JP2026506958A5 - - Google Patents
Info
- Publication number
- JP2026506958A5 JP2026506958A5 JP2025547805A JP2025547805A JP2026506958A5 JP 2026506958 A5 JP2026506958 A5 JP 2026506958A5 JP 2025547805 A JP2025547805 A JP 2025547805A JP 2025547805 A JP2025547805 A JP 2025547805A JP 2026506958 A5 JP2026506958 A5 JP 2026506958A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate processing
- processing step
- updated
- expected
- value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/113,342 | 2023-02-23 | ||
| US18/113,342 US12566412B2 (en) | 2023-02-23 | 2023-02-23 | Deposition thickness drift compensation in substrate processing systems |
| PCT/US2023/035332 WO2024177663A1 (en) | 2023-02-23 | 2023-10-17 | Residual thickness compensation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2026506958A JP2026506958A (ja) | 2026-02-27 |
| JP2026506958A5 true JP2026506958A5 (https=) | 2026-03-12 |
Family
ID=92460533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025547805A Pending JP2026506958A (ja) | 2023-02-23 | 2023-10-17 | 残留厚さ補償 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12566412B2 (https=) |
| JP (1) | JP2026506958A (https=) |
| KR (1) | KR20250150083A (https=) |
| CN (1) | CN120752660A (https=) |
| TW (1) | TW202449532A (https=) |
| WO (1) | WO2024177663A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12259719B2 (en) * | 2022-05-25 | 2025-03-25 | Applied Materials, Inc. | Methods and mechanisms for preventing fluctuation in machine-learning model performance |
| US12327714B2 (en) * | 2023-05-02 | 2025-06-10 | Applied Materials, Inc. | Plasma generation quality monitoring using multi-channel sensor data |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184733A (ja) | 2000-12-18 | 2002-06-28 | Hitachi Ltd | 処理方法、測定方法及び半導体装置の製造方法 |
| US9400172B2 (en) | 2011-10-26 | 2016-07-26 | Mitsubishi Electric Corporation | Film thickness measurement method |
| US12446771B2 (en) | 2019-06-28 | 2025-10-21 | Topcon Corporation | 2D multi-layer thickness measurement |
| US20230086738A1 (en) | 2020-01-28 | 2023-03-23 | Tokyo Electron Limited | Bonding apparatus and bonding method |
| JP2021194748A (ja) * | 2020-06-17 | 2021-12-27 | 株式会社荏原製作所 | 研磨装置及びプログラム |
| JP7667047B2 (ja) * | 2021-09-22 | 2025-04-22 | キオクシア株式会社 | ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法 |
| US12265379B2 (en) * | 2022-05-05 | 2025-04-01 | Applied Materials, Inc. | Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing |
-
2023
- 2023-02-23 US US18/113,342 patent/US12566412B2/en active Active
- 2023-10-17 KR KR1020257030692A patent/KR20250150083A/ko active Pending
- 2023-10-17 WO PCT/US2023/035332 patent/WO2024177663A1/en not_active Ceased
- 2023-10-17 CN CN202380094766.8A patent/CN120752660A/zh active Pending
- 2023-10-17 JP JP2025547805A patent/JP2026506958A/ja active Pending
- 2023-10-23 TW TW112140393A patent/TW202449532A/zh unknown
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