KR20250150083A - 잔여 두께 보상 - Google Patents
잔여 두께 보상Info
- Publication number
- KR20250150083A KR20250150083A KR1020257030692A KR20257030692A KR20250150083A KR 20250150083 A KR20250150083 A KR 20250150083A KR 1020257030692 A KR1020257030692 A KR 1020257030692A KR 20257030692 A KR20257030692 A KR 20257030692A KR 20250150083 A KR20250150083 A KR 20250150083A
- Authority
- KR
- South Korea
- Prior art keywords
- data
- substrate processing
- expected
- recipe
- thickness value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/0265—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric the criterion being a learning criterion
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
- G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
- G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
- G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Program-control systems
- G05B19/02—Program-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32926—Software, data control or modelling
-
- H01L22/20—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Artificial Intelligence (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Health & Medical Sciences (AREA)
- Evolutionary Computation (AREA)
- Medical Informatics (AREA)
- Software Systems (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US18/113,342 | 2023-02-23 | ||
| US18/113,342 US12566412B2 (en) | 2023-02-23 | 2023-02-23 | Deposition thickness drift compensation in substrate processing systems |
| PCT/US2023/035332 WO2024177663A1 (en) | 2023-02-23 | 2023-10-17 | Residual thickness compensation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250150083A true KR20250150083A (ko) | 2025-10-17 |
Family
ID=92460533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257030692A Pending KR20250150083A (ko) | 2023-02-23 | 2023-10-17 | 잔여 두께 보상 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12566412B2 (https=) |
| JP (1) | JP2026506958A (https=) |
| KR (1) | KR20250150083A (https=) |
| CN (1) | CN120752660A (https=) |
| TW (1) | TW202449532A (https=) |
| WO (1) | WO2024177663A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12259719B2 (en) * | 2022-05-25 | 2025-03-25 | Applied Materials, Inc. | Methods and mechanisms for preventing fluctuation in machine-learning model performance |
| US12327714B2 (en) * | 2023-05-02 | 2025-06-10 | Applied Materials, Inc. | Plasma generation quality monitoring using multi-channel sensor data |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002184733A (ja) | 2000-12-18 | 2002-06-28 | Hitachi Ltd | 処理方法、測定方法及び半導体装置の製造方法 |
| US9400172B2 (en) | 2011-10-26 | 2016-07-26 | Mitsubishi Electric Corporation | Film thickness measurement method |
| US12446771B2 (en) | 2019-06-28 | 2025-10-21 | Topcon Corporation | 2D multi-layer thickness measurement |
| US20230086738A1 (en) | 2020-01-28 | 2023-03-23 | Tokyo Electron Limited | Bonding apparatus and bonding method |
| JP2021194748A (ja) * | 2020-06-17 | 2021-12-27 | 株式会社荏原製作所 | 研磨装置及びプログラム |
| JP7667047B2 (ja) * | 2021-09-22 | 2025-04-22 | キオクシア株式会社 | ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法 |
| US12265379B2 (en) * | 2022-05-05 | 2025-04-01 | Applied Materials, Inc. | Methods and mechanisms for adjusting film deposition parameters during substrate manufacturing |
-
2023
- 2023-02-23 US US18/113,342 patent/US12566412B2/en active Active
- 2023-10-17 KR KR1020257030692A patent/KR20250150083A/ko active Pending
- 2023-10-17 WO PCT/US2023/035332 patent/WO2024177663A1/en not_active Ceased
- 2023-10-17 CN CN202380094766.8A patent/CN120752660A/zh active Pending
- 2023-10-17 JP JP2025547805A patent/JP2026506958A/ja active Pending
- 2023-10-23 TW TW112140393A patent/TW202449532A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024177663A1 (en) | 2024-08-29 |
| CN120752660A (zh) | 2025-10-03 |
| US20240288838A1 (en) | 2024-08-29 |
| US12566412B2 (en) | 2026-03-03 |
| TW202449532A (zh) | 2024-12-16 |
| JP2026506958A (ja) | 2026-02-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| D11 | Substantive examination requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D11-EXM-PA0201 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| Q12 | Application published |
Free format text: ST27 STATUS EVENT CODE: A-1-1-Q10-Q12-NAP-PG1501 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| D16 | Fast track examination requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D16-EXM-PA0302 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D17 | Fast track examination accepted |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D17-EXM-PA0302 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| PA0302 | Request for accelerated examination |
St.27 status event code: A-1-2-D10-D17-exm-PA0302 St.27 status event code: A-1-2-D10-D16-exm-PA0302 |