CN120752660A - 残余厚度补偿 - Google Patents

残余厚度补偿

Info

Publication number
CN120752660A
CN120752660A CN202380094766.8A CN202380094766A CN120752660A CN 120752660 A CN120752660 A CN 120752660A CN 202380094766 A CN202380094766 A CN 202380094766A CN 120752660 A CN120752660 A CN 120752660A
Authority
CN
China
Prior art keywords
data
thickness value
substrate processing
recipe
value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380094766.8A
Other languages
English (en)
Chinese (zh)
Inventor
阿尔伯特·刘
米特什·哈沙德·桑维
文卡塔纳拉亚纳·尚卡拉穆尔提
姚雨莲
韩新海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN120752660A publication Critical patent/CN120752660A/zh
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
CN202380094766.8A 2023-02-23 2023-10-17 残余厚度补偿 Pending CN120752660A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18/113,342 2023-02-23
US18/113,342 US12566412B2 (en) 2023-02-23 2023-02-23 Deposition thickness drift compensation in substrate processing systems
PCT/US2023/035332 WO2024177663A1 (en) 2023-02-23 2023-10-17 Residual thickness compensation

Publications (1)

Publication Number Publication Date
CN120752660A true CN120752660A (zh) 2025-10-03

Family

ID=92460533

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380094766.8A Pending CN120752660A (zh) 2023-02-23 2023-10-17 残余厚度补偿

Country Status (6)

Country Link
US (1) US12566412B2 (https=)
JP (1) JP2026506958A (https=)
KR (1) KR20250150083A (https=)
CN (1) CN120752660A (https=)
TW (1) TW202449532A (https=)
WO (1) WO2024177663A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
US12327714B2 (en) * 2023-05-02 2025-06-10 Applied Materials, Inc. Plasma generation quality monitoring using multi-channel sensor data

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184733A (ja) 2000-12-18 2002-06-28 Hitachi Ltd 処理方法、測定方法及び半導体装置の製造方法
US9400172B2 (en) 2011-10-26 2016-07-26 Mitsubishi Electric Corporation Film thickness measurement method
US12446771B2 (en) 2019-06-28 2025-10-21 Topcon Corporation 2D multi-layer thickness measurement
US20230086738A1 (en) 2020-01-28 2023-03-23 Tokyo Electron Limited Bonding apparatus and bonding method
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7667047B2 (ja) * 2021-09-22 2025-04-22 キオクシア株式会社 ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法
US12265379B2 (en) * 2022-05-05 2025-04-01 Applied Materials, Inc. Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing

Also Published As

Publication number Publication date
WO2024177663A1 (en) 2024-08-29
US20240288838A1 (en) 2024-08-29
US12566412B2 (en) 2026-03-03
TW202449532A (zh) 2024-12-16
KR20250150083A (ko) 2025-10-17
JP2026506958A (ja) 2026-02-27

Similar Documents

Publication Publication Date Title
JP7695374B2 (ja) プロセスチャンバ健康状態モニタリングおよび仮想モデルを使用した診断のためのシステムおよび方法
KR102930177B1 (ko) 가상 계측을 사용하여 개별 층들의 막 두께를 예측하기 위한 시스템들 및 방법들
KR102874867B1 (ko) 기판 제조 동안 필름 퇴적 파라미터들을 조절하기 위한 방법들 및 메커니즘들
CN120752660A (zh) 残余厚度补偿
CN118435338A (zh) 用于在基板制造期间调整处理腔室参数的方法及机制
JP2025540116A (ja) 基板欠陥解析
CN117378036A (zh) 利用成像计量的空间模式负载测量
KR20230140535A (ko) 기판 제조 동안 패턴화된 기판 속성들을 측정하기 위한 방법들 및 메커니즘들
CN116954784A (zh) 生成用于模型性能调谐的虚拟旋钮的方法和机制
US20240229234A1 (en) Cleaning operations based on deposition thickness
CN118569184A (zh) 修改用于新半导体处理设备的机器学习模型的方法和机制
US12462369B2 (en) Method for image-based sensor trace analysis
US20250316491A1 (en) Integrated substrate thinning
WO2025104456A1 (en) Iterative metrology of product features
WO2025111095A1 (en) Methods and mechanisms to perform automated classifications of anomalous trace shapes

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination