TW202449532A - 殘餘厚度補償 - Google Patents

殘餘厚度補償 Download PDF

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Publication number
TW202449532A
TW202449532A TW112140393A TW112140393A TW202449532A TW 202449532 A TW202449532 A TW 202449532A TW 112140393 A TW112140393 A TW 112140393A TW 112140393 A TW112140393 A TW 112140393A TW 202449532 A TW202449532 A TW 202449532A
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TW
Taiwan
Prior art keywords
data
expected
thickness value
substrate processing
recipe
Prior art date
Application number
TW112140393A
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English (en)
Chinese (zh)
Inventor
艾伯特 劉
米特什哈沙德 桑維
凡卡塔納拉亞納 山卡拉穆席
姚雨蓮
新海 韓
Original Assignee
美商應用材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 美商應用材料股份有限公司 filed Critical 美商應用材料股份有限公司
Publication of TW202449532A publication Critical patent/TW202449532A/zh

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32926—Software, data control or modelling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Artificial Intelligence (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Health & Medical Sciences (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Software Systems (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
TW112140393A 2023-02-23 2023-10-23 殘餘厚度補償 TW202449532A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US18/113,342 2023-02-23
US18/113,342 US12566412B2 (en) 2023-02-23 2023-02-23 Deposition thickness drift compensation in substrate processing systems

Publications (1)

Publication Number Publication Date
TW202449532A true TW202449532A (zh) 2024-12-16

Family

ID=92460533

Family Applications (1)

Application Number Title Priority Date Filing Date
TW112140393A TW202449532A (zh) 2023-02-23 2023-10-23 殘餘厚度補償

Country Status (6)

Country Link
US (1) US12566412B2 (https=)
JP (1) JP2026506958A (https=)
KR (1) KR20250150083A (https=)
CN (1) CN120752660A (https=)
TW (1) TW202449532A (https=)
WO (1) WO2024177663A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12259719B2 (en) * 2022-05-25 2025-03-25 Applied Materials, Inc. Methods and mechanisms for preventing fluctuation in machine-learning model performance
US12327714B2 (en) * 2023-05-02 2025-06-10 Applied Materials, Inc. Plasma generation quality monitoring using multi-channel sensor data

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184733A (ja) 2000-12-18 2002-06-28 Hitachi Ltd 処理方法、測定方法及び半導体装置の製造方法
US9400172B2 (en) 2011-10-26 2016-07-26 Mitsubishi Electric Corporation Film thickness measurement method
US12446771B2 (en) 2019-06-28 2025-10-21 Topcon Corporation 2D multi-layer thickness measurement
US20230086738A1 (en) 2020-01-28 2023-03-23 Tokyo Electron Limited Bonding apparatus and bonding method
JP2021194748A (ja) * 2020-06-17 2021-12-27 株式会社荏原製作所 研磨装置及びプログラム
JP7667047B2 (ja) * 2021-09-22 2025-04-22 キオクシア株式会社 ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法
US12265379B2 (en) * 2022-05-05 2025-04-01 Applied Materials, Inc. Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing

Also Published As

Publication number Publication date
WO2024177663A1 (en) 2024-08-29
CN120752660A (zh) 2025-10-03
US20240288838A1 (en) 2024-08-29
US12566412B2 (en) 2026-03-03
KR20250150083A (ko) 2025-10-17
JP2026506958A (ja) 2026-02-27

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