (ja) * | 1983-09-14 | 1985-04-08 | 松下電器産業株式会社 | フレキシブルプリント配線装置 |
| JPS6247170U (enrdf_load_stackoverflow) * | 1985-09-11 | 1987-03-23 | ||
| JPS63162568U (enrdf_load_stackoverflow) * | 1987-04-10 | 1988-10-24 |
-
1989
- 1989-07-29 JP JP1989089409U patent/JP2501678Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328775U (enrdf_load_stackoverflow) | 1991-03-22 |
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